CN202310317U - SMT substrate mounting device - Google Patents
SMT substrate mounting device Download PDFInfo
- Publication number
- CN202310317U CN202310317U CN201120429844XU CN201120429844U CN202310317U CN 202310317 U CN202310317 U CN 202310317U CN 201120429844X U CN201120429844X U CN 201120429844XU CN 201120429844 U CN201120429844 U CN 201120429844U CN 202310317 U CN202310317 U CN 202310317U
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- CN
- China
- Prior art keywords
- air
- mounting device
- substrate
- smt
- substrate mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an SMT substrate mounting device and belongs to the field of circuit board mounting. The SMT substrate mounting device comprises an automatic conveyor and a conveyer belt mated therewith. A printing machine, a chip mounter and a backflow furnace are successively arranged along the direction of the conveyer belt. A blowing structure is arranged on the inlet of the printing machine for cleaning a substrate. The blowing structure comprises a blowing pipe and air nozzles. The air intake of the blowing pipe is connected with an inflator. The plurality of air nozzles are disposed under the blowing pipe, and the included angle between the air outlet direction of each air nozzle and the substrate on the conveyer belt is 45 degrees. As compared with a conventional SMT substrate mounting production line, a substrate cleaning machine is avoided, so that the SMT substrate mounting device of the utility model is of a simple structure, enables the cost to be saved, etc.
Description
Technical field
The utility model discloses a kind of SMT substrate mounting device, belongs to the SMT substrate by International Patent Classification (IPC) (IPC) division and mounts the field, especially relates to a kind of cost-effective SMT substrate mounting device.
Background technology
Existing SMT production line workflow is generally: substrate autotransmitter-substrate cleaning machine-printing machine-paster-reflow ovens-finished product; Mount in the production line at existing SMT substrate; The substrate cleaning machine is the equipment in its link, and it is higher to cause the SMT substrate to mount cost.If no base plate cleaning device, then possibly cause again and speckle with dust on the substrate, cause in the follow-up printing process scolding tin not firm, thereby cause the raising of product fraction defective.
Summary of the invention
Mount the higher shortcoming of cost in order to overcome the SMT substrate, the utility model provides a kind of SMT substrate mounting device, and it has solved existing shortcoming, can well reach the saving cost.
Therefore, the utility model adopts following technical scheme:
A kind of SMT substrate mounting device comprises autotransmitter and the conveyer belt that matches, and is provided with printing machine, chip mounter and reflow ovens successively along belt direction, and described printing machine porch is installed jet structure and is used for cleaning base plate.Comprise autotransmitter and the conveyer belt that matches; Be provided with printing machine, chip mounter and reflow ovens successively along belt direction; Described printing machine porch is installed jet structure and is used for cleaning base plate; Jet structure comprises air jet pipe and air nozzle, and the air jet pipe air inlet links to each other with air compressor machine, the gas outlet that air jet pipe below is provided with some air nozzles and air nozzle along to conveyer belt on the substrate angle be 45 degree.
Description of drawings
Fig. 1 the utility model production line flow chart;
The jet structural representation of Fig. 2 the utility model.
Embodiment
Embodiment: a kind of SMT substrate mounting device; Like Fig. 1, shown in 2; The conveyer belt 11 that comprises autotransmitter 1 and match is provided with printing machine 2, chip mounter 3 and reflow ovens 4 successively along belt direction, and described printing machine 2 porch are installed jet structure 5 and are used for cleaning base plate.Said jet structure 5 comprises air jet pipe 51 and air nozzle 52.Wherein air jet pipe 51 can be circular or square air jet pipe, and some air nozzles 52 are arranged in air jet pipe 51 belows.
Jet structure 5 purposes carry out substrate is cleaned in order to reach before substrate gets into printing machine.This structure is the gases at high pressure that utilize in the existing air compressor machine in workshop, gases at high pressure through air jet pipe 51 and with air nozzle 52, and the gas outlet of air nozzle 52 along to conveyer belt 11 on the substrate P angle be 45 degree, reached the purpose of cleaning.
The above is merely the utility model than embodiment, and anyly be familiar with this art utilization plate creation institute and do to such an extent that modify and variation, claims of the utility model all, and be not limited to embodiment announcement person.
Claims (3)
1. SMT substrate mounting device; It is characterized in that: comprise autotransmitter and the used for conveyer belt that matches in conveying substrate; Be provided with printing machine, chip mounter and reflow ovens successively along belt direction, the conveyer belt top before the described printing machine is provided with jet structure and is used for cleaning base plate.
2. a kind of SMT substrate mounting device according to claim 1; It is characterized in that: described jet structure is installed on the porch of printing machine; This jet structure comprises air jet pipe and air nozzle, and the air jet pipe air inlet links to each other with air compressor machine, and the air jet pipe below is provided with some air nozzles.
3. a kind of SMT substrate mounting device according to claim 2 is characterized in that: the gas outlet of said air nozzle along to conveyer belt on the substrate angle be 45 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120429844XU CN202310317U (en) | 2011-11-03 | 2011-11-03 | SMT substrate mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120429844XU CN202310317U (en) | 2011-11-03 | 2011-11-03 | SMT substrate mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202310317U true CN202310317U (en) | 2012-07-04 |
Family
ID=46379123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120429844XU Expired - Fee Related CN202310317U (en) | 2011-11-03 | 2011-11-03 | SMT substrate mounting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202310317U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106391580A (en) * | 2016-09-26 | 2017-02-15 | 东莞华贝电子科技有限公司 | Air blowing device used on SMT plate feeding machine |
| CN112053819A (en) * | 2020-09-02 | 2020-12-08 | 杭州瞳阳科技有限公司 | Production line based on paster electronic components |
-
2011
- 2011-11-03 CN CN201120429844XU patent/CN202310317U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106391580A (en) * | 2016-09-26 | 2017-02-15 | 东莞华贝电子科技有限公司 | Air blowing device used on SMT plate feeding machine |
| CN112053819A (en) * | 2020-09-02 | 2020-12-08 | 杭州瞳阳科技有限公司 | Production line based on paster electronic components |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20151103 |
|
| EXPY | Termination of patent right or utility model |