CN202205717U

CN202205717U - Wafer cooling device

Info

Publication number: CN202205717U
Application number: CN2011202999036U
Authority: CN
Inventors: 刘畅; 郝静安
Original assignee: Semiconductor Manufacturing International Shanghai Corp
Current assignee: Semiconductor Manufacturing International Beijing Corp
Priority date: 2011-08-17
Filing date: 2011-08-17
Publication date: 2012-04-25
Anticipated expiration: 2021-08-17

Abstract

The utility model provides a wafer cooling device used for cooling wafers, comprising a support, a uniform stream plate fixed on the support and located above a wafer, a gas blowing element fixed on the support and located above the uniform stream plate. The wafer cooling device is provided with the gas blowing element which blows gas to the wafer, which not only can avoid residual moisture on the surface after the wafer is cooled, but also can minimize wafer cooling time and raise wafer cooling efficiency; moreover, the uniform stream plate arranged below the gas blowing element can uniform the intensity of air-flow blown to the wafer surface so as to furthermore uniformly cool the wafer.

Description

A kind of wafer cooling device

Technical field

The utility model relates to integrated circuit and makes the field, relates in particular to a kind of wafer cooling device.

Background technology

In production process of semiconductor device, photoetching is one of most crucial steps wherein.Generally speaking; In the process of photoetching, generally include following steps: at first, carry out cleaning, drying to wafer; The temperature that wafer is baked and banked up with earth reaches 100 degrees centigrade usually; Removing the moisture of crystal column surface, with the photoresist (photoresist is called for short PR) that improves follow-up formation adhesion with crystal column surface; Afterwards, spare glue (also claiming gluing) on the surface of wafer and handle, the photoresist of liquid state is dropped in the center of wafer, make the chuck high speed rotating then, photoresist spreads apart under action of centrifugal force, thereby covers crystal column surface equably.

Yet,, also can influence the effect of developing process simultaneously because temperature can influence the viscosity and the thickness of photoresist; For this reason; Present most photoetching process all is made up of following steps: at first, carry out the process for cooling first time, before sparing the glue processing, need wafer be cooled off; Be to reach a predetermined temperature before, guarantee can not influence the effect of even glue in order to make wafer spare adhesive process; Then, spare adhesive process, bake and bank up with earth after the even adhesive process, make the most of solvent evaporation in the photoresist; Afterwards, carry out process for cooling again one time, make even glue wafer afterwards remain on predetermined temperature (generally being ambient temperature), to prevent that high temperature from can quicken chemical reaction and causing development (Over Develop); Subsequently, carry out developing process again, with the design transfer on the mask to photoresist.

In above-mentioned photoetching process, relate to process twice with the wafer cooling, general, normally be divided into two stages in this cooling procedure: at first be that wafer is placed on natural cooling in the air, and then in the further accurately cooling of control of the enterprising row of coldplate.But when wafer was placed in the air natural cooling, because the initial temperature of wafer is higher, whole cooling rate was slow, needed the long time of cost, and cooling effectiveness is lower, causes this process for cooling to become the bottleneck of photoetching productive rate.In addition, in air during natural cooling, the easy residual moisture of said crystal column surface, thus influence follow-up technology.

The utility model content

The purpose of the utility model is to provide a kind of wafer cooling device, the slow problem of cooling rate that occurs when solve adopting natural cooling in the air, and can avoid remained on surface moisture after the wafer cooling.

For addressing the above problem, the utility model provides a kind of wafer cooling device, comprising: support; Even flow plate is fixed on the said support, and is positioned at the top of said wafer; Gas winding-up element is fixed on the said support, and is positioned at the top of said even flow plate.

Preferably, in described wafer cooling device, the shape of said even flow plate and said wafer coupling.

Preferably, in described wafer cooling device, said even flow plate is rounded.

Preferably, in described wafer cooling device, be evenly distributed with hole on the said even flow plate, the diameter of the hole in said even flow plate centre is less than the diameter of the hole of edge.

Preferably, in described wafer cooling device, described hole be shaped as circle.

Preferably, in described wafer cooling device, also comprise gas supply unit, said gas supply unit is connected with said gas winding-up element.

Owing to adopted above technical scheme, the utlity model has following beneficial effect:

The wafer cooling device that the utility model provides is jetted element to the wafer blowing gas through the gas of setting up, and has not only avoided wafer cooling remained on surface moisture afterwards, and has reduced the time of wafer cooling, has improved the efficient of wafer cooling; And the even flow plate through gas winding-up element below is provided with makes the current rate of jetting to crystal column surface even, and then makes the wafer cooling evenly.

Description of drawings

The wafer cooling device cross-sectional view that Fig. 1 provides for the utility model embodiment;

The plan structure sketch map of the even flow plate that Fig. 2 provides for the utility model embodiment.

