CN202384300U - 用于离子注入的掩膜环 - Google Patents
用于离子注入的掩膜环 Download PDFInfo
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- CN202384300U CN202384300U CN 201120571324 CN201120571324U CN202384300U CN 202384300 U CN202384300 U CN 202384300U CN 201120571324 CN201120571324 CN 201120571324 CN 201120571324 U CN201120571324 U CN 201120571324U CN 202384300 U CN202384300 U CN 202384300U
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Application Number | Priority Date | Filing Date | Title |
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CN 201120571324 CN202384300U (zh) | 2011-12-30 | 2011-12-30 | 用于离子注入的掩膜环 |
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CN 201120571324 CN202384300U (zh) | 2011-12-30 | 2011-12-30 | 用于离子注入的掩膜环 |
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CN202384300U true CN202384300U (zh) | 2012-08-15 |
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CN 201120571324 Expired - Fee Related CN202384300U (zh) | 2011-12-30 | 2011-12-30 | 用于离子注入的掩膜环 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130424 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20130424 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120815 Termination date: 20181230 |
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CF01 | Termination of patent right due to non-payment of annual fee |