CN202076260U - Sheet type diode - Google Patents
Sheet type diode Download PDFInfo
- Publication number
- CN202076260U CN202076260U CN2011201923538U CN201120192353U CN202076260U CN 202076260 U CN202076260 U CN 202076260U CN 2011201923538 U CN2011201923538 U CN 2011201923538U CN 201120192353 U CN201120192353 U CN 201120192353U CN 202076260 U CN202076260 U CN 202076260U
- Authority
- CN
- China
- Prior art keywords
- chip
- negative
- sheet type
- positive
- type diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The utility model discloses a sheet type diode, relating to improvements of internal structures of diodes, and the sheet type diode has a thin overall size and is suitable for utilization in a small-scale space. The sheet type diode comprises a positive lead wire, a negative lead wire, a chip and a package body, wherein opposite end heads of the positive lead wire and the negative lead wire are provided with a positive working surface and a negative working surface which are in contact with the chip; the chip is horizontally arranged; and a positive surface and a negative surface of the chip are respectively connected with the positive working surface of the positive lead wire and a negative working surface of the negative lead wire. According to the utility model, the traditional manner that the chip of the diode is arranged vertical to the lead wires is changed, the chip is changed to be horizontally arranged, and inner end heads of the two lead wires are respectively provided with working surfaces which are suitable for a surface size of the chip, therefore, the sheet type diode with the thin overall size is formed. The chip of the sheet type diode is arranged to be parallel to the lead wires, therefore, the volume of the product is reduced; and the surface of the chip is closer to the external surface of the package body, so that the heat-radiating performance is relatively enhanced, and the service life of the product is prolonged.
Description
Technical field
The utility model relates to a kind of diode, relates in particular to the improvement to the diode internal structure.
Background technology
The version of diode of the prior art mostly is two lead-in wires greatly and clamps chips welding, adds packaging body and forms.Shown in Fig. 3,4, chip 2 is provided with perpendicular to positive wire 1 and negative wire 4, and two lead ends are provided for connecting the anodal dististyle 10 and the negative pole dististyle 40 of chip 2 respectively; Complex process, the high material consumption of dististyle are set on the one hand; On the other hand, the diode body of this kind version is cylindrical shape (being the outer contour shape of cylindrical encapsulation body 5), causes whole height (diameter of cylinder packaging body 5) size bigger.Make to take up room greatlyyer that waste of raw materials is serious, is difficult to adapt to client miniaturization development trend.
The utility model content
The utility model provides a kind of overall dimensions thin, the sheet type diode that is suitable for utilizing in small space at above problem.
The technical solution of the utility model is: comprise positive wire, negative wire, chip and packaging body, the termination that described positive wire is relative with negative wire is provided with anodal working face and the negative pole working face that contacts described chip; Described chip horizontal, the positive pole-face of described chip is connected the anodal working face of described positive wire and the negative pole working face of negative wire respectively with the negative pole face.
Described packaging body is flat tetragonal body shape.
The utility model has changed the set-up mode of existing diode chip for backlight unit perpendicular to lead-in wire, changes chip into horizontal, in two inner termination that go between the working face adaptive with the chip surface size is set respectively, and then has formed the thin sheet type diode of overall dimensions.Chip of the present utility model is parallel to lead placement, has reduced small product size, and since the surface more near the packaging body outer surface, so heat dispersion improves relatively, can improve product useful life.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
1 is positive wire among the figure, the 2nd, and chip, the 3rd, packaging body, the 4th, negative wire;
Fig. 2 is the upward view of Fig. 1;
Fig. 3 is the structural representation of the utility model background technology;
1 is anodal dististyle among the figure, the 4th, and negative pole dististyle, the 5th, cylindrical encapsulation body;
Fig. 4 is the vertical view of Fig. 3.
Embodiment
The utility model comprises positive wire 1, negative wire 4, chip 2 and packaging body 3 as shown in Figure 1, 2, and described positive wire 1 is provided with anodal working face and the negative pole working face that contacts described chip 2 with negative wire 4 relative terminations (inner termination); Described chip 2 horizontal, the positive pole-face of described chip 2 is connected the anodal working face of described positive wire 1 and the negative pole working face of negative wire 4 respectively with the negative pole face.
Described packaging body 3 is flat tetragonal body shape.Whole height is little with respect to cylinder diameter of the prior art, makes to use in some narrow and small occasions.
The utility model is adjusted into traverse with original chip of placing vertically, in the middle of being placed on two lead frames, welds chip, and the height when having reduced welding, and the stability between chip and the lead-in wire is better during welding.Be more convenient for carrying out welding operation.
Claims (2)
1. a sheet type diode comprises positive wire, negative wire, chip and packaging body, it is characterized in that, the termination that described positive wire is relative with negative wire is provided with anodal working face and the negative pole working face that contacts described chip; Described chip horizontal, the positive pole-face of described chip is connected the anodal working face of described positive wire and the negative pole working face of negative wire respectively with the negative pole face.
2. a kind of sheet type diode according to claim 1 is characterized in that, described packaging body is flat tetragonal body shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201923538U CN202076260U (en) | 2011-06-09 | 2011-06-09 | Sheet type diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201923538U CN202076260U (en) | 2011-06-09 | 2011-06-09 | Sheet type diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202076260U true CN202076260U (en) | 2011-12-14 |
Family
ID=45114349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201923538U Expired - Fee Related CN202076260U (en) | 2011-06-09 | 2011-06-09 | Sheet type diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202076260U (en) |
-
2011
- 2011-06-09 CN CN2011201923538U patent/CN202076260U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203242617U (en) | A packaging structure of a Schottky diode | |
| CN202076260U (en) | Sheet type diode | |
| CN201229941Y (en) | Lead wire frame for transistor | |
| CN202025761U (en) | Crimping type controlled silicon chip structure | |
| CN202373578U (en) | Ultrathin paster diode | |
| CN202585399U (en) | Lead frame | |
| CN203617275U (en) | Lead frame for high-power devices | |
| CN202103057U (en) | Large-power chip-type diode | |
| CN203085645U (en) | Die bonder fixture | |
| CN201638796U (en) | Bayonet cap | |
| CN202384327U (en) | Small-size chip package structure | |
| CN203617280U (en) | Lead frame convenient for bonding wires | |
| CN205194735U (en) | Double -end cut straightly formula LED support | |
| CN204420678U (en) | A kind of heat-dissipating luminous diode | |
| CN101924141A (en) | High-power diode suitable for DO-27 and A-201AD package structures | |
| CN201134425Y (en) | Cylinder ceramic sealed diode | |
| CN220086059U (en) | Flat axial diode | |
| CN203617274U (en) | Lead frame for low-power devices | |
| CN202633055U (en) | Ceramic capacitor | |
| CN202271100U (en) | Pressure claw capable of welding aluminium foil on DFN lead frame | |
| CN203386742U (en) | One-chip-type structural framework | |
| CN202384325U (en) | Crystal package structure | |
| CN201655810U (en) | Miniature surface mount diode | |
| CN202539800U (en) | Cutter for ultrasonic welding wire | |
| CN201118432Y (en) | Plastic three-phase bridge commutator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111214 Termination date: 20170609 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |