CN202275058U - Discharging device in wafer full-automatic visual inspection machine - Google Patents

Discharging device in wafer full-automatic visual inspection machine Download PDF

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Publication number
CN202275058U
CN202275058U CN 201120386623 CN201120386623U CN202275058U CN 202275058 U CN202275058 U CN 202275058U CN 201120386623 CN201120386623 CN 201120386623 CN 201120386623 U CN201120386623 U CN 201120386623U CN 202275058 U CN202275058 U CN 202275058U
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CN
China
Prior art keywords
visual inspection
discharging device
inspection machine
wafer
transverse arm
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201120386623
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Chinese (zh)
Inventor
王维锐
林斌
陈浙泊
王辉
梅武军
刘木林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Research Institute of Zhejiang University Taizhou
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Research Institute of Zhejiang University Taizhou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN 201120386623 priority Critical patent/CN202275058U/en
Application granted granted Critical
Publication of CN202275058U publication Critical patent/CN202275058U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a discharging device in a wafer full-automatic visual inspection machine, belonging to the technical field of machinery. The utility model solves the technical problem that speed is slow in a manual material taking process in the prior art. In the discharging device of the wafer full-automatic visual inspection machine, the visual inspection machine comprises a rack, the rack is provided with a detection rotary plate and a material receiving box, the material receiving box is arranged at one side of the detection rotary plate, the discharging device comprises a cross arm and a suction head fixedly arranged at one end of the cross arm, the suction head is arranged above the detection rotary plate, a guide mechanism is arranged between the other end of the cross arm and the rack, and the cross arm can drive the suction head to be arranged above the material receiving box by virtue of the guide mechanism. The device provided by the utility model realizes an automatic material taking process by adopting the cross arm and the suction head, qualified or unqualified wafers can be classified and placed at different positions in the material receiving box according to wafer analysis result, and material taking speed is improved.

