CN203250732U - Rib-wire type heat-dissipating device - Google Patents
Rib-wire type heat-dissipating device Download PDFInfo
- Publication number
- CN203250732U CN203250732U CN 201320150043 CN201320150043U CN203250732U CN 203250732 U CN203250732 U CN 203250732U CN 201320150043 CN201320150043 CN 201320150043 CN 201320150043 U CN201320150043 U CN 201320150043U CN 203250732 U CN203250732 U CN 203250732U
- Authority
- CN
- China
- Prior art keywords
- rib
- heat
- shroud ring
- line
- adopts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a rib-wire type heat-dissipating device. The rib-wire type heat-dissipating device is characterized in that: the rib-wire type heat-dissipating device includes rib wires (8), a heat-dissipating fixing plate (7) or a shroud ring sleeve (1); one technical scheme is that, rib feet (3) of the amount-rich rib wires (8) are inserted in the holes in the heat-dissipating fixing plate (7), and the connection structure above is welded together; and another technical scheme is that, rib feet (3) of the amount-rich rib wires (8) are bundled tightly, the shroud ring sleeve (1) is sleeved over the rib feet (3), the shroud ring sleeve (1) is shrank tightly under a shrinking preparing process, and a heat-dissipating contacting surface (5) of the heat-dissipating device is processed by turning or grinding, until all rib feet end surfaces (4), and bottom surface of the heat-dissipating fixing plate (7) or bottom surface of the shroud ring sleeve (1) are smooth and bright. The rib-wire type heat-dissipating device has advantages of high heat dissipation performance, simple production technology, and high utilization rate of materials; and the rib-wire type heat-dissipating device is important to promotion and popularization of semiconductor solid state illumination technology with great heat dissipation cost in the prior art.
Description
Technical field
The utility model belongs to semi-conductor electronic device heat dissipation technology field.
Technical background
As everyone knows, now semiconductor electronic technology develop rapidly, size is little, operating frequency or power are but in continuous increase, it is obvious that large temperature rise becomes suddenly, for make its better, more stable, long-life work operation, the scientific and reasonable heat dissipation equipment of design configurations is most important, such as computer CPU chip, video card chip etc., particularly develop now semiconductor solid illuminating lamp chip cooling like a raging fire still for remarkable, its electric energy conversion more than 80% is heat, 2 ℃ of the every risings of temperature, its life-span reduces 10%, solves its heat radiation and is imminent.
Heat transfer and heat dissipation technology have developed last 100 years, an insider or generation generation is inheriting ancestors' family estate, adopt traditional project organization and manufacture method, although can solve reluctantly heat dissipation problem, but, the radiator product is heavy, the size super large, production technology is many, must cause the many and high price of waste of material, this runs counter to the energy saving and environment friendly and economizing type industrial development thinking of praising highly energetically and advocating now, and light weight, low cost, high performance heat dissipation equipment will be the pets of Times ' Demand.
Summary of the invention
The purpose of this utility model is exactly for the problems referred to above, proposes a kind of structure of the best-rib line formula radiator.
The technical solution of the utility model is: a kind of rib line formula radiator includes rib line and heat conduction fixed head or shroud ring cover, the rib line comprises rib pin and rib body, the rib line adopts the pressing and bending moulding process to make various shapes or adopts spring winding process wound into spring shape, the mesh plate structure that the heat conduction fixed head adopts Sheet Metal Forming Technology to make, the shroud ring cover adopts the expressing technique moulding or adopts easy processing metal light wall pipe to cut and forms, in the hole on the rib foot insertion heat conduction fixed head of many ribs of employing number line, adopt again welding method to be welded and fixed syndeton; Or adopt the rib pin section that to count many ribs line to be close to into a bundle, put the shroud ring cover outward, adopt again to tighten fixture technique, the shroud ring cover is tightened structure, adopt at last turning or grinding radiator heat transfer contact face, to all rib foot faces and heat conduction fixed head bottom surface or shroud ring cover bottom face neatly bright and clean.
