CN202373578U - 超薄贴片二极管 - Google Patents

超薄贴片二极管 Download PDF

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Publication number
CN202373578U
CN202373578U CN2011205354786U CN201120535478U CN202373578U CN 202373578 U CN202373578 U CN 202373578U CN 2011205354786 U CN2011205354786 U CN 2011205354786U CN 201120535478 U CN201120535478 U CN 201120535478U CN 202373578 U CN202373578 U CN 202373578U
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lead
chip
wire
face
jumper wire
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Expired - Fee Related
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CN2011205354786U
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蒋李望
王双
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Yangzhou Yangjie Electronic Co Ltd
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Yangzhou Yangjie Electronic Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

超薄贴片二极管。涉及太阳能光伏用超薄贴片二极管。提供了一种空间体积小、实用方便和易于加工的超薄贴片二极管。包括芯片、引线一和引线二，还包括跳线，所述引线一和引线二呈片状，所述芯片的底面贴设于所述引线一的内端面；所述跳线呈片状，所述跳线的一端连接芯片的顶面、另一端连接引线二的内端面，使得所述引线一、芯片与引线二相连接。本实用新型将芯片平行于引线放置，有效的减小了产品体积，增加了芯片的接触面积，使得芯片牢牢的固定在引线上，同时还设有呈片状的跳线，进一步牢固了芯片的位置；在引线的外端面设有安装孔，不仅保留了客户焊接使用的方便，而且方便了客户用螺栓进行安装。

Description

超薄贴片二极管
技术领域
本实用新型涉及二极管，尤其涉及太阳能光伏用超薄贴片二极管。
背景技术
现有技术中，贴片二极管的加工是将两根引线夹住芯片进行焊接，然后通过玻封的形式，将芯片进行封装，使得本体外形多为圆柱形，占用空间体积较大，导致原材料浪费严重，而且难以适应客户端小型化发展趋势。随着塑封二极管的出现，很大程度上降低了二极管的空间体积，但是二级管在使用过程中，会出现芯片焊接质量不牢固等情况，影响了工作过程中的二极管的使用寿命等。
实用新型内容
本实用新型针对以上问题，提供了一种空间体积小、实用方便和易于加工的超薄贴片二极管。
本实用新型的技术方案是：包括芯片、引线一和引线二，还包括跳线，所述引线一和引线二呈片状，所述芯片的底面贴设于所述引线一的内端面；
所述跳线呈片状，所述跳线的一端连接芯片的顶面、另一端连接引线二的内端面，使得所述引线一、芯片与引线二相连接。
所述引线一的外端面设有通孔，所述引线二的外端面设有腰形孔。
所述引线二内端面设有朝向所述跳线的段差面，使得所述引线二的内端顶面与所述芯片顶面位于同一平面。
本实用新型将芯片平行于引线放置，有效的减小了产品体积，增加了芯片的接触面积，使得芯片牢牢的固定在引线上，同时还设有呈片状的跳线，进一步牢固了芯片的位置；在引线的外端面设有安装孔，不仅保留了客户焊接使用的方便，而且方便了客户用螺栓进行安装。本实用新型结构紧凑，既有效地降低了产品体积，又保证了芯片的焊接质量，提高了产品的使用寿命。
附图说明
图1是本实用新型的结构示意图，
图2是图1的右视图；
图中1是引线一，10是通孔，2是芯片，3是跳线，4是引线二，40是腰形孔，41是段差面，5是塑胶壳，6是焊片。
具体实施方式
本实用新型如图1-2所示，包括芯片2、引线一1和引线二4，还包括跳线3，所述引线一1和引线二4呈片状，所述芯片2的底面贴设于所述引线一1的内端面的顶面上；
所述跳线3呈片状，所述跳线3的一端的底面连接芯片2的顶面、另一端的底面连接引线二4的内端面的顶面，使得所述引线一1、芯片2与引线二4相连接。跳线3通过焊片6，使其与芯片2和引线二4连接。
所述引线一1的外端面设有通孔，所述引线二4的外端面设有腰形孔。引线一1和引线二4的外端面设有安装孔，可以通过螺栓进行紧固连接。这样不仅可以通过焊接进行连接，还有采用螺钉、螺丝进行连接，方便户外维护、更换元器件。
所述引线二4内端面设有朝向所述跳线3的段差面41，使得所述引线二4的内端顶面与所述芯片2顶面位于同一平面，这样两者之间的连接更可靠。
最后，通过塑胶壳5进行塑封制得。

Claims (2)

1.超薄贴片二极管，包括芯片、引线一和引线二，其特征在于，还包括跳线，所述引线一和引线二呈片状，所述芯片的底面贴设于所述引线一的内端面；
所述跳线呈片状，所述跳线的一端连接芯片的顶面、另一端连接引线二的内端面，使得所述引线一、芯片与引线二相连接。
2.根据权利要求1 所述的超薄贴片二极管，其特征在于，所述引线二内端面设有朝向所述跳线的段差面，使得所述引线二的内端顶面与所述芯片顶面位于同一平面。
CN2011205354786U 2011-12-20 2011-12-20 超薄贴片二极管 Expired - Fee Related CN202373578U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105514058A (zh) * 2016-02-03 2016-04-20 泰州优宾晶圆科技有限公司 一种开放性贴片二极管
CN105743363A (zh) * 2016-04-25 2016-07-06 蒋李望 一种磁电机用单相整流、电压调节功率模块及其制作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105514058A (zh) * 2016-02-03 2016-04-20 泰州优宾晶圆科技有限公司 一种开放性贴片二极管
CN105743363A (zh) * 2016-04-25 2016-07-06 蒋李望 一种磁电机用单相整流、电压调节功率模块及其制作方法

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Granted publication date: 20120808

Termination date: 20171220