Description

Discharging device in the full-automatic visual inspection machine of a kind of wafer
Technical field
The utility model belongs to field of mechanical technique, relates to the discharging device in the full-automatic visual inspection machine of a kind of wafer.
Background technology
Crystal resonator is meant the quartz-crystal resonator made from quartz material, is commonly called as crystal oscillator, in electronic equipment, plays the effect that produces frequency, has the characteristics stable, that interference free performance is good, is widely used in the various electronic products.The quartz wafer that uses in the industry is processed through series of processes by quartzy bar dicing again.Because the singularity of service condition; Quartz wafer must satisfy strict quality requirements; Satisfy CF; A certain size breakage of surface: like cut (comprising limit cut and inner cut), slight crack, collapse the limit, collapse the angle, defective such as out-of-shape and surface are dirty, all can directly influence the performance of wafer.Single wafer needs through frequency screening after moulding, carries out the surface again and detects, and just can be used for making crystal resonator.
More present producers have designed some and have been used for some machines of wafer visual inspection; Like the disclosed a kind of wafer appearance detection method of patent (CN101762596A); It may further comprise the steps: it is provided with the transparent load plate of wafer; Through the rotating driving device driven rotary; When wafer rotated to the detection camera place, detection camera detects by predetermined requirement wafer and testing result is reached the host computer analysis judged that wafer is non-defective unit or defective products, and described rotating driving device is according to its start-stop of signal controlling and the rotation of host computer output.Though this device can tentatively screen it, after wafer is to be detected, still be to get material through manual mode, this makes operating rate be restricted.
Summary of the invention
The purpose of the utility model is the problems referred to above that exist to existing technology; Discharging device in the full-automatic visual inspection machine of a kind of wafer is provided, and the utility model technical matters to be solved is according to testing result wafer to be got on from detecting the diverse location that rotating disk takes out and classification is placed in the rewinding box automatically.
The purpose of the utility model can realize through following technical proposal: the discharging device in the full-automatic visual inspection machine of a kind of wafer; This visual inspection machine comprises a frame; Described frame is provided with and detects rotating disk and rewinding box, and described rewinding box is positioned at a side that detects rotating disk, it is characterized in that; This discharging device comprises a transverse arm and the suction nozzle that is installed in this transverse arm one end; Described suction nozzle is positioned at the top of detecting rotating disk, is provided with a guiding mechanism between the other end of described transverse arm and the frame, can make transverse arm drive the top that suction nozzle is positioned at the rewinding box through this guiding mechanism.
The principle of work of this device is following: after wafer is through detection; Detect rotating disk according to certain angular velocity drive wafer move to suction nozzle under; Suction nozzle passes through negative pressure absorption wafer, drives transverse arm then and on guiding mechanism, moves, and transverse arm is through directly over the mobile drive suction nozzle arrival rewinding box; Suction nozzle puts down wafer, and wafer drops in the rewinding box.The structure of transverse arm and suction nozzle that adopts this device realizes the process of automatic material taking, can the wafer of acceptance or rejection be classified according to the analysis result of wafer to be placed on the diverse location in the rewinding box, has improved the speed of getting material.
In the discharging device in the full-automatic visual inspection machine of above-mentioned a kind of wafer, described guiding mechanism comprises the slide rail that is installed on the frame and is positioned at detection rotating disk one side, slidely connects slide block on the described slide rail, and the end of described slide block and transverse arm is connected mutually.Slide block slides on slide rail, the same moved further of transverse arm and slide block.
In the discharging device in the full-automatic visual inspection machine of above-mentioned a kind of wafer, described transverse arm comprises the vertical installing plate and the back up pad of level, and the end of described installing plate and back up pad is connected mutually.
In the discharging device in the full-automatic visual inspection machine of above-mentioned a kind of wafer, described installing plate is provided with several mounting holes.Installing plate passes through the matching and fixing of screw and mounting hole on slide block.
In the discharging device in the full-automatic visual inspection machine of above-mentioned a kind of wafer; Described suction nozzle comprises a suction pipe that is located on the transverse arm end; The upper end of described suction pipe is connected with a pipe adapter, the intracavity inter-connection of described pipe adapter and this suction pipe, and the lower end of this suction pipe has a suction inlet.Pipe adapter connects outside negative pressure source of the gas, when the negative pressure source of the gas starts, makes the suction inlet of the lower end of suction pipe produce suction.
In the discharging device in the full-automatic visual inspection machine of above-mentioned a kind of wafer, described suction inlet flare, and bore outwards increases one by one.This structure helps suction inlet and produces stronger suction.
Compared with prior art, this device adopts the structure of transverse arm and suction nozzle to realize the process of automatic material taking, and can the wafer of acceptance or rejection be classified according to the analysis result of wafer is placed on the diverse location in the rewinding box, has improved the speed of getting material.Suction inlet adopts flared structure, helps suction inlet and produces stronger suction.
Description of drawings
Fig. 1 is the one-piece construction synoptic diagram of visual inspection machine.
Fig. 2 is the structural representation of this discharging device.
Fig. 3 is the structural representation of this suction nozzle.
Among the figure, 1, frame; 2, detect rotating disk; 3, rewinding box; 4, transverse arm; 5, slide rail; 6, slide block; 7, installing plate; 8, back up pad; 9, mounting hole; 10, suction pipe; 11, pipe adapter; 12, suction inlet.
Embodiment
Below be the specific embodiment of the utility model and combine accompanying drawing, the technical scheme of the utility model is done further to describe, but the utility model is not limited to these embodiment.
Like Fig. 1, Fig. 2 and shown in Figure 3; The visual inspection machine comprises a frame 1, and frame 1 is provided with and detects rotating disk 2 and rewinding box 3, and rewinding box 3 is positioned at a side that detects rotating disk 2; This discharging device comprises a transverse arm 4 and the suction nozzle that is installed in these transverse arm 4 one ends; Suction nozzle is positioned at the top of detecting rotating disk 2, is provided with a guiding mechanism between the other end of transverse arm 4 and the frame 1, can make transverse arm 4 drive the top that suction nozzle is positioned at rewinding box 3 through this guiding mechanism.Guiding mechanism comprises the slide rail 5 that is installed on the frame 1 and is positioned at detection rotating disk 2 one sides, slidely connects slide block 6 on the slide rail 5, and slide block 6 is connected with the end of transverse arm 4 mutually.Slide block 6 slides on slide rail 5, transverse arm 4 and slide block 6 same moved further.
Transverse arm 4 comprises the back up pad 8 of vertical installing plate 7 and level, and installing plate 7 is connected with the end of back up pad 8 mutually.Installing plate 7 is provided with several mounting holes 9.The matching and fixing that installing plate 7 passes through screw and mounting hole 9 is on slide block 6.Suction nozzle comprises a suction pipe 10 that is located on transverse arm 4 ends, and the upper end of suction pipe 10 is connected with a pipe adapter 11, the intracavity inter-connection of pipe adapter 11 and this suction pipe 10, and the lower end of this suction pipe 10 has a suction inlet 12.Pipe adapter 11 connects outside negative pressure source of the gas, when the negative pressure source of the gas starts, makes the suction inlet 12 of the lower end of suction pipe 10 produce suction.Suction inlet 12 flares, and bore outwards increases one by one.This structure helps suction inlet 12 and produces stronger suction.
The principle of work of this device is following: after wafer is through detection; Detect rotating disk 2 according to certain angular velocity drive wafer move to suction nozzle under; Suction nozzle passes through negative pressure absorption wafer, drives transverse arm 4 then and on guiding mechanism, moves, and transverse arm 4 is through directly over the mobile drive suction nozzle arrival rewinding box 3; Suction nozzle puts down wafer, and wafer drops in the rewinding box 3.The structure of transverse arm 4 and suction nozzle that adopts this device realizes the process of automatic material taking, can the wafer of acceptance or rejection be classified according to the analysis result of wafer to be placed on the diverse location in the rewinding box 3, has improved the speed of getting material.
Specific embodiment described herein only is that the utility model spirit is illustrated.The utility model person of ordinary skill in the field can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from the spirit of the utility model or surmount the defined scope of appended claims.

