CN202404869U - Apparatus for detecting IGZO-TFT driving characteristic - Google Patents

Apparatus for detecting IGZO-TFT driving characteristic Download PDF

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CN202404869U
CN202404869U CN 201120338472 CN201120338472U CN202404869U CN 202404869 U CN202404869 U CN 202404869U CN 201120338472 CN201120338472 CN 201120338472 CN 201120338472 U CN201120338472 U CN 201120338472U CN 202404869 U CN202404869 U CN 202404869U
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tft
igzo
array
area
mask plate
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王彬
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GUANGDONG ZHONGXIAN TECHNOLOGY Co Ltd
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GUANGDONG ZHONGXIAN TECHNOLOGY Co Ltd
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Abstract

The utility model provides an apparatus for detecting IGZO-TFT driving characteristics, comprising an IGZO-TFT driving unit, a mask slice utilized in array preparation and a plurality of microcapsule electrophoresis display elements. The mask slice includes three functional zones of an aligning mark zone, a separate device zone and an array area. According to the detection apparatus, not only is the driving performance of the array TFT transistors detected, but also a single TFT transistor can be detected one by one, and simultaneously, the array quantity is set according to requirements, and the driving display function can be realized when the TFT array is driven in a single-pixel static state. Furtherly, the detection work efficiency and accuracy can be accelerated by employing the aligning mark zone.

Description

A kind of device that is used to detect the IGZO-TFT drive characteristic
Technical field
The utility model relates to IGZO thin film transistor (TFT) (TFT) and drives detection range, and more specifically, the utility model relates to the device that a kind of IGZO of detection thin film transistor (TFT) drives effect.
Background technology
Thin film transistor (TFT) is meant deposition layer of semiconductor film on substrate, goes out source, drain electrode through fabrication techniques such as photoetching, etchings, and grid and body form, and it is made up of gate insulation layer, active layer, gate electrode, source and drain electrode several sections.Fig. 1 is several frequently seen TFT structure, can be divided into two types: one type is top gate structure, claims just folded (Normal Staggered is called for short NS) structure again; One type is bottom grating structure, claims reciprocal cross folded (Inverted Staggered is called for short IS) structure again.Sedimentary sequence according to channel layer and source-drain electrode is different, and top grid, bottom grating structure have end contact and two kinds of forms of top contact again respectively.In the bottom gate top contact structure, can improve semiconductor structure and pattern through the interface of modifying insulation course, thereby improve the mobility of device.This fault of construction is that the photoetching process of source-drain electrode can pollute active layer.And in other a kind of bottom grating structure; The source-drain electrode photoetching process was carried out before the semiconductor layer deposition; Can not cause pollution to semiconductor layer; But electrode and insulation course exist step to be unfavorable for the injection of electric charge, and the exposed of active layer outside, need protective mulch to improve the stability of device usually.Top gate structure has requirements at the higher level to substrate, particularly requires in surfaceness and chemical stability.
Since the Hosono of Tokyo polytechnical university in 2004 reports the flexible and transparent TFT based on IGZO (In-Ga-Zn-O) preparation for the first time.IGZO-TFT has received the concern of research institution and industry member, and is being shown in Application for Field, especially the new display spare technology by developing.IGZO-TFT receives publicity and gets into the FPD application apace, and the characteristic that this and it display is inseparable, describes from electrical property, stability, uniformity below.
Outstanding electrical property
IGZO-TFT has higher mobility, generally between 1-100cm2/Vs.For example, people such as Kim M deposit the layer of silicon dioxide etching barrier layer on bottom grating structure IGZO-TFT, realized the TFT of the high mobility of 35.8cm2/Vs; The amorphous state IGZO-TFT of people such as the Ho-Nyun Lee of lg electronics report, its mobility is up to 95cm2/Vs.Except that higher mobility, IGZO-TFT also has low off-state current, and the minimum off-state current of IGZO-TFT reaches 10-14A, is less than 10-12A and be applied to usually that FPD requires for the off-state current of TFT; The IGZO-TFT defect concentration is also lower, is 1/10th of amorphous silicon TFT.
