CN202282206U - NTC (Negative Temperature Coefficient) thermistor - Google Patents
NTC (Negative Temperature Coefficient) thermistor Download PDFInfo
- Publication number
- CN202282206U CN202282206U CN2011203504774U CN201120350477U CN202282206U CN 202282206 U CN202282206 U CN 202282206U CN 2011203504774 U CN2011203504774 U CN 2011203504774U CN 201120350477 U CN201120350477 U CN 201120350477U CN 202282206 U CN202282206 U CN 202282206U
- Authority
- CN
- China
- Prior art keywords
- layer
- ntc
- ceramic layer
- pins
- thermistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Thermistors And Varistors (AREA)
Abstract
The utility model discloses an NTC (Negative Temperature Coefficient) thermistor, which comprises an NTC resistance chip and a protecting layer, wherein two pins are connected onto the NTC resistance chip, the NTC resistance chip is coated in the middle of the protecting layer, the two pins extend out of the protecting layer, a ceramic layer is packaged on the outer surface of the protecting layer, the two pins are kept to extend out of the ceramic layer, and the ceramic layer is an alumina ceramic layer or an aluminum-nitride ceramic layer; the protecting layer is preferably a silicon-resin material layer; the packaged ceramic layer is further preferably square or round; and through the NTC thermistor, the absorbing capability of surge current can be greatly improved, and the performance-price ratio is high.
Description
Technical field
The utility model relates to the semiconductor component technology field, especially a kind of NTC thermistor.
Background technology
In the semiconductor component technology field, negative tempperature coefficient thermistor is the NTC thermistor, and its resistance raises with temperature and reduces; In circuit application; It can suppress the surge current in the circuit through the mode that surge current is converted into heat, after it has absorbed a certain amount of surge current and has converted heat into, because temperature raises; Resistance descends, and will lose the absorbability of surge current.
Improve the surge current absorbability of NTC thermistor; Will make the NTC thermistor can absorb more heat, and make the rising of its temperature slack-off, the heat that the NTC thermistor absorbs can use formula: W=m * C * Δ T to represent; Wherein W is a heat; M is a quality, and C is a specific heat, and Δ T is the temperature change amount; Can judge through formula; For improving the caloric receptivity before the NTC thermistor lost efficacy; Need improve the quality m and the specific heat C of NTC thermistor as far as possible, improve NTC thermistor surge current absorbability with the quality that increases the NTC thermistor and be easier to realize, better simply way is the size that increases product; But increase product size and can significantly improve material cost, reduce the competitiveness in market.
The utility model content
The technical problem that the utility model will solve provides a kind of NTC thermistor, can increase substantially the absorbability of surge current, and cost performance is high.
For achieving the above object, the technical scheme of the utility model is: a kind of NTC thermistor comprises NTC resistance chip, protective layer; Connect two pins on the NTC resistance chip; NTC resistance chip is coated on the centre of protective layer, and two pins stretch out outside the protective layer, outer surface encapsulation one deck ceramic layer of protective layer; Keep two pins to stretch out outside the ceramic layer, described ceramic layer is aluminium oxide ceramics layer or aluminium nitride ceramics layer.
Preferred described protective layer is the silicone material layer, and material cost is less.
The profile of preferred said encapsulation back ceramic layer is square or circular, the convenient manufacturing.
The utility model is at the outer surface encapsulation one deck aluminium oxide ceramics layer or the aluminium nitride ceramics layer of chip protection layer; Because of aluminium oxide ceramics layer or aluminium nitride ceramics layer have the advantages that specific heat is big, heat conduction is fast; The heat that it can the fast Absorption chip produces distributes to the external world; The speed that chip heats up is reduced greatly, improve the absorbability of NTC resistance surge current.
On the other hand, aluminium oxide ceramics layer or aluminium nitride ceramics layer low price are suitable as outer field heat-absorbing material very much; Be encapsulated in outside the protective layer with aluminium oxide ceramics layer or aluminium nitride ceramics layer; The cost that increases is less, and cost performance is high, helps improving the market competitiveness.
Description of drawings
Fig. 1 is the utility model front view.
Fig. 2 is the A-A cutaway view of Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and concrete execution mode the utility model is done further explain.
Fig. 1, shown in Figure 2, a kind of NTC thermistor comprises NTC resistance chip 1, protective layer 2; Connect two pins 3,4 on the NTC resistance chip 1; NTC resistance chip 1 is coated on the centre of protective layer 2, and two pins 3,4 stretch out outside the protective layer 2, encapsulates one deck ceramic layer 5 again at the outer surface of protective layer 2; Keep two pins 3,4 to stretch out outside the ceramic layer 5, described ceramic layer 5 can be selected aluminium oxide ceramics layer or aluminium nitride ceramics layer for use.
The profile of the ceramic layer 5 after the encapsulation is square, also can be circle, same convenient the manufacturing.
