CN202405239U - High-frequency rotation mechanism and lead bonding machine - Google Patents

High-frequency rotation mechanism and lead bonding machine Download PDF

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Publication number
CN202405239U
CN202405239U CN 201120548952 CN201120548952U CN202405239U CN 202405239 U CN202405239 U CN 202405239U CN 201120548952 CN201120548952 CN 201120548952 CN 201120548952 U CN201120548952 U CN 201120548952U CN 202405239 U CN202405239 U CN 202405239U
Authority
CN
China
Prior art keywords
support cup
ceramic
ceramic support
rotating mechanism
anchor clamps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201120548952
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Chinese (zh)
Inventor
胡晶
高云峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN HAN'S PHOTOELECTRIC EQUIPMENT CO Ltd
Shenzhen Hans Laser Technology Co Ltd
Han s Laser Technology Co Ltd
Original Assignee
SHENZHEN HAN'S PHOTOELECTRIC EQUIPMENT CO Ltd
Shenzhen Hans Laser Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN HAN'S PHOTOELECTRIC EQUIPMENT CO Ltd, Shenzhen Hans Laser Technology Co Ltd filed Critical SHENZHEN HAN'S PHOTOELECTRIC EQUIPMENT CO Ltd
Priority to CN 201120548952 priority Critical patent/CN202405239U/en
Application granted granted Critical
Publication of CN202405239U publication Critical patent/CN202405239U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Wire Bonding (AREA)

Abstract

The utility model relates to a rotation mechanism, and provides a high-frequency rotation mechanism. The high-frequency rotation mechanism comprises a fixture body, and two coaxial rotation sections arranged on the fixture body, wherein the fixture body includes a first fixture and a second fixture opposite to each other; each rotation section includes a first ceramic support cup fixed on the first fixture, a second ceramic support cup arranged on the second fixture, and a ceramic bead arranged between the first ceramic support cup and the second ceramic support cup, wherein the second ceramic support cup can be driven by a drive component to rotate; and the ceramic bead can rotate together with the second ceramic support cup. According to the utility model, the rotation mechanism is simple in structure by using two coaxial rotation sections, and can not only reduce rotation resistance and realize high-speed rotation but also realize high repetitive motion accuracy by adopting the ceramic material with surface smoothness and excellent surface hardness. Meanwhile, the ceramic material has insulation property and high thermal stability to ensure wide temperature range, so that the rotation mechanism can keep high reliability and motion consistency. The utility model also provides a lead bonding machine.

