CN202188322U - Novel high-power LED (light-emitting diode) lighting lamp of cooling device - Google Patents
Novel high-power LED (light-emitting diode) lighting lamp of cooling device Download PDFInfo
- Publication number
- CN202188322U CN202188322U CN2011201475211U CN201120147521U CN202188322U CN 202188322 U CN202188322 U CN 202188322U CN 2011201475211 U CN2011201475211 U CN 2011201475211U CN 201120147521 U CN201120147521 U CN 201120147521U CN 202188322 U CN202188322 U CN 202188322U
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- locating hole
- heat
- led
- pcb board
- reflector
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Abstract
The utility model discloses a novel high-power LED (light-emitting diode) lighting lamp of a cooling device, belonging to the field of LED lighting technology. The novel high-power LED lighting lamp of the cooling device comprises a reflector (1), a printed circuit board (PCB) (2) and a radiator (3), wherein a locating hole (101) arranged on the reflector (1) is connected with a locating hole (201) arranged on the PCB (2); and the locating hole (201) arranged on the PCB (2) is connected with a locating hole (301) arranged on the radiator (3). The novel high-power LED lighting lamp of the cooling device has the advantages that a carbon nano tube (CNT) heat dissipation technology is adopted to quickly and efficiently diffuse heat, so that the weight of a light fitting is lighter, the service life of the light fitting is prolonged, and the novel high-power LED lighting lamp is simple in structural design.
Description
Technical field
The utility model relates to the LED lighting technical field, is specifically related to a kind of LED high-power illumination lamp of heat sinking device.
Background technology
LED (Light Emitting Diode, light emitting diode) has efficiently, safety, energy-saving and environmental protection, characteristics such as the life-span is long, response speed is fast, colour rendering index height.
Advantages such as exactly because led light source have energy-saving and environmental protection, life-span length, vibration resistance, control is flexible, response speed is fast, at lighting field, increasing choose LED is as light source.Deep enforcement along with China's energy-saving and emission-reduction state basic policy; Green illumination has been included one of energy-conservation key project in; Under the guiding of these favourable policies; Illuminating product manufacturing enterprise quantity surpasses 30% surprising speed development with annual growth, and developing at present and produce with the white light LEDs is thousands of nearly families of lighting enterprise of light source.
The core of LED is exactly a wafer, and wafer is to be made up of P-type semiconductor and N-type semiconductor).Occupying an leading position in the P-type semiconductor holes, mainly is electronics in N-type semiconductor, and the centre is a SQW.When electric current when the LED anode flows to negative electrode, the P-N junction barrier reduces, electronics and hole are pushed SQW and recombination luminescence to.Along with the increase LED meeting blast of electric current, but heating is but very serious.Though the luminous efficiency of LED is very high in theory, in fact LED is used for heating with 80% electric energy in the course of the work.So the heat of vast scale has greatly reduced the efficient of illumination, if heat can not in time conduct, causes chip temperature to raise, and also possibly have influence on the luminous color of LED.In addition, along with the rising of wafer operating temperature, the life-span of LED presents the index downward trend.Theoretically, the operating temperature of LED is low more good more, but requires the high packaging density of high brightness in the illuminator, and this just has higher requirement to the heat radiation of LED.
Existing LED radiating mode mainly is to set about with the heat-sinking capability aspect that improves device from improving the LED luminous efficiency.The approach that improves luminous efficiency generally is to change the wafer micro-structural or change LED external structure or the like.The heat-sinking capability that improves device is on the basis of wafer, to select some high heat conduction, the material that thermal resistance is low for use.These prior aries no doubt can reduce the temperature of LED wafer effectively; But; On the basis of wafer, improve heat sinking function is very difficult thing; Especially Chinese domestic, the LED wafer manufacturer of independent research not, the forming that comes for some imports wafer on the level of wafer, to improve radiating efficiency be very difficult thing.
Existing radiator mounting means generally is that this mode will directly increase the weight of the load of LED light fixture upper bracket with heat-radiating substrate and lamp body design also encapsulation together.Because metal material density such as radiator are big, hardness is also big, and cost is also high, and design is heavy; What also have takes the copper pipe heat dissipation technology, and this mode can reduce cost and light fixture weight to a certain extent, and radiating efficiency is also higher; And the heat radiation form in the utility model will be abandoned above dual mode, adopt this material of CNT to dispel the heat, and CNT is as monodimension nanometer material; In light weight, hexagonal structure connects perfect, has many unusual mechanics, electricity and chemical property; Particularly has the good heat transfer performance; CNTs has very large draw ratio, thereby its heat exchange performance alongst is very high, and the heat exchange performance of its relative vertical direction is lower; Through suitable orientation, CNT can synthesize the heat conducting material of high anisotropy.Therefore adopt CNT the high and light fixture weight of the radiating efficiency of light fixture will be had and reduce, be easy to carry and install as heat sink material.
The utility model content
The utility model provides a kind of LED high-power illumination lamp of heat sinking device, mainly is through CNT the heat that LED produces to be discharged lamp body.
The utility model makes full use of the thermal characteristic of LED itself, lamp body self structure characteristics and designing.
The LED high-power illumination lamp of a kind of heat sinking device of the utility model, its characteristic comprise reflector (1), pcb board (2), radiator (3); Locating hole (101) on the said reflector (1) is connected with locating hole (201) on the pcb board (2), and the locating hole (201) on the said pcb board (2) is connected with locating hole (301) on the radiator (3).