Homogeneity and stability preferably
Hayashi etc. are 96 bottom gate type IGZO-TFT devices of preparation on the substrate of 10mm * 10mm at area; Wherein semiconductor layer adopts the radio frequency magnetron sputtering method preparation; Each device has the wide length (being respectively 60 μ m and 10 μ m) of same size, finds that in test under the identical condition device represents the height consistance on important physical amounts such as threshold voltage, saturated mobility and the subthreshold value amplitude of oscillation by the gross.
The IGZO-TFT device of not annealing, stability is relatively poor, and through being higher than 300 ℃ annealing, and the defective in can passivating amorphous IGZO makes TFT device exhibits stability preferably.
Although IGZO film crystal pipe unit is created by a large amount of research and development; And still do not have at present a kind of detection, demo plant to be used for that thereby each orientation detects coming of new or whether the drive characteristic of the IGZO thin film transistor (TFT) developed reaches the manufacturing requirement; The current IGZO thin film transistor (TFT) that just need a kind ofly collect a plurality of test functions district drives and array prepares pick-up unit; Can be from single to a plurality of; From being distributed to integral body, comprehensive, the drive characteristic of the IGZO film crystal pipe unit of the detection coming of new that height is integrated.
The utility model content
For overcoming above-mentioned defective of the prior art, the utility model proposes a kind of device that is used to detect the IGZO-TFT drive characteristic.
This device comprises that IGZO-TFT driver element and array prepare used mask plate, several microcapsules Electronphoretic display units; This mask plate comprises three functional areas, is respectively: alignment mark regions, individual devices district, array region; Said alignment mark regions is at two edges of mask plate, and each edge adopts a plurality of square figures to serve as a mark; This square figure at each edge adopts the square figure that increases gradually from both ends to the middle, and it is little to have formed the two ends square, the structure that middle square is big; Said individual devices is distinguished two districts, and the first area is positioned at mask plate two rows topmost, amounts to 8 * 2 single TFT; Array region comprises at least two group patterns, and each array can display quantity according to the needs of reality and select.
Preferably, said 16 TFT are according to different four groups of A, B, C, the D of being divided into of channel width and length, and the corresponding respectively wide length of raceway groove is respectively 900 μ m and 60 μ m, 1200 μ m and 80 μ m, 1200 μ m and 60 μ m, 900 μ m and 80 μ m.
Preferably, in the zone, the lower left corner of mask plate 3 * 2 single TFT are arranged, be used to drive the microcapsules display unit, the wide length of its raceway groove is respectively 1200 μ m and 60 μ m, and the area of this area pixel electrode is bigger than conventional area, is 3mm * 3mm.
Preferably, one of them is 8 * 6 arrays in the said array; The display area of this 8 * 6 pixelated array is 28mm * 16mm, and the area of single pixel is 3.5mm * 3mm.The wide length of single TFT pixel raceway groove is 800 μ m and 60 μ m in 8 * 6 arrays, and the width of sweep trace is 100 μ m, and the width of signal wire is 150 μ m, and TFT source electrode is of a size of 3mm * 3mm.
Through this pick-up unit, not only can carry out the detection of driveability by array TFT transistor, and also can realize detecting one by one single TFT transistor; Simultaneously, also array quantity is set as required, and tft array can realize driving Presentation Function when single pixel static drive.In addition, adopt alignment mark regions can accelerate the efficient and the accuracy of testing.
Description of drawings
Fig. 1 illustrates several frequently seen TFT structure of the prior art;
The IGZO-TFT driver element is shown Fig. 2 a and array prepares used mask plate concrete graphic;
The IGZO-TFT driver element is shown Fig. 2 b and array prepares used mask plate explanation synoptic diagram;
Fig. 3 shows single IGZO-TFT and drives microcapsules display unit test circuit synoptic diagram;
Fig. 4 shows 8 * 6IGZO-TFT and drives microcapsules display unit test circuit synoptic diagram.
