CN202372911U - Air deflecting and radiating device for computer - Google Patents
Air deflecting and radiating device for computer Download PDFInfo
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- CN202372911U CN202372911U CN2011205104333U CN201120510433U CN202372911U CN 202372911 U CN202372911 U CN 202372911U CN 2011205104333 U CN2011205104333 U CN 2011205104333U CN 201120510433 U CN201120510433 U CN 201120510433U CN 202372911 U CN202372911 U CN 202372911U
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- heat
- wind guide
- dispersion device
- radiator
- heat dispersion
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Abstract
An air deflecting and radiating device for a computer is characterized in that the air deflecting and radiating device is an air duct with a tapered ventilating duct in the computer, the tapered ventilating duct is arranged in the middle, and a large-caliber area and a small-caliber area are respectively arranged at two ends; while a radiator fan is mounted at the large-caliber area, heating chips or radiating fins on a radiator of the device are mounted on the outer side of the port of the small-caliber area or embedded into the small-caliber area; due to the bottleneck effect of the air deflecting device, when the fan at the large-caliber area starts, the wind speed of gaps among the radiating fins at the small-caliber region of the air deflecting device is higher than that at the large-caliber area; and compared with a method that the fan is adhered on the radiating fins in the prior art, the heat radiating efficiency is greatly improved. Therefore, the computer adopting the radiating device has a low cost, is light in weight, and can achieve the effect of reducing noise when in high load.
Description
Technical field
The utility model relates to the computer to dissipate heat field, particularly a kind of computing machine wind guide and heat dispersion device.
Background technology
Fan on power supply fan on the computing machine, cpu heat and the video card heating radiator all can send certain noise usually; Heat dissipating method under the prior art normally directly is attached to fan on the heat radiator of heating radiator hot gas is blown into cabinet, and then utilizes power supply fan and cabinet auxiliary blower that hot gas is extracted into outside the cabinet.Under this method, no matter how to reduce the noise of fan on the heat radiator, the noise that power supply fan and cabinet auxiliary blower send still exists.The quiet effect of computing machine only just can reach when underload usually under the prior art, and noise is still clearly when in very quiet environment, using.
Fig. 1 is a common computer cabinet planar structure synoptic diagram.Having 3 fans in the cabinet, is respectively chassis power supply fan 101, CPU radiator fan 102 and VGA COOLER 201.If in order to reduce the rotating speed that noise reduces power supply fan 101 significantly; Just can not discharge very soon outside the cabinet from the hot gas that CPU and video card send; The hot gas that remains in the cabinet can cause the whole rising of cabinet inside temperature; Cause gas flow temperature to improve, reduced radiating efficiency to CPU and video card heat radiation.
Under the prior art, even if under low configuring condition, the rotating speed that can not reduce power supply fan is to degree that can't hear noise.Higher and when higher load condition moves when computer configuration, in order to let in the cabinet hot gas discharge as early as possible, just also need extra increase cabinet auxiliary blower and improve rotation speed of the fan to reach the heat radiation requirement, noise is inevitable.In addition, long-term excessive air-flow also can be brought more dust into and get into cabinet, causes heat radiator to be stopped up by dust, further influences radiating effect.If computing machine does not have preposition auxiliary blower and is placed on below the desk of back face closure, because rearmounted air intake opening and exhaust outlet are too near, hot gas can't normally be discharged, and also can cause the computer overheating shutdown when serious.
The utility model content
The utility model discloses a kind of high efficiency computing machine wind guide and heat dispersion device; It is characterized in that a kind of guide duct that has the taper ventiduct that is installed in the computing machine; Be the taper ventiduct in the middle of the wind guide and heat dispersion device; Two ends are respectively heavy caliber district and small-bore district, and radiator fan is installed in wind guide and heat dispersion device heavy caliber district, and the heat radiator on euthermic chip or its heating radiator is installed in the port outside, small-bore district or is embedded in the small-bore district.
Because having the taper ventiduct has ink-bottle effect; Behind heavy caliber district starting fan; In the heat radiator slit in the small-bore district of wind guide and heat dispersion device, can produce wind speed, thereby can under the situation that keeps great heat radiation effect, reduce rotation speed of the fan significantly far above the heavy caliber end.
Further, radiator fan closely is embedded in the wind guide and heat dispersion device heavy caliber district.
Further, radiator fan is close to the port outside, wind guide and heat dispersion device heavy caliber district.
