CN202282456U - Three-dimensional circuit structure - Google Patents
Three-dimensional circuit structure Download PDFInfo
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- CN202282456U CN202282456U CN2011203361770U CN201120336177U CN202282456U CN 202282456 U CN202282456 U CN 202282456U CN 2011203361770 U CN2011203361770 U CN 2011203361770U CN 201120336177 U CN201120336177 U CN 201120336177U CN 202282456 U CN202282456 U CN 202282456U
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Abstract
The utility model discloses a three-dimensional circuit structure which comprises a base material with a predetermined three-dimensional structure, a sputtering coating circuit base layer formed on the surface of the base material, and a metal thickening layer formed on the sputtering coating circuit base layer and allowing the sputtering coating circuit base layer to be thickened to a predetermined thickness, wherein, the wire diameter width of the sputtering coating circuit base layer is integral and provided with a predetermined three-dimensional picture; and the sputtering coating circuit base layer with the predetermined three-dimensional picture can serve as an antenna structure. According to the utility model, the production method adopting the three-dimensional circuit structure is not limited to a specific material and the equipment of single equipment supplier; the circuit quality is improved, and the high-cost problem is solved; and accordingly, the yield of conduction through holes is improved.
Description
Technical field
The utility model is about a kind of metallic circuit structure, particularly about a kind of three-dimensional line line structure.
Background technology
Laser straight forming (Laser Direct Structuring; LDS); It is 3D-MID (the Three-dimensional moulded interconnect device) production technology of a kind of professional laser processing, ejaculation and the electroplating process that develop out by German LPKF D. O. O.; Its principle is common plastic assembly/circuit board to be given functions such as electric interconnection function, the support of supporting components and parts function and plastic casing, protection; And combine with conductive pattern and functions such as the shielding that produces, antenna are incorporated into one by mechanical entities, form so-called 3D-MID, be applicable to that IC plate, HDI PCB, the local fine rule of lead frame road make.The LDS manufacturing technology is after accepting the digital circuit data through the laser board, with the anti-etching resistance agent of PCB surface tin burn off, imposes plated metalization afterwards again, can produce the circuit of metal material at frosting.
With reference to figure 1～Fig. 2, it shows the shortcoming sketch map of thunder carving circuit respectively.For example shown in Figure 1; Utilize the LDS processing procedure at a base material 11 formed laser active layers 12; Because the zone of part does not receive the laser priming reaction fully; And produce uneven phenomenon (dotted portion is desirable line width), and therefore possibly produce the phenomenon of jumping plating, will badly influence the overall efficiency of circuit.In addition, as shown in Figure 2, when some offers on the base material 11 of perforation with laser L activation; Because the factor affecting such as angle of the size of perforation, shape, laser; Possibly in hole wall, can't receive the laser activation fully in the subregion, and then the laser active layer 12 of above and below is not connected, or few part contact is only arranged; Possibly have influence on the overall efficiency of circuit, and must cooperation offer the bigger perforation in aperture.The shortcoming of above-mentioned thunder carving line construction is still this field manufacturing antenna or other conducting wire is demanded improvements urgently.
Vacuum splashing and plating (Vacuum Sputtering) be a kind of on base material the technology of deposit film, its principle is in vacuum cavity, to produce the electricity slurry and speeding-up ion (argon) bombardment solid (copper) with electrion in minimum gas (being generally argon gas).In the sputter process, with cathode assembly target (film material that will plate, the material of pen electricity is copper and stainless steel); And load thing to be plated (like plastic plate) on the anode, and negative electrode is added to hundreds of volts, negative electrode institute making alive phase antianode is for negative; Thereby free argon ion will be with high-speed impact " target "; The particle that it is surperficial is got, and this process is called sputter (Sputtering), deposits on the base material (plastic casing of pen electricity) that is plated again; Form the film of one deck metalloid, make the cabinet outside have the layer of metal film.Generally speaking, vacuum splashing and plating has unrestricted, the membranous density of base material kind metal film, the speed of response high, that can make thinner thickness and meets plurality of advantages such as environmental protection demand soon and.
