CN202197488U - Improvement of connection structure of heat pipe and base plate - Google Patents
Improvement of connection structure of heat pipe and base plate Download PDFInfo
- Publication number
- CN202197488U CN202197488U CN2011203307009U CN201120330700U CN202197488U CN 202197488 U CN202197488 U CN 202197488U CN 2011203307009 U CN2011203307009 U CN 2011203307009U CN 201120330700 U CN201120330700 U CN 201120330700U CN 202197488 U CN202197488 U CN 202197488U
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- CN
- China
- Prior art keywords
- heat pipe
- base plate
- connection structure
- heat
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses improvement of a connection structure of a heat pipe and a base plate, which is applied to the field of radiator components. The improvement of the connection structure of the heat pipe and the base plate of a radiator comprises the heat pipe and the base plate. An inserting connection hole is arranged in the base plate, one end of the heat pipe is provided with an inserting connection plug connected with the inserting connection hole in interference fit mode, and an inserting connection head is integrally formed with the heat pipe. The outer diameter of the heat pipe is 0.02 to 0.04 mm bigger than the hole diameter of the inserting connection hole, and the outer diameter of the heat pipe is 0.03 mm bigger than the hole diameter of the inserting connection hole. By means of the technical scheme, radiating capacity of the radiator is improved by 15% under the same condition by adopting a thermal contact resistor of the heat pipe and the base plate compared with traditional interference fit, operation is simpler, used materials are less and cost is more economical.
Description
Technical field
The utility model is applied to heat-pipe radiator element field, particularly a kind of improvement structure of heat-pipe radiator.
Background technology
Along with development of electronic technology, electronic device more and more to high frequency, at a high speed, the modularization direction develops, the extensive use of powerful 6 cun components and parts and powerful IGBT module makes the heat that electronic device produced increase always.MSDS plain telegram subset operation makes mistakes and 55% is all caused by overheated, so important link in the exploitation of electronic device cooling more and more becoming electronic product, development.The quality of heat radiation directly has influence on cost, reliability and the service behaviour of electronic product.
Hot pipe technique is the heat transfer element of a kind of being called " heat pipe " of the GM.Grover invention of U.S. LosAlamos National Laboratory in 1963; It has made full use of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling; Be delivered to rapidly outside the thermal source through the heat of heat pipe with thermal objects, its capacity of heat transmission surpasses the capacity of heat transmission of any known metal.Hot pipe technique was widely used in industries such as aerospace, military project in the past; Since being introduced into the radiator manufacturing; Make people change the mentality of designing of traditional heat-dissipating device; Broken away from the high air quantity motor of simple dependence or obtained the single radiating mode of better radiating effect,, can obtain satisfied effect equally even if adopt hot pipe technique to make radiator adopt the motor of the slow-speed of revolution, low air quantity with water-filled radiator; Make that the noise problem of puzzlement wind-cooling heat dissipating is well solved, opened up heat radiation industry new world.
Traditional heat-pipe radiator structure generally is to adopt matched in clearance between tubular heat tube and the substrate, and the technology of riveting tightly the root of heat pipe with mechanical force is then made radiator, also the processing mode that welds together of handlebar heat pipe and substrate.In practical application, adopt matched in clearance, have air between heat pipe and the substrate, heat pipe and radiator base plate contact heat resistance are big, and radiating effect is bad, and it is little to adopt welding procedure contact heat resistance ratio gap to cooperate, but the welding difficulty is big, and cost is high.
The utility model content
The utility model technical problem to be solved provides a kind of heat-pipe radiator heat pipe and circuit board connection structure that increases substantially heat-sinking capability and improves.
For solving the problems of the technologies described above; The utility model adopts following technical scheme: a kind of heat pipe of heat-pipe radiator and circuit board connection structure improve; Comprise heat pipe and substrate, substrate is provided with spliced eye, and described heat pipe one end is provided with the plug that is connected with the jointing holes interference fit.
Preferably, described plug and heat pipe integrated moulding.
Preferably, the external diameter of described plug is than the big 0.02-0.04mm in the aperture of jointing holes.
Further, the external diameter of described plug is than the big 0.03mm in the aperture of jointing holes.
The utility model is owing to adopted technique scheme, and the contact heat resistance of heat pipe and substrate is than traditional matched in clearance, and the heat-sinking capability of radiator improves 15% under equal situation, and operation is simpler, and related material still less expense is more economical.
Description of drawings
Fig. 1 is the process sketch map that the utility model heat pipe and circuit board connection structure improve an embodiment
Embodiment
Further describe below in conjunction with the embodiment of accompanying drawing the utility model.
