CN1276489C - Magnetic material bottom filling method in chip packaging - Google Patents
Magnetic material bottom filling method in chip packaging Download PDFInfo
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- CN1276489C CN1276489C CN 200410052865 CN200410052865A CN1276489C CN 1276489 C CN1276489 C CN 1276489C CN 200410052865 CN200410052865 CN 200410052865 CN 200410052865 A CN200410052865 A CN 200410052865A CN 1276489 C CN1276489 C CN 1276489C
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Abstract
The present invention relates to a bottom filling method for magnetic material in chip packaging. In the adopted filling material, magnetic micro powder material replaces SiO2. An electromagnetic exciting head is arranged on one scanning axis of an electromagnetic scanning mechanism and is arranged above a chip or under a base. External electromagnetic force is exerted in the glue dripping and filling process to excite the electromagnetic exciting head to always lie in the front position of the filling material, do scan along the glue dripping direction and guide the magnetic organic material to be filled. The present invention has the advantages of magnetic filler material easily prepared, simple scanning mechanism easily embedded in the existing packaging production line, greatly reduces filling time because of the external electromagnetic force function, raises packaging efficiency, effectively avoids filling defects and enhances device reliability.
Description
Technical field
The present invention relates to the magnetic material bottom fill method in a kind of Chip Packaging, be specifically related to a kind of method that adopts the controlled bottom filling magnetic composite of external drive, belong to the Electronic Packaging field that integrated circuit is made.
Background technology
In the flip chip technology (fct) of Electronic Packaging, for improving the reliability of device, need fill high-intensity adhesives (Underfill Material) between chip and base material, this material is mixed by polymer (as epoxy resin) and multiple additives (as curing agent, catalyst, filling powder, couplant etc.).Fill process comprises flowing fills (Flow Underfill) and does not have (No-flow Underfill) the two kinds of forms of filling that flow.In Electronic Packaging, the interface debonding that thermal mismatching caused between the different materials is the main cause that causes that packaging lost efficacy.Underfill technology not only can dispersed chip and base material between temperature expansion coefficient (CTE, the Coefficient of Thermal Expansion) stress that do not match and produced, can also prevent the pollution of moist and other form.
With respect to mobile fill process, do not have the fill process of flowing and have the advantage of low-cost high-efficiency, still, also there is wretched insufficiency simultaneously.Because filler particles can influence the formation of solder joint and the wettability between scolder and the metal pad, do not have the glue of flowing and generally do not contain SiO
2The filler particles of class mainly is made up of epoxy resin, curing agent, catalyst and scaling powder.And the adhesive curing process of not having in the glue fill process that flows occurs in the Reflow Soldering stage, and curing temperature is higher than mobile packing material, fills in adhesive curing process and the temperature cycles process end of at, owing to lacked SiO
2The particle powder fills the regulating action of glue thermodynamic property the end of to, does not have the glue of flowing and has higher thermal coefficient of expansion, and chip will bear very big thermal stress, tend to cause chip cracked.In addition, it is bigger not have the stress of chip when low temperature that flows after encapsulating, and can not show a candle to the device lifetime of adopting the fill process that flows device lifetime.Therefore, along with chip is increasing, more and more thinner, the cracked problem of chip more can not be ignored.
In chip package process, flow and fill many relatively time of glue process consumption in the bottom, and mainly because whole filling process relies on capillarity fully and finishes, the big more then filling time of chip size is also just long more.In filling process, packing material generally maintains 60 ℃～80 ℃ temperature, to reduce the viscosity of packing material, correspondingly reduces the filling time.Because packing material has moisture-absorption characteristics, if filling process is long, the moisture that is adsorbed will cause the cavity in solidification process; In addition, the not exclusively phenomenon of filling may take place also in the filling process that flows, this bring negative effect can for the reliability of encapsulated device.Therefore, for ultra-large device package, be flow fill process production efficiency or the reliability of encapsulated device all faces more challenges.
Summary of the invention
The objective of the invention is at the deficiencies in the prior art, propose the magnetic material bottom fill method in a kind of Chip Packaging, can reduce the filling time, and effectively avoid occurring cavity, the defective of complete filling not even, improve packaging efficiency.
For realizing such purpose, in the packing material that the present invention adopts, partly replace SiO with said magnetic powder material
2An electromagnetic excitation head is installed on a scan axis of electromagnetic scanning mechanism, and the electromagnetic excitation head placed the top of chip or the below of substrate, in dripping the glue filling process, apply external electric magnetic force, excitation electromagnetic excitation head is in the position, forward position of packing material all the time and along the scanning direction that drips glue, the guiding magnetic organic material is filled.
Magnetic material of the present invention bottom fill method is specific as follows:
1, the composition of magnetic filled composite materials is to be epoxy resin and SiO in main component
2The routine packing material (SiO wherein that flows
2Weight percent content is about 50-70%) the basis on, partly replace SiO with the magnetic micro-powder material
2, promptly reduce the SiO in the packing material
2Content adds the magnetic micro-powder material, adopts and the conventional identical preparation technology of packing material of flowing, and obtains the magnetic filled composite materials, and wherein the percentage by weight of magnetic micro-powder material is 30～60%.