Further, with the small-bore district of wind guide and heat dispersion device port outside mask above euthermic chip in 20 millimeters.
Further, with the small-bore district of wind guide and heat dispersion device port outside mask above the heat radiator of euthermic chip heating radiator in 20 millimeters.
Further, adopt a kind of heating radiator, heat radiator closely is embedded in the small-bore district of wind guide and heat dispersion device with heat pipe.
Further, in a wind guide and heat dispersion device one or more taper ventiducts are arranged.
Further, one or more groups heat radiator of wind guide and heat dispersion device band.
Further, in a wind guide and heat dispersion device one or more taper ventiducts are arranged.
Further, corresponding one or more wind guide and heat dispersion devices on one group of heat radiator.
For the lower euthermic chip of thermal value; A wind guide and heat dispersion device can dispel the heat for a plurality of euthermic chips, and the heat radiator top that the small-bore district of wind guide and heat dispersion device port is covered on euthermic chip or its heating radiator is no more than 20 millimeters places and can plays radiating effect.
For the bigger euthermic chip of thermal value, adopt the heating radiator of band heat pipe, its heat radiator closely is embedded in the small-bore district of wind guide and heat dispersion device, can have good heat-radiation effect.In addition, if the euthermic chip power consumption is very big, can also uses a plurality of wind guide and heat dispersion devices and radiator fan to unite and be its heat radiation.
Adopt the common computer of the utility model wind guide and heat dispersion device; Wind guide and heat dispersion device heavy caliber district port is close on the power supply air intake vent; Employing is with the cpu heat of heat pipe and its heat radiator closely is embedded in the small-bore district of wind guide and heat dispersion device; Again with the small-bore district of wind guide and heat dispersion device outboard end mouth mask above mainboard north bridge chips heating radiator, utilize power supply fan to dispel the heat for power supply, CPU and mainboard north bridge chips simultaneously.Cold air is the process from mainboard north bridge chips heating radiator top earlier, takes away mainboard north bridge chips part heat, gets into the small-bore district of wind guide and heat dispersion device port again, and high speed is passed through from the CPU radiating fin slit then.Blow out by the air meeting whole entering power supply air intake vents after the CPU radiating fin heating and from the power supply air outlet.Because the north bridge chips thermal value is less; Little to CPU heat radiation influence; The hot gas that comes out from CPU radiating fin does not spread to the cabinet; Can not improve cabinet inside temperature and CPU radiating fin inlet air temperature, adopt high-effect power supply to dispel the heat in the lump simultaneously, therefore overall radiating efficiency is directly installed the heat dissipating method that fan is blown into hot gas cabinet far above prior art on CPU radiating fin.Adopt the computing machine of the utility model wind guide and heat dispersion device, after rotation speed of the fan reduces significantly, still can obtain better heat radiating effect, vibrations noise and pneumatic noise can both drop to extremely low degree.Through actual test, adopting the utility model wind guide and heat dispersion device is the computer to dissipate heat of 100 watts of total power consumptions, and requires noise to be reduced to below 5 decibels, and wind guide and heat dispersion device heavy caliber district and fan bore diameter reach more than 120 millimeters and can realize.
For the computing machine that middle and high end independence video card has been installed; Because the video card thermal value is very big; Must wind guide and heat dispersion device and radiator fan be installed in addition and dispel the heat, particularly for the computing machine that top independent video card has been installed, because video card chip thermal value is very big; Need to use many group wind guide and heat dispersion devices and radiator fan to merge and be its heat radiation, on case front panel, side plate or base plate, open air vent simultaneously.
CPU or video card for low-power consumption can keep original-pack common radiator, only remove fan, let the small-bore district of wind guide and heat dispersion device port cover on CPU radiating fin or video card heat radiator top and get final product.
The heating radiator that adopts heat pipe to draw heat radiator is compared the ordinary copper core Aluminium Radiator; Since heat pipe can be fast with heat transferred to the heat radiator of distant place; Cooperate the utility model wind guide and heat dispersion device radiation device, under equal environment and identical fans rotating speed, can effectively reduce about 20 ℃ of chip core temperature.
Adopt the computing machine of the utility model wind guide and heat dispersion device, because the whole airshed of cabinet is less, the dust that is brought in the cabinet has reduced a lot, even long-time use under the more environment of dust can not cause radiating efficiency that obvious reduction is arranged yet.