The rib line of the utility model rib line formula radiator, the wire rod of the various shaped cross of employing aluminium matter or copper or copper aluminum composite material, its sectional area S1 is greater than 2mm
2, less than 30mm
2For the rib pin that guarantees the rib line and the derivation heat-transfer area of semiconductor components and devices have enough transmission of heat by contact areas, circle is preferably adopted in the cross section of rib pin, the mean gap e1 of rib pin is less than 15mm, the total sectional area n S1 of many ribs of number foot face, 1 to 6 times of derivation heat transfer area S of semiconductor components and devices, for the end face that makes several many ribs line rib pin can both be directly or recently with the derivation heat-transfer area transmission of heat by contact of undersized semiconductor components and devices, between the rib pin as far as possible near setting.The rib line adopts Sheet Metal Forming Technology or spring winding process to make a lot of shapes, has increased the rib line length, has namely increased area of dissipation, and the overall dimensions of radiator has diminished simultaneously, becomes compacter, and appearance is ever-changing.The rib body of number many ribs lines, it is outwards radial in one plane to be radius of circle, is stacked at vertical face, is the setting of staggered structure between layer by layer; Or the outside radiant type structure of number many ribs body radius spherical in shape arranges; Or the parallel and vertical structure setting of rib pin of many ribs of number body, mean gap e2 between the adjacent rib body less than 30mm, makes the cooling fin line rib body part of the utility model rib line formula radiator more penetrating greater than 2mm, improve the convection transfer rate of rib body and air, improved widely heat dispersion.
The heat conduction fixed head of the utility model rib line formula radiator adopts aluminium or copper or copper-aluminum composite board material, and its thickness is greater than 2mm, less than 20mm; The shroud ring cover adopts aluminium or copper or copper aluminum composite material, and its height is greater than 2mm, less than 30mm.Rib pin and heat conduction fixed head welding method can be that the surface all adopts nickel plating technology to process, and adopt the welding of soldering technique again, or adopt aluminium weldering or brazing technique directly to weld.
Adopt the fine aluminium of same weight, the cold forging rib pillar of the equal surface area of making and rib-type integrative-structure (alleged one, rib post or fin and the heat-conducting plate structure that is formed in one) radiator, at same limit test environment, do simultaneously with the power thermal testing, the result is that rib pillar integrative-structure radiator heat-dissipation effect is better.Analysis draws: one, the handing-over heat transfer area of the rib post of rib pillar integrative-structure radiator and heat-conducting plate is larger; Two, rib pillar integrative-structure radiator is better than rib-type integrative-structure radiator permeability.Again with the outwards from level to level bending of close foot of every root post of rib pillar integrative-structure radiator, increase the average headway of rib intercolumniation, average headway roughly increases 2 times, and the radiator height dimension reduces, lateral dimension has increased, record radiating effect before state improved 25%.Analysis draws, and the heat dispersion of radiator is relevant with the convection transfer rate of rib post or fin and surrounding air, and cooling fin post or the rib structure of radiator design more penetratingly, and the cross-ventilation heat exchange coefficient is higher.Testing described sample all is to adopt the fine aluminium cold-forging technique to make, cold-forging technique is to be washed into cake blank material with plate material first, each part just has four right angle material wastes, the blank material is put into cold forging press again and is forged into the semi-finished product radiator, also the Vehicle Processing operation must must be adopted, the turning waste is arranged again, just reach 40% with regard to luminescent material waste rate.If in order to improve the heat dispersion of cold forging rib pillar integrative-structure radiator 25%, then also must be as making the experiment exemplar, increase is with the operation of the several rows of bending of rib post, this procedure is not easy again to design tool and adopts mechanically actuated operation to come single stepping to finish, so time-consuming, the expense of increase is high.In sum, the utility model adopts metal wire rod to come the rib post of alternate design cold forging rib pillar integrative-structure radiator, so be called rib line formula in the utility model, employing will be counted many ribs line rib foot and be inserted the heat conduction fixedly in the plate hole be arranged on the mesh plate structure, adopt again welding method to fix to connect or bundle many ribs of number line rib pin section with the shroud ring cover, adopt at last turning or grinding to make whole rib foot faces neatly bright and clean.