Alternative magnetic micro-powder comprises inorganic magnetic material and organo-metallic material, and the organo-metallic material (as two metallocene macromolecule magnets) with low Curie temperature is more suitable for the magnetic additive as packing material.
2, the electromagnetic excitation head of coil-core structure is fixed on the scan axis in the electromagnetic scanning mechanism by the excitation headstock, and with the electromagnetic excitation head place chip directly over or substrate under, guarantee that as far as possible driving head is near space to be filled and not contact chip or substrate.The height of electromagnetic excitation head adopts mechanical adjustment, in case highly regulate suitablely, its height and position will no longer change in the filling process.
3, fill with the conventional end that to drip adhesive process the same, adopt special-purpose Beverage bottle cover evenly to drip glue, avoid the magnetic filled composite materials to pile up and waste as far as possible along certain selected limit of chip.For reducing the viscosity of packing material, ambient temperature maintains 60 ℃～80 ℃.The present invention need not adopt polygon glue fill process.
4, when dripping glue, connect the power supply of electromagnetic scanning mechanism, apply external electric magnetic force, under the alternating current effect, the termination in the nearly space to be filled of electromagnetic excitation head rest generates an electromagnetic field, and power frequency is 50Hz～1KHz.In filling process, the electromagnetic excitation head is in the position, forward position of packing material all the time, and its direction of motion is parallel with the glue limit that chip is selected, and realizes the complete filling of magnetic composite by lining by line scan.The about 0.1mm of the positioning accuracy of scanning motion.The scanning pattern of electromagnetic excitation head can adopt the two kinds of forms in Z-shaped path and back-shaped path, and electromagnetic scanning mechanism is used to control the position and the sweep speed of electromagnetic excitation head.
The present invention has substantive distinguishing features and marked improvement, and the preparation of magnetic organic filler material can adopt present preparation facilities and technology to obtain easily fully; Sweep mechanism is simple, is easy to embed existing packing producing line; Compare with the capillary fill method of simple dependence, owing to be subjected to extra magneticaction, the filling time of magnetic organic filler material significantly reduces, thereby can improve packaging efficiency, can also effectively avoid filling defect, and improve device reliability, be more suitable for the large size chip encapsulation.
Description of drawings
Fig. 1 adopts the schematic diagram of magnetic material fill method for the present invention.
Among Fig. 1,1 is the electromagnetic excitation head, and 2 is chip, and 3 are substrate, and H is the vertical range in electromagnetic excitation head 1 and space to be filled, and W is the horizontal range (scanning pitch) in electromagnetic excitation head 1 and colloid forward position.
Fig. 2 is an electromagnetic scanning structural scheme of mechanism of the present invention.
Among Fig. 2,1 is the electromagnetic excitation head, and 4 is the X-axis driving mechanism, and 5 is the Y-axis driving mechanism, and 6 are the excitation headstock.
Fig. 3 is an electromagnetic excitation head scanning pattern schematic diagram.
Among Fig. 3, (a) being the zigzag scan path, (b) is back-shaped scanning pattern, and 2 is chip.
Embodiment
Below in conjunction with accompanying drawing technical scheme of the present invention is further described.
The main implementation method of the present invention is as follows:
1, magnetic material is selected and the preparation of magnetic filled composite materials
Alternative magnetic material comprises inorganic magnetic material, organo-metallic material, underfill of the present invention is the soft-magnetic composite material that contains Magnaglo, require Magnaglo to have low remanent magnetism rate, high resistivity characteristic, and the Curie temperature of Magnaglo is lower than normally used inorganic magnetic material, weakens even demagnetization fully with the magnetic composite magnetic after curing that guarantees to be filled between chip and the substrate.With two metallocenes is that two synthetic metallocene macromolecule magnets of raw material are black powder (micro mist), this powder is a soft magnetic material, have high permeability, high resistivity, low remanent magnetism, and Curie temperature is the first-selected filler of Electronic Packaging bottom filled composite materials far below other inorganic magnetic material.Magnaglo in the composite filling material has double action, promptly produces expansion power and the thermal coefficient of expansion of regulating after packing material solidifies when filling.The conventional main component that flows packing material is epoxy resin and SiO
2, SiO wherein
2Content be about 50～70%, the magnetic composite filling material has reduced SiO
2Content, the ratio about 30～60% that magnetic micro-powder is shared.The preparation technology of magnetic composite filling material is consistent with the conventional packing material that flows.
2, the electromagnetic excitation head 1 of coil-core structure is fixed on the scan axis in the electromagnetic scanning mechanism by the excitation headstock 6, as shown in Figure 2, can be fixed on the Y-axis driving mechanism 5, and with electromagnetic excitation head 1 place as shown in Figure 1 chip 2 directly over, guarantee near space to be filled and not contact chip 2 of driving head 1 as far as possible.Electromagnetic excitation head 1 is H with the vertical range in space to be filled, with the horizontal range (scanning pitch) in colloid (dash area in the accompanying drawing 1) forward position be W.The height of electromagnetic excitation head 1 adopts mechanical adjustment, in case highly regulate suitablely, its height and position H will remain unchanged in the scanning filling process.