As shown in the figure; In order clearly to realize the structure of the embodiment of the utility model, marked specific structure and device in the drawings, but this is merely the signal needs; Be not that intention is limited to the utility model in this ad hoc structure, device and the environment; According to concrete needs, those of ordinary skill in the art can adjust these devices and environment or revise, and adjustment of being carried out or modification still are included in the scope of accompanying Claim.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment a kind of device that is used to detect the IGZO-TFT drive characteristic that the utility model provides is described in detail.
In the following description, with a plurality of different aspect of describing the utility model, yet, for the one of ordinary skilled in the art, can only utilize some or the entire infrastructure of the utility model or flow process to implement the utility model.For the definition of explaining, set forth specific number, configuration and order, but clearly, do not had also can to implement the utility model under the situation of these specific detail.In other cases, in order not obscure the utility model, will set forth no longer in detail for some well-known characteristics.
This device that is used to detect the IGZO-TFT drive characteristic mainly comprises mask plate and several microcapsules Electronphoretic display units of IGZO-TFT driver element.
Fig. 2 (a), Fig. 2 (b) prepare used mask plate concrete graphic and explanation synoptic diagram for IGZO-TFT driver element and the array that the utility model designed, and it is three districts that its structure is divided into:
Alignment mark regions.Alignment mark regions is at two edges of mask plate; Each edge adopts a plurality of square figures to serve as a mark; Wherein this square figure at each edge adopts the square figure that increases gradually from both ends to the middle, and it is little to have formed the two ends square, the structure that middle square is big.
The individual devices zone.Individual devices is distinguished two districts, and Fig. 2 (a) two rows are topmost seen in the first area, amount to 8 * 2 single TFT.These 16 TFT are according to different four groups of A, B, C, the D of being divided into of channel width and length, and the corresponding respectively wide length of raceway groove is respectively 900 μ m and 60 μ m, 1200 μ m and 80 μ m, 1200 μ m and 60 μ m, 900 μ m and 80 μ m.In Fig. 2 (a) zone, the lower left corner 3 * 2 single TFT are arranged, be used to drive the microcapsules display unit, the wide length of its raceway groove is respectively 1200 μ m and 60 μ m; The maximum characteristics in this zone are exactly that the area of pixel electrode (source electrode) is bigger; Be generally N * N, 2≤N≤4 wherein, unit is a millimeter (mm); Wherein being preferably 3mm * 3mm, mainly is in order to observe easily with showing the integrated driving of film.It is wherein following that to drive the used TFT figure of integrated demonstration about individual devices be exactly this regional TFT.
Array region.Comprise two group patterns in the mask plate, this array can display quantity according to the needs of reality and select, and wherein is preferably 8 * 6 arrays and 3 * 3, and the design parameter of the domain of two group patterns is the same.Be that example describes with 8 * 6 arrays below.The display area of 8 * 6 pixelated array is 28mm * 16mm, and the area of single pixel is 3.5mm * 3mm.The wide length of single TFT pixel raceway groove is 800 μ m and 60 μ m in array, and the width of sweep trace is 100 μ m, and the width of signal wire is 150 μ m, and TFT source electrode is of a size of 3mm * 3mm, simultaneously also as the pixel electrode of TFT.
The integrated demonstration of single IGZO-TFT device
Fig. 3 shows single IGZO-TFT and drives microcapsules display unit test circuit synoptic diagram.The TFT device substrate shows film laminating through cementing agent with microcapsules; Impose driving voltage then; Test its driving force; The voltage of public electrode is constant when drive showing, controls the voltage of drain electrode through the variation of control signal (gate electrode) voltage, makes upper and lower base plate produce voltage difference and realizes white and black displays.When TFT was in gating, the voltage of public electrode was 15V, and the voltage of gate electrode is 40V; Source class voltage is 0V, and the voltage of drain electrode is about 0V, and the voltage of upper substrate is higher than bottom crown like this; Make electronegative white particles move, white when human eye can be watched to upper substrate; If the voltage of source electrode is 30V, in this state, drain voltage probably is 30V, and bottom crown voltage is higher than top crown voltage, makes the black particles of positively charged assemble to upper substrate, and the color that human eye can be seen is a black.