The utility model wind guide and heat dispersion device can be made different shape, and is crooked or one-body molded with casing according to the chassis space situation.The utility model wind guide and heat dispersion device is not only applicable to computing machine, can be used on other electronic equipments that are similar to computing machine yet.
Description of drawings
Fig. 1 prior art common computer cabinet planar structure synoptic diagram;
The common performance computing machine of Fig. 2 the utility model planar structure synoptic diagram;
The common performance Computerized 3 D of Fig. 3 the utility model structural representation;
Fig. 4 the utility model high-performance computer planar structure synoptic diagram;
Fig. 5 the utility model high-performance computer perspective view;
Fig. 6 the utility model very-high performance computing machine planar structure synoptic diagram;
Fig. 7 the utility model very-high performance Computerized 3 D structural representation;
Fig. 8 the utility model minitype high-performance computing machine planar structure synoptic diagram;
Fig. 9 the utility model minitype high-performance Computerized 3 D structural representation.
Embodiment
Below in conjunction with accompanying drawing, further explain is done in the preferred embodiment of the utility model.
Embodiment 1:
Fig. 2, Fig. 3 are common performance computing machine plane and the perspective view that the utility model wind guide and heat dispersion devices have been installed.This machine is general ATX vertical structure; The configuration maximum power dissipation is the double-core CPU of 65W; Adopt integrated graphics card; Chassis power supply contains the active high-effect power supply of 120mm bore fan for rated power 200W, and a 120mm bore cabinet auxiliary blower is equipped with in the front panel bottom, on CPU, adopts the heating radiator of band heat pipe.Wind guide and heat dispersion device heavy caliber district port is close on the chassis power supply air intake vent; CPU radiating fin is embedded in the small-bore district of the wind guide and heat dispersion device port; The small-bore district of wind guide and heat dispersion device port covers on mainboard north bridge heating radiator top, from the cabinet power pack, pulls out the fan electric wire and cabinet auxiliary blower electric wire together inserts the fan speed reduction unit.
The heat radiation process: (1) cold air is blown into cabinet through screen pack by cabinet auxiliary blower 110 from the front panel air intake vent; (2) air-flow enters into wind guide and heat dispersion device 120 from mainboard north bridge heating radiator 104 tops; (3) cold air is heated through CPU radiating fin 103; (4) Hot air quilt power supply fan 101 is extracted out outside the cabinet.
Because the hot gas that CPU produces does not get into cabinet, but directly is discharged from outside the cabinet, the temperature in the cabinet does not receive the influence of CPU heat, equals ambient temperature basically, uses the mainboard and the just ability operation steady in a long-term of device of normal quality, helps reducing equipment cost.In addition, utilize the fan speed reduction unit to reduce the rotating speed of power supply fan and cabinet auxiliary blower significantly after, can reach real super-silent effect.
This machine is through test, when room temperature is 25 ℃, adjustment fan speed reduction unit to noise less than 5 decibels; During the work of 10% underload, about 33 ℃ of core cpu temperature is during the full load pressure test; About 40 ℃ of core cpu temperature, all below 38 ℃, the heat radiation situation is fine for other device DIE Temperatures on the mainboard.When room temperature is 35 ℃, rotation speed of the fan is constant, about 62 ℃ of core cpu temperature during pressure test at full capacity, and the heat radiation situation is still normal.
Embodiment 2:
Fig. 4, Fig. 5 are high-performance computer plane and the perspective view that the utility model wind guide and heat dispersion devices have been installed.This machine is general ATX vertical structure; The configuration maximum power dissipation is that 4 nuclear CPU and the maximum power dissipation of 95W is the high-end video card of 125W; Chassis power supply contains the active high-effect power supply of 120mm bore fan for rated power 300W; A 120mm bore VGA COOLER is equipped with in the front panel bottom, and the heating radiator of mounting strap heat pipe and corresponding wind guide and heat dispersion device on CPU and video card are pulled out the fan electric wire from the cabinet power pack and the VGA COOLER electric wire together inserts the fan speed reduction unit.
Heat radiation process: (1) the first half: cold air gets into cabinet from front panel air intake vent 110, gets into wind guide and heat dispersion device 120 through mainboard north bridge heating radiator 104 tops, by CPU radiating fin 103 heating, is extracted out outside the cabinet by power supply fan 101 then; (2) the latter half: cold air gets into from backboard air intake vent 210, gets into wind guide and heat dispersion device 220 through the video card surface, is shown heat radiator 203 heating backs and discharges from VGA COOLER 201.