Description of drawings
The utility model is described in further detail below in conjunction with accompanying drawing and specific embodiments.
Fig. 1 is the schematic three dimensional views of the utility model shroud ring that radiator adopts cover.
Fig. 2 is the schematic three dimensional views that the utility model radiator adopts the heat conduction fixed head.
Fig. 3 a, 4a, 5a, 6a, 7 are the 3-D view of the utility model radiator, and Fig. 3 b, 4b, 5b, 6b are that the three-dimensional of the utility model radiator is dissectd structural representation.
Among the figure, 1, the shroud ring cover, 2, the rib body, 3, the rib pin, 4, rib foot face, 5, radiator heat transfer contact face, 6, shrink the tool impression, 7, the heat conduction fixed head, 8, the rib line.
Among the figure, e2 is the average headway of adjacent rib body, and S1 is rib line rib foot face area, then nS1 is the gross area of n rib line of the utility model rib line radiator rib foot face, if S is the derivation heat transfer surface area of semi-conductor electronic device, h is the thickness of heat conduction fixed head, and H is the height of shroud ring cover.
Specific embodiments
Fig. 1,2 illustrates respectively the schematic three dimensional views of the shroud ring cover 1 that the utility model rib line formula radiator adopts or the heat conduction fixed head 7 that adopts, all adopt high-thermal conductive metal materials of aluminum or copper or copper aluminum composite material, shroud ring cover 1 adopts the expressing technique moulding, adopt again processing of cutting to become a section to form, heat conduction fixed head 7 adopts Sheet Metal Forming Technology to make, be evenly arranged several porous on it, plating nickel on surface is processed.
Fig. 3 a, 4a, 5a, 6a, 7 and Fig. 3 b, 4b, 5b, 6b, the 3-D view and the three-dimensional that are respectively three kinds of the utility model rib line formula radiators are dissectd structural representation, the formula of rib line shown in Fig. 3 a, 3b, 4a, 4b, 5a, 5b, 6a, 6b radiator, comprise that several many ribs lines 8 and a heat conduction fixed head 7 form, the rib pin 3 of many ribs of number line 8 inserts on the heat conduction fixed head 7, rib line 8 and heat conduction fixed head 7 plating nickel on surface are processed, and adopt soldering technique to be welded and fixed connection.Rib line formula radiator shown in Figure 7, comprise that several many ribs lines 8 and a shroud ring cover 1 form, adopt rib pin 3 ends at several many ribs lines 8 to put shroud ring cover 1, adopt to tighten tool, shroud ring is overlapped 1 compression (as shown in Figure 7, shroud ring overlaps 1 cylinder border and shrinks tool impression 6) technique assembling.Two kinds of package assemblies also can adopt aluminium weldering or brazing technique, with rib pin 3 and heat conduction fixed head 7 in the welding of rib pin 3 exits of heat conduction fixed head 7 or namely count many ribs pin 3 in the bottom surface of shroud ring cover 1 and be welded to connect near section end face 4, at last, with anchor clamps on the rib line formula radiator muff-joint that assembles, adopt the bottom surface of lathe or grinding machine processing heat conduction fixed head 7 or shroud ring cover 1, it is the fixedly assembling end face of the rib pin 3 of rib line 8, bottom surface to all rib pin 3 end faces and heat conduction fixed head 7 or shroud ring cover 1 is neatly bright and clean, as rib line formula radiator transmission of heat by contact face 5.Shown in the figure, rib line 8 comprises rib body 2 and rib pin 3, and rib line 8 adopts bending molding process to make, and the mean gap e of the rib body 2 of adjacent rib line 8 is greater than 2mm, and less than 30mm, the sectional area S1 of rib line 8 is greater than 2mm
2, less than 30mm
3, adopting circular-section wire, the gross area nS1 of many ribs of radiator number line 8 rib foot areas 4 is 1 times to 6 times of derivation heat transfer surface area S of semiconductor electronic component.