Flexible 8 * 6IGZO-TFT array drives integrated demonstration
The big advantage that active TFT shows is exactly the cross effect that can eliminate in the passive drive, and so-called cross effect is meant when applying voltage on the pixel, near also have certain voltage on the not selected pixel.Flexible IGZO-TFT array and microcapsules show that film is integrated into active display screen; It is more similar with the method for testing of individual devices that it drives method of testing; 8 active pixel TFT of the 6th row that we have carried out in 8 * 6 arrays carry out the line scanning test of 8 unlike signals, and analyze to the problem that is produced in showing.
When the active display pixel structure of 8 * 6 arrays being carried out turntable driving demonstration test, for ease, we just verify the 6th row in 8 * 6 pixels, and the preceding five-element's sweep trace all connects low level.
Fig. 4 shows 8 * 6IGZO-TFT and drives microcapsules display unit test circuit synoptic diagram.Original state is all is input as low level, and the 6th row is shown as complete white; Then since the 6th first (being designated as C61) of row scanning, during scanning, data-signal is increased to 30V from 0V, and theoretically, TFT is in conducting state, and the voltage of pixel electrode is about 30V, shows black; And the like, signal electrode is successively from C61 to C68, when the gating pixel; The data line ground connection of other pixel is so other pixel all is a white; Can find out, for the scanning of each row, the bright dark solid colour of microcapsules; The independence that the TFT device drive is described is pretty good, can not produce cross effect.
From prepared IGZO-TFT and the integrated realization white and black displays of microcapsules electrophoretic display thin film, comprise the white and black displays of single active driving pixels and the active driving pixels white and black displays of 8 * 6 arrays, the result summarizes as follows:
1. single flexible IGZO-TFT device can be realized the microcapsules display driver preferably.
2.8 * 6 flexible IGZO-TFT arrays are when single pixel static drive; Can realize driving Presentation Function, but be expert at or column scan when drive realizing that function shows that the display performance that each pixel appears is inconsistent; And effect and pixel electrode in scan electrode and the demonstration of signal electrode place are inconsistent; Theoretically, these two kinds of problems can independently solve source-drain electrode and pixel electrode through improving uniformity of film and increasing a photoetching respectively.
What should explain at last is; Above embodiment only limits in order to the technical scheme of description the utility model rather than to the present technique method; The utility model can extend to other modification, variation, application and embodiment on using, and therefore thinks that all such modifications, variation, application, embodiment are in the spirit and teachings of the utility model.

Claims (5)

1. device that is used to detect the IGZO-TFT drive characteristic, this device comprises that IGZO-TFT driver element and array prepare used mask plate, several microcapsules Electronphoretic display units; It is characterized in that: this mask plate comprises three functional areas, is respectively: alignment mark regions, individual devices district, array region; Said alignment mark regions is at two edges of mask plate, and each edge adopts a plurality of square figures to serve as a mark; This square figure at each edge adopts the square figure that increases gradually from both ends to the middle, and it is little to have formed the two ends square, the structure that middle square is big; Said individual devices is distinguished two districts, and the first area is positioned at mask plate two rows topmost, amounts to 8 * 2 single TFT; Array region comprises at least two group patterns, and each array can display quantity according to the needs of reality and select.
2. be used to detect the device of IGZO-TFT drive characteristic according to claim 1; It is characterized in that; Said 16 TFT are according to different four groups of A, B, C, the D of being divided into of channel width and length, and the corresponding respectively wide length of raceway groove is respectively 900 μ m and 60 μ m, 1200 μ m and 80 μ m, 1200 μ m and 60 μ m, 900 μ m and 80 μ m.
