CN202373578U - 超薄贴片二极管 - Google Patents
超薄贴片二极管 Download PDFInfo
- Publication number
- CN202373578U CN202373578U CN2011205354786U CN201120535478U CN202373578U CN 202373578 U CN202373578 U CN 202373578U CN 2011205354786 U CN2011205354786 U CN 2011205354786U CN 201120535478 U CN201120535478 U CN 201120535478U CN 202373578 U CN202373578 U CN 202373578U
- Authority
- CN
- China
- Prior art keywords
- lead
- chip
- wire
- face
- jumper wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
超薄贴片二极管。涉及太阳能光伏用超薄贴片二极管。提供了一种空间体积小、实用方便和易于加工的超薄贴片二极管。包括芯片、引线一和引线二,还包括跳线,所述引线一和引线二呈片状,所述芯片的底面贴设于所述引线一的内端面;所述跳线呈片状,所述跳线的一端连接芯片的顶面、另一端连接引线二的内端面,使得所述引线一、芯片与引线二相连接。本实用新型将芯片平行于引线放置,有效的减小了产品体积,增加了芯片的接触面积,使得芯片牢牢的固定在引线上,同时还设有呈片状的跳线,进一步牢固了芯片的位置;在引线的外端面设有安装孔,不仅保留了客户焊接使用的方便,而且方便了客户用螺栓进行安装。
Description
技术领域
本实用新型涉及二极管,尤其涉及太阳能光伏用超薄贴片二极管。
背景技术
现有技术中,贴片二极管的加工是将两根引线夹住芯片进行焊接,然后通过玻封的形式,将芯片进行封装,使得本体外形多为圆柱形,占用空间体积较大,导致原材料浪费严重,而且难以适应客户端小型化发展趋势。随着塑封二极管的出现,很大程度上降低了二极管的空间体积,但是二级管在使用过程中,会出现芯片焊接质量不牢固等情况,影响了工作过程中的二极管的使用寿命等。
实用新型内容
本实用新型针对以上问题,提供了一种空间体积小、实用方便和易于加工的超薄贴片二极管。
本实用新型的技术方案是:包括芯片、引线一和引线二,还包括跳线,所述引线一和引线二呈片状,所述芯片的底面贴设于所述引线一的内端面;
所述跳线呈片状,所述跳线的一端连接芯片的顶面、另一端连接引线二的内端面,使得所述引线一、芯片与引线二相连接。
所述引线一的外端面设有通孔,所述引线二的外端面设有腰形孔。
所述引线二内端面设有朝向所述跳线的段差面,使得所述引线二的内端顶面与所述芯片顶面位于同一平面。
本实用新型将芯片平行于引线放置,有效的减小了产品体积,增加了芯片的接触面积,使得芯片牢牢的固定在引线上,同时还设有呈片状的跳线,进一步牢固了芯片的位置;在引线的外端面设有安装孔,不仅保留了客户焊接使用的方便,而且方便了客户用螺栓进行安装。本实用新型结构紧凑,既有效地降低了产品体积,又保证了芯片的焊接质量,提高了产品的使用寿命。
附图说明
图1是本实用新型的结构示意图,
图2是图1的右视图;
图中1是引线一,10是通孔,2是芯片,3是跳线,4是引线二,40是腰形孔,41是段差面,5是塑胶壳,6是焊片。
具体实施方式
本实用新型如图1-2所示,包括芯片2、引线一1和引线二4,还包括跳线3,所述引线一1和引线二4呈片状,所述芯片2的底面贴设于所述引线一1的内端面的顶面上;
所述跳线3呈片状,所述跳线3的一端的底面连接芯片2的顶面、另一端的底面连接引线二4的内端面的顶面,使得所述引线一1、芯片2与引线二4相连接。跳线3通过焊片6,使其与芯片2和引线二4连接。
所述引线一1的外端面设有通孔,所述引线二4的外端面设有腰形孔。引线一1和引线二4的外端面设有安装孔,可以通过螺栓进行紧固连接。这样不仅可以通过焊接进行连接,还有采用螺钉、螺丝进行连接,方便户外维护、更换元器件。
所述引线二4内端面设有朝向所述跳线3的段差面41,使得所述引线二4的内端顶面与所述芯片2顶面位于同一平面,这样两者之间的连接更可靠。
最后,通过塑胶壳5进行塑封制得。
Claims (2)
1.超薄贴片二极管,包括芯片、引线一和引线二,其特征在于,还包括跳线,所述引线一和引线二呈片状,所述芯片的底面贴设于所述引线一的内端面;
所述跳线呈片状,所述跳线的一端连接芯片的顶面、另一端连接引线二的内端面,使得所述引线一、芯片与引线二相连接。