Shown in Figure 1 is that the utility model heat pipe and circuit board connection structure improve, and comprises heat pipe 2 and substrate 1, and substrate is provided with spliced eye 3, and heat pipe one end is provided with the plug 4 that is connected with the jointing holes interference fit.
As a preferred version, heat pipe 2 and plug 4 integrated moldings, the external diameter of plug be than the big 0.02-0.04mm in the aperture of jointing holes, such as the plug external diameter than the aperture of jointing holes 0.03mm greatly.
This heat-pipe radiator new machining method comprises the steps:
On substrate, process jointing holes, and then carry out reaming, fraising, guarantee that hole tolerance is ± 0.01mm; One end of heat pipe processes the plug of external diameter greater than the jointing holes internal diameter on coreless grinding machine, the external diameter of plug is than the big 0.02-0.04mm in hole, heated substrates; The aperture that makes the jointing holes on the substrate is because of the external diameter of heat expansion greater than the heat pipe plug; Insert the heat pipe plug in the substrate jointing holes, the cooling metacoxal plate shrinks, and heat pipe and substrate connect as one.In addition, also can adopt the mode of machining directly to throw the heat pipe plug on the substrate jointing holes, make heat pipe plug and jointing holes interference fit.
The utility model is not to be defined in aforesaid execution mode; In the category that does not exceed basic fundamental thought of the present invention; The operator of relevant industries can carry out various deformation to it, and the above-mentioned distortion of carrying out should belong to the claim scope of the utility model.
Claims (4)
1. heat pipe and circuit board connection structure improve, and comprise heat pipe (2) and substrate (1), and substrate is provided with spliced eye (3), it is characterized in that: described heat pipe (2) one ends are provided with the plug (4) that is connected with the jointing holes interference fit.
2. heat pipe according to claim 1 and circuit board connection structure improve, and it is characterized in that: described plug (4) and heat pipe (2) integrated molding.
3. heat pipe according to claim 1 and circuit board connection structure improve, and it is characterized in that: the external diameter of described plug is than the big 0.02-0.04mm in the aperture of jointing holes.
4. heat pipe according to claim 1 and 2 and circuit board connection structure improve, and it is characterized in that: the external diameter of described plug is than the big 0.03mm in the aperture of jointing holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203307009U CN202197488U (en) | 2011-09-05 | 2011-09-05 | Improvement of connection structure of heat pipe and base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203307009U CN202197488U (en) | 2011-09-05 | 2011-09-05 | Improvement of connection structure of heat pipe and base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202197488U true CN202197488U (en) | 2012-04-18 |
Family
ID=45952384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203307009U Expired - Lifetime CN202197488U (en) | 2011-09-05 | 2011-09-05 | Improvement of connection structure of heat pipe and base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202197488U (en) |
-
2011
- 2011-09-05 CN CN2011203307009U patent/CN202197488U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Xiaoshan District of Hangzhou City, Zhejiang province 311220 Xiaoshan Economic Development Zone Huarui Center 1 building 23 layer Patentee after: Hangzhou Bo Bo heat transfer Polytron Technologies Inc Address before: Wen Da Wan Lu Yan Zhen Xiaoshan District of Hangzhou City, Zhejiang province 311258 No. 58 Hangzhou xenbo Electric Co. Ltd. Patentee before: Hangzhou Xiangbo Electric Co., Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Improvement of connection structure of heat pipe and base plate Effective date of registration: 20170728 Granted publication date: 20120418 Pledgee: Bank of Beijing, Limited by Share Ltd, Hangzhou, Xiaoshan branch Pledgor: Hangzhou Bo Bo heat transfer Polytron Technologies Inc Registration number: 2017330000076 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20180828 Granted publication date: 20120418 Pledgee: Bank of Beijing, Limited by Share Ltd, Hangzhou, Xiaoshan branch Pledgor: Hangzhou Bo Bo heat transfer Polytron Technologies Inc Registration number: 2017330000076 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| CP03 | Change of name, title or address |
Address after: Room 702, building 3, no.371, Mingxing Road, Xiaoshan Economic and Technological Development Zone, Hangzhou, Zhejiang 311200 Patentee after: Xiangbo heat transfer technology Co.,Ltd. Address before: Xiaoshan District of Hangzhou City, Zhejiang province 311220 Xiaoshan Economic Development Zone Huarui Center 1 building 23 layer Patentee before: XENBO (HANGZHOU) HEAT TRANSFER SCIENCE & TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120418 |
|
| CX01 | Expiry of patent term |