Further, the said reflector of the utility model (1), its locating hole through reflector self (101) is connected with locating hole (201) on the pcb board (2), and has curved surface reflector more than 15 (102), layout triangular in shape at least.
Further, the said pcb board of the utility model (2) is to be connected with locating hole (301) on the radiator through the locating hole (201) on the pcb board (2), and has the LED of 15 1W at least on the pcb board (2), layout triangular in shape.
Further; The said radiator of the utility model (3) is characterized in that it is divided into the locating hole (301) that is connected with the last locating hole (201) of pcb board (2), and is used to fill the radiating groove (302) of heat sink material; At least 5 of said radiating grooves; Each the inside scribbles two-layer heat sink material, is heat-conducting glue near that one deck of pcb board (2), is one deck CNT above the heat-conducting glue.
Compared with prior art the LED high-power illumination lamp of the utility model need not too much heat sink material and just can reach corresponding heat radiation standard, and radiating efficiency is high; Prolonged the service life of light fixture; Reflector (1) pcb board (2) and radiator (3) are fixing one in addition, constitute integrated, easy for installation.
Description of drawings
Fig. 1: be the utility model LED high-power illumination modulated structure sketch map;
Fig. 2: be the utility model reflector structure sketch map;
Fig. 3: be the utility model pcb board structural representation;
Fig. 4: be the utility model heat spreader structures sketch map.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is done further explanation:
Fig. 1 is the utility model LED high-power illumination modulated structure sketch map, but by the LED high-power illumination lamp of scheming a kind of heat sinking device of knowledge capital utility model, comprises reflector (1), pcb board (2), radiator (3); Locating hole (101) on the said reflector (1) is connected with locating hole (201) on the pcb board (2), and the locating hole (201) on the said pcb board (2) is connected with locating hole (301) on the radiator (3).
Fig. 2 is the utility model reflector structure sketch map, by figure can know that three locating holes are arranged on the reflector (1), its effect be with radiator on locating hole (301) be connected fixing; Comprise many many curved surfaces reflectors (102) on the reflector, the light that all adopts many curved surfaces luminous intensity distribution technical guarantee LED to send is evenly distributed.
Fig. 3 is the utility model pcb board structural representation, can know have 15 LEDs to fix on it on PCB (2) plate by figure, and be the great power LED (202) of 1W, and lamp can produce a large amount of used heat in work like this.
Fig. 4 is the utility model heat spreader structures sketch map; It is divided into the locating hole (301) that is connected with pcb board (2) locating hole (201), and be used to fill heat sink material radiating groove (302), in the time of lamp work; The quantity of waste heat that produces will be delivered to radiating groove by pcb board (2); Said radiating groove the inside ground floor material heat-conducting glue will absorb heat rapidly, and second layer matter of C nanotube is given in conduction afterwards, because it has good heat conduction function; The used heat that light fixture produces will be imported in the air by it rapidly, thereby guarantee the working environment of light fixture.
More than the LED high-power illumination lamp of a kind of heat sinking device that the utility model provided has been carried out detailed introduction, used various integral body in the utility model and separation model figure sets forth the specific embodiment; For one of ordinary skill in the art, according to thought of the present invention, the part that on the specific embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention simultaneously.
Claims (4)
1. the LED high-power illumination lamp of a heat sinking device, its characteristic comprises reflector (1), pcb board (2), radiator (3); Locating hole (101) on the said reflector (1) is connected with locating hole (201) on the pcb board (2), and the locating hole (201) on the said pcb board (2) is connected with locating hole (301) on the radiator (3).
2. the LED high-power illumination lamp of a kind of heat sinking device according to claim 1 is characterized in that described reflector (1) has curved surface reflector more than 15 (102) at least, and layout is triangular in shape.
3. the LED high-power illumination lamp of a kind of heat sinking device according to claim 1 is characterized in that having at least on the described pcb board (2) great power LED (202) of 15 1W, and layout is triangular in shape.
4. the LED high-power illumination lamp of a kind of heat sinking device according to claim 1 is characterized in that described radiator (3) comprises the locating hole (301) that is connected with the last locating hole (201) of pcb board (2), and is used to fill the radiating groove (302) of heat sink material; Said radiating groove (302) is at least 5, and each groove the inside scribbles two-layer heat sink material, is heat-conducting glue near that one deck of pcb board (2), is one deck CNT above the heat-conducting glue.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011201475211U CN202188322U (en) | 2011-05-10 | 2011-05-10 | Novel high-power LED (light-emitting diode) lighting lamp of cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011201475211U CN202188322U (en) | 2011-05-10 | 2011-05-10 | Novel high-power LED (light-emitting diode) lighting lamp of cooling device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202188322U true CN202188322U (en) | 2012-04-11 |
Family
ID=45919773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011201475211U Expired - Fee Related CN202188322U (en) | 2011-05-10 | 2011-05-10 | Novel high-power LED (light-emitting diode) lighting lamp of cooling device |
Country Status (1)
Country | Link |
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CN (1) | CN202188322U (en) |
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2011
- 2011-05-10 CN CN2011201475211U patent/CN202188322U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Termination date: 20140510 |