Claims (6)

1. the discharging device in the full-automatic visual inspection machine of wafer; This visual inspection machine comprises a frame (1); Described frame (1) is provided with and detects rotating disk (2) and rewinding box (3), and described rewinding box (3) is positioned at a side that detects rotating disk (2), it is characterized in that; This discharging device comprises a transverse arm (4) and is installed in the suction nozzle of these transverse arm (4) one ends; Described suction nozzle is positioned at the top of detecting rotating disk (2), is provided with a guiding mechanism between the other end of described transverse arm (4) and the frame (1), can make transverse arm (4) drive the top that suction nozzle is positioned at rewinding box (3) through this guiding mechanism.
2. the discharging device in the full-automatic visual inspection machine of a kind of wafer according to claim 1; It is characterized in that; Described guiding mechanism comprises the slide rail (5) that is installed on the frame (1) and is positioned at detection rotating disk (2) one sides; Slidely connect slide block (6) on the described slide rail (5), described slide block (6) is connected with the end of transverse arm (4) mutually.
3. the discharging device in the full-automatic visual inspection machine of a kind of wafer according to claim 1 and 2 is characterized in that, described transverse arm (4) comprises the back up pad (8) of vertical installing plate (7) and level, and described installing plate (7) is connected with the end of back up pad (8) mutually.
4. the discharging device in the full-automatic visual inspection machine of a kind of wafer according to claim 3 is characterized in that described installing plate (7) is provided with several mounting holes (9).
5. the discharging device in the full-automatic visual inspection machine of a kind of wafer according to claim 1 and 2; It is characterized in that; Described suction nozzle comprises a suction pipe (10) that is located on transverse arm (4) end; The upper end of described suction pipe (10) is connected with a pipe adapter (11), the intracavity inter-connection of described pipe adapter (11) and this suction pipe (10), and the lower end of this suction pipe (10) has a suction inlet (12).
6. the discharging device in the full-automatic visual inspection machine of a kind of wafer according to claim 5 is characterized in that, described suction inlet (12) flare, and bore outwards increases one by one.
CN 201120386623 2011-10-12 2011-10-12 Discharging device in wafer full-automatic visual inspection machine Expired - Fee Related CN202275058U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201120386623 CN202275058U (en) 2011-10-12 2011-10-12 Discharging device in wafer full-automatic visual inspection machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201120386623 CN202275058U (en) 2011-10-12 2011-10-12 Discharging device in wafer full-automatic visual inspection machine

Publications (1)

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CN202275058U true CN202275058U (en) 2012-06-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103730399A (en) * 2014-01-16 2014-04-16 成都先进功率半导体股份有限公司 Piece drawing device for semiconductor visual inspection machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103730399A (en) * 2014-01-16 2014-04-16 成都先进功率半导体股份有限公司 Piece drawing device for semiconductor visual inspection machine

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C14 Grant of patent or utility model
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120613

Termination date: 20141012

EXPY Termination of patent right or utility model