3. like the said device that is used to detect the IGZO-TFT drive characteristic of claim 2; It is characterized in that; In the zone, the lower left corner of mask plate 3 * 2 single TFT are arranged, be used to drive the microcapsules display unit, the wide length of its raceway groove is respectively 1200 μ m and 60 μ m; The area of this area pixel electrode is bigger than conventional area, is 3mm * 3mm.
4. be used to detect the device of IGZO-TFT drive characteristic according to claim 1, it is characterized in that, one of them is 8 * 6 arrays in the said array; The display area of this 8 * 6 pixelated array is 28mm * 16mm, and the area of single pixel is 3.5mm * 3mm.
5. like the said device that is used to detect the IGZO-TFT drive characteristic of claim 4; It is characterized in that the wide length of single TFT pixel raceway groove is 800 μ m and 60 μ m in 8 * 6 arrays, the width of sweep trace is 100 μ m; The width of signal wire is 150 μ m, and TFT source electrode is of a size of 3mm * 3mm.
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CN201110267190XA Pending CN102832251A (en) 2011-06-15 2011-09-09 Flexible semitransparent indium gallium zinc oxide (IGZO) thin film transistor
CN 201120338446 Expired - Fee Related CN202285237U (en) 2011-06-15 2011-09-09 Flexible semi-transparent indium gallium zinc oxide (IGZO) thin-film transistor
CN 201120338472 Expired - Fee Related CN202404869U (en) 2011-06-15 2011-09-09 Apparatus for detecting IGZO-TFT driving characteristic
CN2011102672067A Pending CN102832131A (en) 2011-06-15 2011-09-09 Method for manufacturing flexible IGZO (In-Ga-Zn-O) thin film transistor
CN2011102671384A Pending CN102831850A (en) 2011-06-15 2011-09-09 Device for detecting IGZO (Indium Gallium Zinc Oxide)-TFT (Thin Film Transistor) drive characteristics
CN2011102671435A Pending CN102832109A (en) 2011-06-15 2011-09-09 Method for strengthening thin film in flexible thin film transistor manufacturing process
CN2011102672118A Pending CN102832252A (en) 2011-06-15 2011-09-09 Flexible indium gallium zinc oxide (IGZO) thin film transistor
CN2011102671365A Pending CN102832257A (en) 2011-06-15 2011-09-09 MIM structure device used to test SiNx insulating layer
CN 201120338322 Expired - Fee Related CN202487581U (en) 2011-06-15 2011-09-09 Flexible IGZO thin film transistor
CN2011102671399A Pending CN102832103A (en) 2011-06-15 2011-09-09 Manufacturing method of MIM (metal layer-insulation layer-metal layer) structure used for testing SiNx insulating layer
CN2011102671204A Pending CN102832130A (en) 2011-06-15 2011-09-09 Method for manufacturing flexible semitransparent IGZO (In-Ga-Zn-O) thin film transistor (TFT)

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CN201110267190XA Pending CN102832251A (en) 2011-06-15 2011-09-09 Flexible semitransparent indium gallium zinc oxide (IGZO) thin film transistor
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CN2011102671384A Pending CN102831850A (en) 2011-06-15 2011-09-09 Device for detecting IGZO (Indium Gallium Zinc Oxide)-TFT (Thin Film Transistor) drive characteristics
CN2011102671435A Pending CN102832109A (en) 2011-06-15 2011-09-09 Method for strengthening thin film in flexible thin film transistor manufacturing process
CN2011102672118A Pending CN102832252A (en) 2011-06-15 2011-09-09 Flexible indium gallium zinc oxide (IGZO) thin film transistor
CN2011102671365A Pending CN102832257A (en) 2011-06-15 2011-09-09 MIM structure device used to test SiNx insulating layer
CN 201120338322 Expired - Fee Related CN202487581U (en) 2011-06-15 2011-09-09 Flexible IGZO thin film transistor