2.根据权利要求1 所述的超薄贴片二极管,其特征在于,所述引线二内端面设有朝向所述跳线的段差面,使得所述引线二的内端顶面与所述芯片顶面位于同一平面。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205354786U CN202373578U (zh) | 2011-12-20 | 2011-12-20 | 超薄贴片二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205354786U CN202373578U (zh) | 2011-12-20 | 2011-12-20 | 超薄贴片二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202373578U true CN202373578U (zh) | 2012-08-08 |
Family
ID=46597272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011205354786U Expired - Fee Related CN202373578U (zh) | 2011-12-20 | 2011-12-20 | 超薄贴片二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202373578U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105514058A (zh) * | 2016-02-03 | 2016-04-20 | 泰州优宾晶圆科技有限公司 | 一种开放性贴片二极管 |
CN105743363A (zh) * | 2016-04-25 | 2016-07-06 | 蒋李望 | 一种磁电机用单相整流、电压调节功率模块及其制作方法 |
-
2011
- 2011-12-20 CN CN2011205354786U patent/CN202373578U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105514058A (zh) * | 2016-02-03 | 2016-04-20 | 泰州优宾晶圆科技有限公司 | 一种开放性贴片二极管 |
CN105743363A (zh) * | 2016-04-25 | 2016-07-06 | 蒋李望 | 一种磁电机用单相整流、电压调节功率模块及其制作方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN202373578U (zh) | 超薄贴片二极管 | |
CN201150149Y (zh) | 偷锡焊盘 | |
CN202120937U (zh) | 太阳能组件封装结构 | |
CN202678303U (zh) | 一种引线框架 | |
CN204558206U (zh) | 一种电子零件组装盒 | |
CN101552267A (zh) | 单臂桥式汽车整流二极管 | |
CN201570498U (zh) | 单臂桥式汽车整流二极管 | |
CN203491970U (zh) | 一种适用于双玻组件接线盒的装配装置 | |
CN201914814U (zh) | 一种电梯轿厢吊顶 | |
CN202340041U (zh) | 一种电机接线柱 | |
CN202405274U (zh) | 高贴服高导电光伏焊带 | |
CN201758139U (zh) | 新型led光源模组封装结构 | |
CN206301840U (zh) | 一种直插超小型侧发光led红外发射管模组 | |
CN201651933U (zh) | 多功能全防水led线条灯 | |
CN201741665U (zh) | 一种打胶的节能灯管 | |
CN204647932U (zh) | Led连体灯丝支架及其灯泡 | |
CN206072785U (zh) | 车用铝基板折弯结构 | |
CN201134437Y (zh) | 一种光电元件 | |
CN202384325U (zh) | 一种晶体封装结构 | |
CN204760367U (zh) | 一种引线框架固定装置 | |
CN207471178U (zh) | 一种结构简单的led灯泡 | |
CN202769430U (zh) | 采用灯壳作为安装界面支架结构的led路灯 | |
CN201297095Y (zh) | 中空铝条 | |
CN202094142U (zh) | 太阳能光伏组件安装用的挂钩装置 | |
CN201758140U (zh) | 新型led光源模块封装结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120808 Termination date: 20171220 |