Rib line formula radiator shown in Figure 3, the rib body 2 of rib line 8 ringwise, both sides of the chest pin 3 symmetrical parallel, rib body 2 is vertical bending structure with rib pin 3, to concordant with the bottom surface, rib line 8 is divided into three layers of setting, forms layer by layer staggered structure in the hole of both sides of the chest pin 3 insertion heat conduction fixed heads 7.Rib line formula radiator shown in Figure 4, the rib body 2 of rib line 8 is snakelike bending, and rib body 2 is vertical bending structure with rib pin 3, the three layers of setting in 8 minutes of rib line.Rib line formula radiator shown in Figure 5, the rib body 2 of rib line 8 is linearly, rib body 2 is greater than 90 degree bending structures with rib pin 3, the rib body 2 of many ribs of number line 8, the center of showing greatly heat conduction fixed head 7 is the centre of sphere, with the outwards radially structure setting of radius of a ball direction, such structure can make the rib body 2 mean gap e2 of rib line 8 very large, increases the convection transfer rate of rib line 8 surfaces and air.Rib line formula radiator shown in Figure 6, rib line 8 adopts spring winding process wound into spring shape structure, rib body 2 axis are parallel with rib pin 3, number many ribs line 8 around heat conduction fixed head 7 axis around just being listed as setting, such structure, increase widely the length of rib line 8, also dwindled the overall appearance size of radiator.Rib line formula radiator shown in Figure 7, the rib body 2 linearly structures of rib line 8 with 3 one-tenth vertical bending structures of rib pin, are counted 3 sections on many ribs pin and are abutted against together, adopt shroud ring cover 1 to tighten assembling, and rib body 2 adopts layer by layer shifted structure setting.
In sum, the rib line formula radiator that the utility model provides, weight is extremely light, rib wire shaped flexible design, the radiator integral structure is ever-changing, and permeability is good, the cross-ventilation heat exchange coefficient is very high, production technology is simple, adopts material price cheap, and stock utilization is high, substantially do not have the loss waste, it is significant to be applied to the semi-conductor electronic device field of radiating, particularly promotes and the semiconductor solid lighting technology of popularizing existing great number heat radiation cost, and meaning is unprecedented.
Claims (5)
1. rib line formula radiator, it is characterized in that: rib line formula radiator includes rib line (8) and heat conduction fixed head (7) or shroud ring cover (1), rib line (8) comprises rib pin (3) and rib body (2), rib line (8) adopts the pressing and bending moulding process to make various shapes or adopts spring winding process wound into spring shape, the mesh plate structure that heat conduction fixed head (7) adopts Sheet Metal Forming Technology to make, shroud ring cover (1) adopts the expressing technique moulding or adopts easy processing metal light wall pipe to cut and forms, adopt the rib pin (3) of number many ribs line (8) to hold in the hole of inserting on the heat conduction fixed head (7), adopt again welding method to be welded and fixed syndeton; Or adopt rib pin (3) section that to count many ribs line (8) to be close to into a bundle, put shroud ring cover (1) outward, adopt again and tighten fixture technique, shroud ring cover (1) is tightened structure, adopt at last turning or grinding radiator heat transfer contact face (5), neatly bright and clean with heat conduction fixed head (7) bottom surface or shroud ring cover (1) bottom face to all rib foot faces (4).
2. rib line formula radiator according to claim 1 is characterized in that: described rib line (8) adopts the wire rod of aluminium matter or copper or copper aluminum composite material, and its sectional area S1 is greater than 2mm
2, less than 30mm
2
3. rib line formula radiator according to claim 1, it is characterized in that: it is outwards radial that the rib body (2) of described many ribs of number line (8) in one plane is radius of circle, is stacked at vertical face, is the setting of staggered structure between layer by layer; Or the outside radiant type structure of number many ribs body (2) radius spherical in shape arranges; Or number many ribs body (2) is parallel and vertically structure setting of rib pin (3), and the mean gap e2 between adjacent rib body (2) is greater than 2mm, less than 30mm.