The utility model content
Except above-mentioned shortcoming about thunder carving line construction; The LDS processing procedure must use specific materials (chemical Coupling material) and single equipment supplier's equipment (LPKF D. O. O.); Except selectivity was few, cost height and line quality are not good etc. all was to demand improved problem urgently.
Therefore, a purpose of the utility model promptly provides a kind of three-dimensional line line structure, has the complete and perforation aperture features of smaller of line footpath width.
The utility model is a kind of three-dimensional line line structure for solving the technological means that prior art problems adopted.
In an embodiment of the utility model, the three-dimensional line line structure comprises: a base material, this base material have a predetermined spatial configuration; One sputter circuit basic unit is formed at the surface of this base material, and wherein the line of this sputter circuit basic unit footpath width is complete and have a predetermined three-dimensional figure; One metal thickening layer is formed in this sputter circuit basic unit, and this sputter circuit basic unit is thickened to a predetermined thickness; Wherein this sputter circuit basic unit with predetermined three-dimensional figure can be used as an antenna structure.
Preferably, the base material of above-mentioned three-dimensional line line structure is a plastic casing.
Preferably, the base material of above-mentioned three-dimensional line line structure more comprises and offers at least one perforation.
Preferably, the aperture of the perforation of above-mentioned three-dimensional line line structure is not less than 0.1mm.
Preferably, the sputter circuit basic unit of above-mentioned three-dimensional line line structure to thicken at least be 0.5 μ m.
Preferably, the metal thickening layer of above-mentioned three-dimensional line line structure is copper or silver.
Preferably, the substrate surface of above-mentioned three-dimensional line line structure more comprises and is formed with a protective layer.
Via the technological means that the utility model adopted, need not must use the materials and the equipment of LPKF D. O. O. like the manufacturing of traditional LDS MID antenna.And the manufacturing approach of the utility model can be used general plastic material, need not be subject to specific materials and single equipment supplier's equipment, and can improve line quality and the too high problem of cost, and the yield that improves the conducting perforation.
Description of drawings
Fig. 1～Fig. 2 is the shortcoming sketch map that shows thunder carving line construction;
Fig. 3 shows the flow chart of steps of making three-dimensional circuit;
Fig. 4 is the stereogram that shows the three-dimensional line line structure;
Fig. 5 is the cutaway view that shows the three-dimensional line line structure;
Fig. 6 shows that the utility model is applied to the sketch map of conducting perforation.
Embodiment
Embodiment 1: the three-dimensional line line structure
With reference to figure 3, it is to show the flow chart of steps of making the three-dimensional line line structure, and its step comprises:
Step 201: a base material is provided, and this base material has a predetermined spatial configuration.This base material can be the base material of any kind of; It for example can be a kind of plastic casing (for example mobile phone shell part) with three-dimensional configuration; For example it has certain length, width, highly; Or have architectural features such as specific recess, protuberance, and desire on its three-dimensional configuration, to form circuit with specific three dimensional figure.
Step 202: form a sputter circuit basic unit at this substrate surface, wherein the line of this sputter circuit basic unit footpath width is complete and have a predetermined three-dimensional figure.Described predetermined three-dimensional figure can be the antenna structure of design as mobile phone, and the sputter circuit basic unit kind of vacuum splashing and plating can be copper or silver.
Step 203: in this sputter circuit basic unit, form a metal thickening layer, this sputter circuit basic unit is thickened to a predetermined thickness.In this step, electroless plating method capable of using, and the metal that carries out chemical plating is preferably copper, it is 0.5 μ m that the thickness that thickens thickens at least, the visual demand of its thickness and adjusting.
Step 204: form a protective layer at this substrate surface.This protective layer is preferably transparent material, and has the material of isolated effect and low electrical conductivity characteristic.