This machine is through test; When room temperature is 25 ℃, adjustment fan speed reduction unit to noise less than 5 decibels, about 35 ℃ of core cpu temperature, about 42 ℃ of video card DIE Temperature when 10% underload is worked; During the full load pressure test; About 46 ℃ of core cpu temperature, about 72 ℃ of video card DIE Temperature, all below 38 ℃, the heat radiation situation is normal for other device DIE Temperatures.When room temperature is 35 ℃, rotation speed of the fan is constant, at full capacity during pressure test, and about 57 ℃ of core cpu temperature, about 83 ℃ of video card DIE Temperature, computing machine still can long-time steady operation.Suitably adjustment fan speed reduction unit improves rotation speed of the fan, when not being higher than 15 decibels of the quiet noise of common computer underload, can the video card DIE Temperature be controlled at below 75 ℃.
Embodiment 3:
Fig. 6, Fig. 7 are very-high performance computing machine plane and the perspective view that the utility model wind guide and heat dispersion devices have been installed:
This cabinet is general ATX vertical structure, and the configuration maximum power dissipation is that 6 nuclear CPU and the maximum power dissipation of 125W is the top video card of 250W, and chassis power supply contains the active high-effect power supply of 120mm bore fan for rated power 500W.This machine air intake vent side plate with the back plate washer on, the heating radiator of mounting strap heat pipe and corresponding wind guide and heat dispersion device on CPU and video card.Because video card thermal value when high load capacity is very big, and a wind guide and heat dispersion device with two 120mm bore fans has been installed, the radiator fan electric wire of from power pack, pulling out on fan electric wire and the video card together inserts the fan speed reduction unit.
Heat radiation process: (1) the first half: cold air gets into cabinet from side plate air intake vent 310, through mainboard north bridge heating radiator 104 tops, gets into wind guide and heat dispersion device 221 again, by CPU radiating fin 103 heating, is discharged by power supply fan 101 then; (2) the latter half: cold air gets into the cabinet bottom from backboard air intake vent 210; Get into wind guide and heat dispersion device front portion 221 through the video card surface again, discharged by two fans 201 and 202 from wind guide and heat dispersion device rear portion 223 and 224 respectively after 203 heating of video card heat radiator.
This machine is through test; When room temperature is 25 ℃, adjustment fan speed reduction unit to noise less than 5 decibels, when underload is worked; About 35 ℃ of core cpu temperature, about 42 ℃ of video card DIE Temperature; About 58 ℃ of core cpu temperature, about 75 ℃ of video card DIE Temperature during the full load pressure test, all below 38 ℃, the heat radiation situation is normal for other device DIE Temperatures.When room temperature is 35 ℃, rotation speed of the fan is constant, at full capacity during pressure test, and about 70 ℃ of core cpu temperature, about 88 ℃ of video card DIE Temperature, computing machine still can long-time steady operation.Suitably adjustment fan speed reduction unit improves rotation speed of the fan, when noise is not higher than 15 decibels, can the video card DIE Temperature be controlled at below 75 ℃.
Embodiment 4:
Fig. 8, Fig. 9 are minitype high-performance computing machine plane and the perspective view that the utility model wind guide and heat dispersion devices have been installed.
This cabinet is minitype vertical type, horizontal general use structure; The configuration maximum power dissipation is that 4 nuclear CPU and the maximum power dissipation of 95W is the high-end video card of 125W; Chassis power supply is the active high-effect power supply of rated power 300W, and in order to reduce the cabinet height, power supply adopts nonstandard collimation to advance the form that directly goes out; Power supply fan and cabinet auxiliary blower are the 120mm bore and side is put; Angle between fan and the base plate is 45 °, and the heating radiator of mounting strap heat pipe and corresponding wind guide and heat dispersion device together insert the fan speed reduction unit with power supply fan electric wire and VGA COOLER electric wire on CPU and video card.
Heat radiation process: (1) the first half: cold air gets into from case backboard air intake vent 110; Get into wind guide and heat dispersion device 120 through mainboard north bridge heating radiator 104 tops; By CPU radiating fin 103 heating, extracted out outside the cabinet by power supply fan 101 then, wherein the power supply heat sinking sheet is below the fan of side; (2) the latter half: cold air gets into from backboard air intake vent 210, through the front portion 220 of video card surface entering wind guide and heat dispersion device, is discharged from VGA COOLER 201 by video card heat radiator 203 heating backs.