The encapsulation process of the utility model does; Make earlier a square aluminium oxide or aluminium nitride ceramics box and aluminium oxide or aluminium nitride ceramics lid; Put into box body to the NTC resistance that has protective layer; Re-use aluminium oxide or aluminium nitride coating fills up box body, cover aluminium oxide or aluminium nitride ceramics lid, can accomplish encapsulation after the curing.
Below only be preferred embodiment of the utility model, the change that those skilled in the art does to be equal to by claim all falls into the protection range of this case.
Claims (3)
1. NTC thermistor; Comprise NTC resistance chip, protective layer, connect two pins on the NTC resistance chip, NTC resistance chip is coated on the centre of protective layer; Two pins stretch out outside the protective layer; It is characterized in that: outer surface encapsulation one deck ceramic layer of protective layer, keep two pins to stretch out outside the ceramic layer, described ceramic layer is aluminium oxide ceramics layer or aluminium nitride ceramics layer.
2. a kind of NTC thermistor according to claim 1 is characterized in that: described protective layer is the silicone material layer.
3. a kind of NTC thermistor according to claim 1 and 2 is characterized in that: the profile of said encapsulation back ceramic layer is square or circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203504774U CN202282206U (en) | 2011-09-19 | 2011-09-19 | NTC (Negative Temperature Coefficient) thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203504774U CN202282206U (en) | 2011-09-19 | 2011-09-19 | NTC (Negative Temperature Coefficient) thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202282206U true CN202282206U (en) | 2012-06-20 |
Family
ID=46228363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203504774U Expired - Fee Related CN202282206U (en) | 2011-09-19 | 2011-09-19 | NTC (Negative Temperature Coefficient) thermistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202282206U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111863363A (en) * | 2020-06-03 | 2020-10-30 | 中科立民新材料（扬州）有限公司 | Packaging method of high-temperature thermistor, packaged resistor and application of packaged resistor |
| CN112768241A (en) * | 2020-12-22 | 2021-05-07 | 马鞍山蒹葭电子科技有限公司 | Salt-fog corrosion resistant metallized film capacitor |
| CN115240935A (en) * | 2022-07-27 | 2022-10-25 | 成都顺康三森电子有限责任公司 | NTC element composition with high surge current resistance and preparation method thereof |
-
2011
- 2011-09-19 CN CN2011203504774U patent/CN202282206U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111863363A (en) * | 2020-06-03 | 2020-10-30 | 中科立民新材料（扬州）有限公司 | Packaging method of high-temperature thermistor, packaged resistor and application of packaged resistor |
| CN111863363B (en) * | 2020-06-03 | 2023-02-17 | 中科立民新材料（扬州）有限公司 | Packaging method of high-temperature thermistor, packaged resistor and application of packaged resistor |
| CN112768241A (en) * | 2020-12-22 | 2021-05-07 | 马鞍山蒹葭电子科技有限公司 | Salt-fog corrosion resistant metallized film capacitor |
| CN115240935A (en) * | 2022-07-27 | 2022-10-25 | 成都顺康三森电子有限责任公司 | NTC element composition with high surge current resistance and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202282206U (en) | NTC (Negative Temperature Coefficient) thermistor | |
| JP2012505299A5 (en) | ||
| SG158878A1 (en) | Epoxy resin composition, method of rendering the same latent, and semiconductor device | |
| CN204375722U (en) | A kind of semiconductor package | |
| CN108728046A (en) | A kind of heat conduction heat accumulation composite material and preparation method, heat conduction heat accumulation radiator | |
| WO2014132197A3 (en) | Integrated photovoltaic and thermal module (pvt) | |
| CN204497217U (en) | With the power switch component of radiator | |
| CN208061843U (en) | A kind of Novel reactor encapsulating device | |
| CN103151323A (en) | Flip packaging structure based on anisotropy conductive glue | |
| CN203951518U (en) | A kind of mobile phone shell of lowering the temperature | |
| CN204335251U (en) | High performance components decalescence structure | |
| CN204994196U (en) | A thermal -insulated membrane of heat dissipation and heat radiation structure for electronic components | |
| CN105977227B (en) | A kind of integrated antenna package of composite substrate | |
| CN104582432A (en) | High-power component phase change heat adsorption structure | |
| CN104882234B (en) | Three-dimensional net structure power resistor and its processing technology | |
| CN102709257B (en) | Semiconductor plastic package material and manufacture method thereof and semiconductor package part | |
| CN203707259U (en) | Thermal battery | |
| CN202759725U (en) | Digit television set STB heat dissipation box | |
| CN205508811U (en) | Surface mounting power device packaging structure of high heat dissipating ability | |
| CN108292635A (en) | Electric equipment with encapsulating shell | |
| CN207602545U (en) | A kind of chip upside-down mounting type filter package structure | |
| CN202633373U (en) | LED packaging device having local isolating structure | |
| CN205179620U (en) | Heat conduction aluminium foil | |
| CN208548347U (en) | Insulating radiation encapsulating structure based on TO-220 | |
| CN202565644U (en) | Radiator and terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120620 Termination date: 20140919 |
|
| EXPY | Termination of patent right or utility model |