Description

High frequency rotating mechanism and wire bonder
Technical field
The utility model relates to a kind of rotating mechanism, more particularly, relates to high frequency rotating mechanism and wire bonder in the wire bonder.
Background technology
The lead-in wire bonding is as the important technology of semiconductor die package, and its packing forms accounts for more than 90% of IC encapsulation.In lead key closing process, conductive lead wire need and be sent to bonding station by the anchor clamps clamping, is stripped from position then, is bonded at last on the electrode and chip on the semiconductor chip.Lead-in wire usually adopts a rotating mechanism to accomplish above-mentioned action after by the anchor clamps clamping.In recent years, along with the very big raising of the wire bonder speed of service, therefore higher requirement had been proposed also the rotating mechanism that can drive the anchor clamps rotation.Because wire clamp is positioned near the transhipment axle, in order to realize the rotation of high acceleration, deceleration, requires the inertia of rotating mechanism as far as possible little; Simultaneously, the rotating mechanism on the wire clamp also need have high static state and dynamic rate, guarantees to have higher resonance frequency with this; After could guaranteeing each action like this, remaining vibration all is a short arc, high-frequency; And but fast and stable gets off, and the para-linkage quality produces injurious effects.And existing rotating mechanism does not also reach above-mentioned requirement, therefore demands urgently improving.
The utility model content
The utility model technical problem to be solved is to overcome the defective of prior art, and the height that a kind of simple in structure, high stability and high reliability be provided is rotating mechanism and adopt the wire bonder of this rotating mechanism frequently.
For solving the problems of the technologies described above, the technical scheme of the utility model is: a kind of high frequency rotating mechanism is provided, comprises clamp body and be located on the said clamp body and two rotating parts of coaxial line; Said clamp body comprises first anchor clamps and second anchor clamps that are oppositely arranged, and each rotating part includes the first ceramic support cup that is fixed on said first anchor clamps, be located on said second anchor clamps and drive down the rotating second ceramic support cup and be located between said first, second ceramic support cup and can be with the ceramic bead of second ceramic support cup rotation at a dynamical element.
Particularly, the said first ceramic support cup and the second ceramic support cup all have arc groove, and cavity inner surface and said ceramic bead outer surface that two arc grooves surround formation are complementary.
Further, be provided with the preload piece that can make the said first ceramic support cup, the said second ceramic support cup compress applying respectively with said ceramic bead between said first anchor clamps and said second anchor clamps.
Preferably, said preload piece is a compression spring.
The utility model also provides a kind of wire bonder, and it comprises above-mentioned high frequency rotating mechanism.
In the utility model, each rotating part forms a rotational restraint point, between these two rotational restraint points, forms a virtual rotation axis, and the rotating part of such two coaxial lines promptly forms one can be around the rotating mechanism of this virtual rotation axis rotation; Rotating mechanism adopts ceramic material, and by the smoothness of ceramic material surfaces, the high smooth degree between the rotor contact-making surface of raising rotating mechanism reduces rotary resistance, realizes high speed rotating on the one hand; On the other hand because ceramic material has excellent surface hardness; Can bear more than one hundred million times motion repeatedly, therefore have very high repeating motion precision, and have higher resonance frequency; But fast and stable gets off after guaranteeing each action, and the para-linkage quality does not produce injurious effects; Simultaneously, ceramic material has insulating properties and higher thermal stability, can guarantee in the temperature range of broad, and this rotating mechanism still has the reliability and the motion consistency of height.
Description of drawings
Fig. 1 is the vertical view of the high frequency rotating mechanism that provides of the utility model embodiment;
Fig. 2 is the end view of the high frequency rotating mechanism that provides of the utility model embodiment.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
With reference to Fig. 1, be a kind of high frequency rotating mechanism that the utility model provides, it comprises a clamp body 100 and is located on the clamp body 100 and two rotating parts 200 of coaxial line.Clamp body 100 comprises first anchor clamps 110 and second anchor clamps 120 that are oppositely arranged, each rotating part 200 includes the first ceramic support cup 210 that is fixed on first anchor clamps 110, be located on second anchor clamps 120 and a dynamical element (not shown) drive down the rotating second ceramic support cup 220 and be located in the first ceramic support cup 210 and the second ceramic support cup 220 between and can be with the ceramic bead 230 of the second ceramic support cup, 220 rotations.In the utility model; Each rotating part 200 forms a rotational restraint point; Between these two rotational restraint points, can regard as and exist a virtual rotation axis 300, the rotating part 200 of such two coaxial lines promptly to form the rotating mechanism that can rotate around this virtual rotation axis 300; Rotating mechanism adopts ceramic material, and by the smoothness of ceramic material surfaces, the high smooth degree between the rotor contact-making surface of raising rotating mechanism reduces rotary resistance, realizes high speed rotating on the one hand; On the other hand because ceramic material has excellent surface hardness; Can bear more than one hundred million times motion repeatedly, therefore have very high repeating motion precision, and have higher resonance frequency; But fast and stable gets off after guaranteeing each action, and the para-linkage quality does not produce injurious effects; Simultaneously, ceramic material has insulating properties and higher thermal stability, can guarantee in the temperature range of broad, and this rotating mechanism still has the reliability and the motion consistency of height.
In the present embodiment, the first ceramic support cup 210 and the second ceramic support cup 220 all have arc groove (among the figure not label).After first anchor clamps 110 and second anchor clamps 120 were oppositely arranged, two arc grooves surrounded each other and form a cavity (not shown), and the inner surface of said cavity and ceramic bead 230 outer surfaces are complementary.Like this, guarantee cooperatively interacting of ceramic bead 230 and the first ceramic support cup 210 and the second ceramic support cup 220, and can be under second anchor clamps 120 drive effective and high speed rotating.
Further, in the present embodiment, be provided with a preload piece 400 between first anchor clamps 110 and second anchor clamps 120.Preferably, preload piece 400 is a compression spring.When mounted; Preload piece 400 is set; Make the first ceramic support cup 210, the second ceramic support cup 220 keep down fitting tightly in certain pretightning force effect respectively, have certain frictional force between the assurance ceramic bead 230 and the second ceramic support cup 220, thereby ceramic bead 230 is rotated under the drive of the second ceramic support cup 220 with ceramic bead 230; Simultaneously; Pretightning force exists, and also offsets action of centrifugal force under high speed rotating, avoids ceramic bead 230 and the first ceramic support cup 210,220 disengagings of the second ceramic support cup.
In the present embodiment; The operation principle of rotating mechanism is: the second ceramic support cup 220 on two rotating parts 200 rotates under the effect of dynamical element synchronously; Two ceramic beads 230 rotate under the drive of each self-corresponding second ceramic support cup 220 synchronously, and form a rotating mechanism between two rotating parts 200 this moment.When rotating part 200 rotated, clamp body was closed, and when rotating part 200 stopped operating, clamp body was opened.
The utility model also provides a kind of wire bonder, and it includes above-mentioned high frequency rotating mechanism.Through above-mentioned high frequency rotating mechanism is set, high-frequency, the short arc of rotating mechanism when guaranteeing the lead-in wire bonding, high reliability is for the bonding quality provides reliable guarantee.
More than be merely the preferred embodiment of the utility model,, any modification of being done within all spirit at the utility model and the principle, be equal to and replace and improvement etc., all should be included within the protection range of the utility model not in order to restriction the utility model.