Embodiment

Below in conjunction with accompanying drawing and specific embodiment the wafer cooling device that the utility model proposes is done further explain.According to following explanation and claims, advantage of the utility model and characteristic will be clearer.What need explanation is, accompanying drawing all adopts the form of simplifying very much and all uses non-ratio accurately, only is used for conveniently, the purpose of aid illustration the utility model embodiment lucidly.

The core concept of the utility model is to provide a kind of wafer cooling device, jets element to the wafer blowing gas through the gas of setting up, and avoids wafer cooling remained on surface moisture afterwards, and has reduced the time of wafer cooling, has improved the efficient of wafer cooling.And the even flow plate through gas winding-up element below is provided with makes the current rate of jetting to crystal column surface even, and then makes the wafer cooling evenly.

With reference to Fig. 1, the wafer cooling device cross-sectional view that Fig. 1 provides for the utility model embodiment.The wafer cooling device that the utility model embodiment provides is in order to cool wafers 13, and said wafer cooling device comprises: support 11; Even flow plate 12 is fixed on the said support 11, and is positioned at the top of said wafer 13; Gas winding-up element 14 is fixed on the said support 11, and is positioned at the top of said even flow plate 12.

With reference to Fig. 2, the plan structure sketch map of the even flow plate that Fig. 2 provides for the utility model embodiment.The shape of said even flow plate 12 and said wafer 13 couplings; In the present embodiment, said even flow plate 12 is preferably rounded, is evenly distributed with plurality of holes 12a on the said even flow plate 12; In the present embodiment; Said plurality of holes 12a is a circular opening, and the diameter of the hole 12a in said even flow plate 12 centres is less than the diameter of the hole 12a of edge, because gas winding-up element 14 is positioned at the central authorities of support 11; Centre over against said even flow plate 12; The gas of gas winding-up element 14 ejections is big than the pressure of edge at the pressure at the place, centre of even flow plate 12, and the diameter of hole 12a that therefore is arranged on even flow plate 12 centres makes whole even flow plate in the air-flow process, can play the effect of uniform flow less than the diameter of the hole 12a of edge.

Certainly, the utility model does not limit the shape of hole 12a, and described hole can also be other shape, for example is oval, square or triangle, jets to the current rate of crystal column surface evenly as long as can make.And said even flow plate also can be other shape, for example is oval, square or triangle, as long as pass through the even setting of hole, air-flow is evenly got final product.

Further; Said wafer cooling device also comprises the gas supply unit (not shown); Said gas supply unit is connected with said gas winding-up element 14; Said gas supply unit is used for the gas to the 14 supply winding-ups of said gas winding-up element, and said gas for example is nitrogen (N2) or compressed air.In other specific embodiment of the utility model; Said wafer cooling device can not have gas supply unit yet; Promptly need not one gas supply unit to be set separately for the wafer cooling device; But the gas element of jetting is connected on the pipeline into other semiconductor board supply gas through tube connector, the gas supply unit through other semiconductor board is the gas that said wafer cooling device provides cooling usefulness.

The wafer cooling device that present embodiment provides is following to the process that wafer 13 cools off: at first, open gas supply unit, gas is come out via 14 winding-ups of gas winding-up element; Then, gas blows to wafer 13 surfaces through even flow plate 12, and wafer 13 surfaces can be cooled off fast.The utility model is jetted element 14 to wafer 13 blowing gas through the gas of setting up, and avoids wafer 13 coolings remained on surface moisture afterwards, and has reduced the time of wafer 13 coolings, has improved the efficient of wafer 13 coolings.And the even flow plate 12 through gas winding-up element 14 belows are provided with makes the current rate of jetting to wafer 13 surfaces even, and then makes wafer 13 coolings evenly.

Obviously, those skilled in the art can carry out various changes and modification to utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, then the utility model also is intended to comprise these changes and modification interior.

Claims

1. a wafer cooling device is used for cool wafers, it is characterized in that, comprising:

Support;

Even flow plate is fixed on the said support, and is positioned at the top of said wafer;

Gas winding-up element is fixed on the said support, and is positioned at the top of said even flow plate.

2. wafer cooling device as claimed in claim 1 is characterized in that, the shape of said even flow plate and said wafer coupling.

3. wafer cooling device as claimed in claim 2 is characterized in that said even flow plate is rounded.

4. wafer cooling device as claimed in claim 3 is characterized in that, is evenly distributed with plurality of holes on the said even flow plate, and the diameter of the hole in said even flow plate centre is less than the diameter of the hole of edge.

5. wafer cooling device as claimed in claim 4 is characterized in that, described hole be shaped as circle.

6. like any described wafer cooling device in the claim 1 to 5, it is characterized in that, also comprise gas supply unit, said gas supply unit is connected with said gas winding-up element.