CN2011102671399A Pending CN102832103A (en) 2011-06-15 2011-09-09 Manufacturing method of MIM (metal layer-insulation layer-metal layer) structure used for testing SiNx insulating layer
CN2011102671204A Pending CN102832130A (en) 2011-06-15 2011-09-09 Method for manufacturing flexible semitransparent IGZO (In-Ga-Zn-O) thin film transistor (TFT)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103838053A (en) * 2012-11-23 2014-06-04 德克萨斯仪器股份有限公司 Electrophoretic display and method of operating

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102917089A (en) * 2012-10-09 2013-02-06 金振平 Display screen panel and processing method thereof
CN103177970A (en) * 2013-02-26 2013-06-26 上海大学 Method for manufacturing oxide thin-film transistor
CN104282567B (en) * 2013-07-05 2017-05-03 上海和辉光电有限公司 Method for manufacturing IGZO layer and TFT
CN104282767B (en) * 2013-07-05 2017-12-12 鸿富锦精密工业(深圳)有限公司 Thin film transistor (TFT) and its manufacture method
WO2015060318A1 (en) * 2013-10-22 2015-04-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
CN103943683B (en) * 2013-12-06 2017-12-26 山东大学(威海) A kind of indium tin zinc oxide homogeneity thin film transistor (TFT) and preparation method thereof
CN104155855B (en) * 2014-08-22 2017-12-15 深圳市华星光电技术有限公司 Etch-rate tests the preparation method and recycling method of control wafer
CN105845555B (en) * 2015-01-14 2019-07-02 南京瀚宇彩欣科技有限责任公司 Semiconductor device and its manufacturing method
TWI629791B (en) 2015-04-13 2018-07-11 友達光電股份有限公司 Active device structure and fabricating method thereof
CN105609556A (en) * 2015-09-24 2016-05-25 中国科学院微电子研究所 Transistor and manufacturing method thereof
CN106601619B (en) * 2015-10-16 2019-10-25 中芯国际集成电路制造(上海)有限公司 A kind of semiconductor devices and preparation method thereof, electronic device
US9496415B1 (en) 2015-12-02 2016-11-15 International Business Machines Corporation Structure and process for overturned thin film device with self-aligned gate and S/D contacts
JP6875088B2 (en) * 2016-02-26 2021-05-19 株式会社神戸製鋼所 Thin film transistor including oxide semiconductor layer
CN106252359B (en) * 2016-08-26 2019-06-11 武汉华星光电技术有限公司 Array substrate and liquid crystal display panel
CN107170831A (en) * 2017-06-14 2017-09-15 华南理工大学 A kind of nanometer paper substrate film transistor and preparation method thereof
CN107359206B (en) * 2017-08-11 2020-11-17 东台市超品光电材料有限公司 Preparation method of flexible transparent oxide double-gate thin film transistor
CN107993918A (en) * 2017-11-09 2018-05-04 信利半导体有限公司 A kind of preparation method of flexible display
CN108163803B (en) * 2017-12-26 2023-05-26 中国计量大学 MEMS three-dimensional tunnel structure
CN109801875B (en) * 2018-12-26 2021-06-04 惠科股份有限公司 Manufacturing method of array substrate, array substrate and display panel
CN111430386B (en) 2020-04-01 2023-11-10 京东方科技集团股份有限公司 Photoelectric detector, display substrate and manufacturing method of photoelectric detector
AU2021344334B2 (en) 2020-09-15 2023-12-07 E Ink Corporation Improved driving voltages for advanced color electrophoretic displays and displays with improved driving voltages
EP4214574A1 (en) 2020-09-15 2023-07-26 E Ink Corporation Four particle electrophoretic medium providing fast, high-contrast optical state switching
US11846863B2 (en) 2020-09-15 2023-12-19 E Ink Corporation Coordinated top electrode—drive electrode voltages for switching optical state of electrophoretic displays using positive and negative voltages of different magnitudes
CN112420519B (en) * 2020-11-19 2021-06-08 绵阳惠科光电科技有限公司 Preparation method of indium gallium zinc oxide thin film transistor device