3, adopt the conventional end to fill and drip adhesive process, Beverage bottle cover by special use evenly drips glue along certain selected limit of chip 2, as shown in Figure 1, drips and avoids magnetic composite to pile up in the glue process as far as possible, ambient temperature maintains 60 ℃～80 ℃, to reduce the viscosity of packing material.
4, electromagnetic scanning mechanism and filling control
When dripping glue (magnetic material filling process), connect the power supply of electromagnetic scanning mechanism, apply external electric magnetic force.Electromagnetic excitation head 1 has adopted coil-core structure, and under the alternating current effect, electromagnetic excitation head 1 generates an electromagnetic field near the termination in space to be filled, the active force that this electromagnetic field provides the magnetic packing material to expand in the gap of chip 2 and substrate 3.Power frequency is 50Hz～1KHz.X, Y coordinate position and the sweep speed of electromagnetic scanning mechanism controls electromagnetic excitation head 1.When adhesive dripping machine when selected certain begins to drip glue on one side, electromagnetic excitation head 1 begins scanning simultaneously along the direction of dripping glue.In filling process, electromagnetic excitation head 1 always is in the position, forward position of packing material, and its direction of motion is parallel with the glue limit that chip 2 is selected, and realizes the complete filling of magnetic composite by lining by line scan.
The scanning pattern of electromagnetic excitation head can adopt the two kinds of forms in Z-shaped path and back-shaped path, as shown in Figure 3.Wherein, Fig. 3 (a) is the zigzag scan path, and Fig. 3 (b) is back-shaped scanning pattern, and the phantom line segments in path shown in the figure represents to close electromagnetic excitation.Owing to influenced by the packing material viscous effect, the later stage in scanning progressively reduces sweep speed or reduces scanning line spacing, fills to realize high-quality.Scanning motion can be driven by rotating servo motor or linear servo-actuator, according to the filled object difference, fills or first chip level (wafer level) filling as chip-scale (chip level), the scanning motion scope is difference to some extent, but the scanning positioning accuracy is the same, about 0.1mm.
Claims (4)
1, the bottom of the magnetic material in a kind of Chip Packaging fill method is characterized in that comprising the steps:
1) be epoxy resin and SiO in main component
2Routine flow on the basis of packing material, partly replace SiO with the magnetic micro-powder material
2, in the magnetic filled composite materials that obtains, the percentage by weight of magnetic micro-powder material is 30～60%;
2) electromagnetic excitation head (1) is fixed on the scan axis in the electromagnetic scanning mechanism by the excitation headstock (6), and with electromagnetic excitation head (1) place chip (2) directly over or substrate (3) under, make driving head (1) near space to be filled and not contact chip (2) or substrate (3);
3) adopt Beverage bottle cover evenly to drip glue along one of chip selected limit, ambient temperature maintains 60 ℃～80 ℃;
4) when dripping glue, connect the power supply of electromagnetic scanning mechanism, electromagnetic excitation head (1) is generated an electromagnetic field, power frequency is 50Hz～1KHz, in filling process, electromagnetic excitation head (1) be in all the time the position, forward position of packing material and the direction of motion and chip selected to drip the glue limit parallel, realize the complete filling of magnetic composite by lining by line scan.
2, the bottom of the magnetic material in the Chip Packaging as claimed in claim 1 fill method is characterized in that the scanning pattern of described electromagnetic excitation head (1) adopts Z-shaped path or back-shaped path.
3, the bottom of the magnetic material in the Chip Packaging as claimed in claim 1 fill method is characterized in that described magnetic micro-powder material is inorganic magnetic material or organo-metallic material.
4, the bottom of the magnetic material in the Chip Packaging as claimed in claim 3 fill method is characterized in that described organo-metallic material is two metallocene macromolecule magnets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410052865 CN1276489C (en) | 2004-07-15 | 2004-07-15 | Magnetic material bottom filling method in chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410052865 CN1276489C (en) | 2004-07-15 | 2004-07-15 | Magnetic material bottom filling method in chip packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1588633A CN1588633A (en) | 2005-03-02 |
| CN1276489C true CN1276489C (en) | 2006-09-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200410052865 Expired - Fee Related CN1276489C (en) | 2004-07-15 | 2004-07-15 | Magnetic material bottom filling method in chip packaging |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957977B (en) | 2016-05-13 | 2019-02-05 | 京东方科技集团股份有限公司 | A kind of encapsulating material, encapsulation cover plate, agglomerating plant, sintering method and display device |
| CN110429066A (en) * | 2019-07-29 | 2019-11-08 | 上海先方半导体有限公司 | A kind of electronic encapsulation device and bottom embankment method |
| CN110729205B (en) * | 2019-09-16 | 2021-11-23 | 上海先方半导体有限公司 | Filling method of underfill |
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- 2004-07-15 CN CN 200410052865 patent/CN1276489C/en not_active Expired - Fee Related
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Granted publication date: 20060920 Termination date: 20100715 |