4. rib line formula radiator according to claim 1, it is characterized in that: the mean gap e1 of described rib pin (3) is less than 15mm, count the total sectional area n S1 of many ribs foot face (4), gone out 1 times to 6 times of heat transfer area S by the thermal conductance of heat-radiating semiconductor electronic devices and components.
5. rib line formula radiator according to claim 1 is characterized in that: described heat conduction fixed head (7) adopts aluminium or copper or copper-aluminum composite board material, and its thickness is greater than 2mm, less than 20mm; Shroud ring cover (1) adopts aluminium or copper or copper aluminum composite material, and its height is greater than 2mm, less than 30mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320150043 CN203250732U (en) | 2013-03-03 | 2013-03-03 | Rib-wire type heat-dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320150043 CN203250732U (en) | 2013-03-03 | 2013-03-03 | Rib-wire type heat-dissipating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203250732U true CN203250732U (en) | 2013-10-23 |
Family
ID=49377155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320150043 Expired - Fee Related CN203250732U (en) | 2013-03-03 | 2013-03-03 | Rib-wire type heat-dissipating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203250732U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014134911A1 (en) * | 2013-03-03 | 2014-09-12 | Qin Jizhong | Rib-line type radiator and manufacturing method therefor |
-
2013
- 2013-03-03 CN CN 201320150043 patent/CN203250732U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014134911A1 (en) * | 2013-03-03 | 2014-09-12 | Qin Jizhong | Rib-line type radiator and manufacturing method therefor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103199066A (en) | Rib-line-type radiator and manufacturing method | |
| CN105140194B (en) | Hot superconducting radiator and its manufacture method | |
| CN205104482U (en) | Superconductive radiator of heat | |
| CN203250732U (en) | Rib-wire type heat-dissipating device | |
| CN103957682B (en) | Heat abstractor and there is the electronic equipment of this heat abstractor | |
| CN101222838A (en) | Sunflower embedded heat pipe radiator | |
| CN203534296U (en) | Novel LED sunflower radiator | |
| CN202432488U (en) | LED lamp radiator | |
| CN201555083U (en) | Multi-chip high-power LED lamp and a radiator structure | |
| CN2775835Y (en) | Heat pipe radiator | |
| CN201983233U (en) | Heat dissipation and heat insulation device of LED (light-emitting diode) lamp | |
| CN203659841U (en) | Rib-line-type radiator | |
| CN211557821U (en) | Power electronic radiator | |
| CN202617578U (en) | Low-temperature soldered electronic radiator | |
| CN215181686U (en) | Computer radiator fin aluminum section bar | |
| CN203721706U (en) | Rib-line radiator | |
| CN204796012U (en) | Heat pipe type heat dissipation module and equipment frock | |
| CN203871314U (en) | Radiator | |
| CN201527997U (en) | Radiating structure of light-emitting diode (LED) | |
| TWI336434B (en) | ||
| CN203963872U (en) | A kind of LED bulkhead lamp capable radiator of double-deck heat pipe heat radiation | |
| CN219393391U (en) | Superconductive heat abstractor | |
| CN204810790U (en) | Heat conducting device | |
| CN202076328U (en) | Novel heat pipe circulating radiator | |
| CN104051375A (en) | Rib-line type radiator and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN HECHUANGXIN LIGHTING TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: QIN JIZHONG Effective date: 20140430 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 404339 ZHONGXIAN, CHONGQING TO: 518000 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140430 Address after: Nine road 518000 Guangdong city of Shenzhen province Futian District Tairan 212 building 706B Patentee after: Shenzhen Hechuangxin Lighting Technology Co., Ltd. Address before: 404339, Chongqing, Zhongxian ocean crossing town No. 12, attached to No. 1 Patentee before: Qin Jizhong |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131023 Termination date: 20180303 |