With reference to figure 4～Fig. 5, it shows the stereogram and the cutaway view of three-dimensional line line structure respectively.According to above-mentioned manufacturing approach made three-dimensional line line structure 200a, it comprises: a base material 21, a sputter circuit basic unit 22, a metal thickening layer 23 and a protective layer 24.With shown in Figure 4 is example, the mobile phone shell part of base material 21 for having three-dimensional configuration.And sputter circuit basic unit 22 is the surfaces that are formed at base material 21 with vacuum splashing and plating, and the material of sputter circuit basic unit 22 can be silver or copper, and the line of sputter circuit basic unit 22 footpath width is complete and have a predetermined three-dimensional figure, can be used as the antenna structure that mobile phone uses.Metal thickening layer 23 is to thicken to sputter circuit basic unit 22 with chemical plating, and sputter circuit basic unit 22 is thickened to a predetermined thickness, and for example thickening at least is 0.5 μ m, however the visual demand of its thickness and adjusting.Protective layer 24 is preferably transparent material, and has the material of isolated effect and low electrical conductivity characteristic.In the present embodiment, the stereochemical structure of base material, material, and the 3-D graphic of sputter circuit basic unit is merely example, is not limited only to this, comprises also can optionally determining of protective layer.In fact be applied to the antenna of different types of portable electronic devices, still can optionally make different designs and change.
With reference to figure 6, it is to show that the utility model three-dimensional line line structure is applied to the sketch map of conducting perforation.Shortcoming compared to thunder carving line construction shown in Figure 2; Three-dimensional line line structure 200b is in an embodiment of the base material that offers perforation 25 21; Directly the conducting perforation 25; The sputter circuit basic unit 22 of above and below is connected by the metal thickening layer 23 that chemical plating forms, utilizes these characteristics can make the minimum essential requirement of the aperture D of perforation 25 can reach 0.1mm, this also is the characteristics that prior art did not have.
Can know by above embodiment; Value on the true tool industry of the three-dimensional line line structure that the utility model provided; Only above narration is merely the preferred embodiment explanation of the utility model; All those of ordinary skill in the art are when doing other all improvement according to above-mentioned explanation, and only these changes still belong in the spirit and the following claim that defines of the utility model.
Claims (7)
1. a three-dimensional line line structure is characterized in that, this three-dimensional line line structure comprises:
One base material, this base material have a predetermined spatial configuration;
One sputter circuit basic unit is formed at the surface of this base material, and wherein the line of this sputter circuit basic unit footpath width is complete and have a predetermined three-dimensional figure;
One metal thickening layer is formed in this sputter circuit basic unit, and this sputter circuit basic unit is thickened to a predetermined thickness;
Wherein this sputter circuit basic unit with predetermined three-dimensional figure can be used as an antenna structure.
2. three-dimensional line line structure as claimed in claim 1 is characterized in that, this base material is a plastic casing.
3. three-dimensional line line structure as claimed in claim 1 is characterized in that, this base material more comprises and offers at least one perforation.
4. three-dimensional line line structure as claimed in claim 3 is characterized in that the aperture of this perforation is not less than 0.1mm.
5. three-dimensional line line structure as claimed in claim 1 is characterized in that, it is 0.5 μ m that this sputter circuit basic unit thickens at least.
6. three-dimensional line line structure as claimed in claim 1 is characterized in that, this metal thickening layer is copper or silver.
7. three-dimensional line line structure as claimed in claim 1 is characterized in that, this substrate surface more comprises and is formed with a protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203361770U CN202282456U (en) | 2011-09-08 | 2011-09-08 | Three-dimensional circuit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203361770U CN202282456U (en) | 2011-09-08 | 2011-09-08 | Three-dimensional circuit structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202282456U true CN202282456U (en) | 2012-06-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203361770U Expired - Fee Related CN202282456U (en) | 2011-09-08 | 2011-09-08 | Three-dimensional circuit structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202282456U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106159423A (en) * | 2016-08-05 | 2016-11-23 | 上海睿通机器人自动化股份有限公司 | A kind of integration anti-interference closing electric wire and preparation method thereof |
-
2011
- 2011-09-08 CN CN2011203361770U patent/CN202282456U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106159423A (en) * | 2016-08-05 | 2016-11-23 | 上海睿通机器人自动化股份有限公司 | A kind of integration anti-interference closing electric wire and preparation method thereof |
| CN106159423B (en) * | 2016-08-05 | 2024-04-05 | 上海睿通机器人自动化股份有限公司 | Integrated anti-interference closed wire and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120620 Termination date: 20150908 |
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| EXPY | Termination of patent right or utility model |