CN112558437B (en) * 2020-12-18 2023-03-31 中国科学院光电技术研究所 Processing method of double-sided few-layer super-structured surface device
CN115007229B (en) * 2022-05-23 2023-11-14 佛山奥素博新科技有限公司 Digital micro-fluidic chip with pixel electrode marks and global image stitching method
CN115537781A (en) * 2022-10-27 2022-12-30 上海埃延半导体有限公司 Diffusion laminar flow reaction cavity and control method

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030001188A1 (en) * 2001-06-27 2003-01-02 Nakagawa Osamu Samuel High-dielectric constant metal-insulator metal capacitor in VLSI multi-level metallization systems
CN1352462A (en) * 2001-12-07 2002-06-05 清华大学 Double insulation layer thin film field emitting cathode
TWI380080B (en) * 2003-03-07 2012-12-21 Semiconductor Energy Lab Liquid crystal display device and method for manufacturing the same
CN1277288C (en) * 2003-11-07 2006-09-27 南亚科技股份有限公司 Testing mask structure
CN100383932C (en) * 2005-07-05 2008-04-23 华中科技大学 Silicon wet-etching technology
JP2007073705A (en) * 2005-09-06 2007-03-22 Canon Inc Oxide-semiconductor channel film transistor and its method of manufacturing same
US7763923B2 (en) * 2005-12-29 2010-07-27 Taiwan Semiconductor Manufacturing Co., Ltd. Metal-insulator-metal capacitor structure having low voltage dependence
US8154493B2 (en) * 2006-06-02 2012-04-10 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device, driving method of the same, and electronic device using the same
KR100788545B1 (en) * 2006-12-29 2007-12-26 삼성에스디아이 주식회사 Organic light emitting display and manufacturing method thereof
CN100461433C (en) * 2007-01-04 2009-02-11 北京京东方光电科技有限公司 TFI array structure and manufacturing method thereof
KR100987840B1 (en) * 2007-04-25 2010-10-13 주식회사 엘지화학 Thin film transistor and method for preparing the same
CN101364603A (en) * 2007-08-10 2009-02-11 北京京东方光电科技有限公司 TFT array substrate construction and manufacturing method thereof
JP5393058B2 (en) * 2007-09-05 2014-01-22 キヤノン株式会社 Field effect transistor
JP2009253204A (en) * 2008-04-10 2009-10-29 Idemitsu Kosan Co Ltd Field-effect transistor using oxide semiconductor, and its manufacturing method
TWI500159B (en) * 2008-07-31 2015-09-11 Semiconductor Energy Lab Semiconductor device and method for manufacturing the same
CN101661220B (en) * 2008-08-27 2013-03-13 北京京东方光电科技有限公司 Liquid crystal display panel and mask plate
CN101752387B (en) * 2008-12-16 2012-02-29 京东方科技集团股份有限公司 E-paper, E-paper thin film transistor (TFT) baseplate and fabrication method thereof
JP2010205798A (en) * 2009-02-27 2010-09-16 Japan Science & Technology Agency Method of manufacturing thin-film transistor
KR101218090B1 (en) * 2009-05-27 2013-01-18 엘지디스플레이 주식회사 Oxide thin film transistor and method of fabricating the same
KR101578694B1 (en) * 2009-06-02 2015-12-21 엘지디스플레이 주식회사 Method of fabricating oxide thin film transistor
JP5499529B2 (en) * 2009-06-25 2014-05-21 大日本印刷株式会社 Thin film transistor mounting substrate, manufacturing method thereof, and image display device
KR101248459B1 (en) * 2009-11-10 2013-03-28 엘지디스플레이 주식회사 Liquid crystal display device and method of fabricating the same
CN101789450B (en) * 2010-01-26 2012-02-01 友达光电股份有限公司 Thin film transistor and method for manufacturing silicon-rich channel layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103838053A (en) * 2012-11-23 2014-06-04 德克萨斯仪器股份有限公司 Electrophoretic display and method of operating
CN103838053B (en) * 2012-11-23 2018-09-21 德克萨斯仪器股份有限公司 Electrophoretic display device (EPD) and operating method

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