This machine is through test, when room temperature is 25 ℃, adjustment fan speed reduction unit to noise less than 5 decibels; During underload work; About 40 ℃ of core cpu temperature, about 48 ℃ of video card DIE Temperature, during the full load pressure test, about 61 ℃ of core cpu temperature, about 78 ℃ of video card DIE Temperature; All below 40 ℃, the heat radiation situation is normal for other device DIE Temperatures.When room temperature is 35 ℃, less than 20 decibels, the video card DIE Temperature is lower than 75 ℃ to adjustment fan speed reduction unit during the full load pressure test to noise.
The characteristics of this computing machine are that Hardware configuration is high, cost is low, ultra-low noise, small-sized, in light weight, can be placed in knapsack or the handbag and carry, can be placed on below the desk of relative closure or have only in the cabinet for TV of front openings.
Several kinds of computing machine exemplary embodiments that the utility model wind guide and heat dispersion devices are installed more than are provided; But the utility model method is not limited to described these several kinds of schemes of embodiment, the protection domain that all various improvement of being done based on the utility model wind guide and heat dispersion method or modification all belong to the utility model claim.
Claims (9)
1. computing machine wind guide and heat dispersion device; It is characterized in that: be a kind of air ducting that is installed in the computing machine; Be the taper ventiduct in the middle of the air ducting, two ends are respectively heavy caliber district and small-bore district, and radiator fan is installed in air ducting heavy caliber district; And the radiator fan bore is greater than small-bore district bore, and the heat radiator on euthermic chip or its heating radiator is installed in the small-bore district of air ducting.
2. computing machine wind guide and heat dispersion device as claimed in claim 1 is characterized in that: radiator fan closely is embedded in the wind guide and heat dispersion device heavy caliber district.
3. computing machine wind guide and heat dispersion device as claimed in claim 1 is characterized in that: radiator fan is close to the port outside, air ducting heavy caliber district.
4. computing machine wind guide and heat dispersion device as claimed in claim 1 is characterized in that: with the small-bore district of air ducting port outside mask above euthermic chip in 20 millimeters.
5. computing machine wind guide and heat dispersion device as claimed in claim 1 is characterized in that: with the small-bore district of air ducting port outside mask above the heat radiator of euthermic chip heating radiator in 20 millimeters.
6. computing machine wind guide and heat dispersion device as claimed in claim 1 is characterized in that: adopt a kind of heating radiator with heat pipe, heat radiator closely is embedded in the small-bore district of air ducting.
7. computing machine wind guide and heat dispersion device as claimed in claim 1 is characterized in that: one or more groups heat radiator of air ducting band.
8. computing machine wind guide and heat dispersion device as claimed in claim 1 is characterized in that: one or more taper ventiducts are arranged in the air ducting.
9. computing machine wind guide and heat dispersion device as claimed in claim 1 is characterized in that: corresponding one or more air ductings on one group of heat radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205104333U CN202372911U (en) | 2011-12-08 | 2011-12-08 | Air deflecting and radiating device for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205104333U CN202372911U (en) | 2011-12-08 | 2011-12-08 | Air deflecting and radiating device for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202372911U true CN202372911U (en) | 2012-08-08 |
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ID=46596608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205104333U Expired - Fee Related CN202372911U (en) | 2011-12-08 | 2011-12-08 | Air deflecting and radiating device for computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202372911U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106547327A (en) * | 2016-11-07 | 2017-03-29 | 湖南文理学院 | The cooling device of Based Intelligent Control cabinet |
| WO2018032493A1 (en) * | 2016-08-19 | 2018-02-22 | 深圳市赛亿科技开发有限公司 | Chip heat dissipation apparatus and electronic device |
-
2011
- 2011-12-08 CN CN2011205104333U patent/CN202372911U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018032493A1 (en) * | 2016-08-19 | 2018-02-22 | 深圳市赛亿科技开发有限公司 | Chip heat dissipation apparatus and electronic device |
| CN108141987A (en) * | 2016-08-19 | 2018-06-08 | 深圳市赛亿科技开发有限公司 | Chip heat radiator and electronic equipment |
| CN106547327A (en) * | 2016-11-07 | 2017-03-29 | 湖南文理学院 | The cooling device of Based Intelligent Control cabinet |
| CN106547327B (en) * | 2016-11-07 | 2019-03-12 | 湖南文理学院 | The cooling device of intelligent control cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120808 Termination date: 20121208 |