Claims (5)

1. high frequency rotating mechanism is characterized in that: comprise clamp body and be located on the said clamp body and two rotating parts of coaxial line; Said clamp body comprises first anchor clamps and second anchor clamps that are oppositely arranged, and each rotating part includes the first ceramic support cup that is fixed on said first anchor clamps, be located on said second anchor clamps and drive down the rotating second ceramic support cup and be located between said first, second ceramic support cup and can be with the ceramic bead of second ceramic support cup rotation at a dynamical element.
2. high frequency rotating mechanism as claimed in claim 1 is characterized in that: the said first ceramic support cup and the second ceramic support cup all have arc groove, and cavity inner surface and said ceramic bead outer surface that two arc grooves surround formation are complementary.
3. according to claim 1 or claim 2 high frequency rotating mechanism is characterized in that: be provided with the preload piece that can make the said first ceramic support cup, the said second ceramic support cup compress applying respectively with said ceramic bead between said first anchor clamps and said second anchor clamps.
4. high frequency rotating mechanism as claimed in claim 3 is characterized in that: said preload piece is a compression spring.
5. a wire bonder is characterized in that: comprise like each described high frequency rotating mechanism in the claim 1 to 4.
CN 201120548952 2011-12-23 2011-12-23 High-frequency rotation mechanism and lead bonding machine Expired - Lifetime CN202405239U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201120548952 CN202405239U (en) 2011-12-23 2011-12-23 High-frequency rotation mechanism and lead bonding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201120548952 CN202405239U (en) 2011-12-23 2011-12-23 High-frequency rotation mechanism and lead bonding machine

Publications (1)

Publication Number Publication Date
CN202405239U true CN202405239U (en) 2012-08-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201120548952 Expired - Lifetime CN202405239U (en) 2011-12-23 2011-12-23 High-frequency rotation mechanism and lead bonding machine

Country Status (1)

Country Link
CN (1) CN202405239U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103177978B (en) * 2011-12-23 2015-11-18 大族激光科技产业集团股份有限公司 High frequency rotational mechanism and wire bonder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103177978B (en) * 2011-12-23 2015-11-18 大族激光科技产业集团股份有限公司 High frequency rotational mechanism and wire bonder

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Shenzhen Han's Photoelectric Equipment Co., Ltd.

Assignor: Shenzhen Han City laser Polytron Technologies Inc|Shenzhen Han Photoelectric Equipment Co., Ltd.

Contract record no.: 2012440020095

Denomination of utility model: High-frequency rotating mechanism and lead wire bonding machine

Granted publication date: 20120829

License type: Exclusive License

Record date: 20120507

LICC Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model
CX01 Expiry of patent term

Granted publication date: 20120829

CX01 Expiry of patent term