CN202029342U

CN202029342U - Molding packaging mold for LED (light-emitting diode) lamp beads

Info

Publication number: CN202029342U
Application number: CN2011201466852U
Authority: CN
Inventors: 吴小云
Original assignee: HUIZHOU SULE TECHNOLOGY CO LTD
Current assignee: Guangdong Seedcom Electrical & Lighting Co., Ltd.
Priority date: 2011-05-10
Filing date: 2011-05-10
Publication date: 2011-11-09
Anticipated expiration: 2021-05-10

Abstract

The utility model discloses a molding packaging mold for LED (light-emitting diode) lamp beads, which comprises an upper mold and a lower mold, wherein the joint face of the upper mold is provided with a retainer for fixing holders, the lower mold is provided with lower cavities for containing silica gel, and the open faces of the lower cavities are matched with the joint face. The retainer is a net frame which is fastened with the holders and can be dismounted from the upper mold. The mold can be utilized to realize the automation of the packaging and molding of the LED lamp beads, the processing time is greatly shortened, the processing steps are reduced, the processing efficiency is increased by more than 60 percent, and thereby the processing cost is reduced.

Description

A kind of LED bulb-forming encapsulating mould

Technical field

The utility model belongs to the semiconductor package holding tool, relates in particular to a kind of LED bulb-forming encapsulating mould.

Background technology

The last protection glue that adopts in the existing large-power LED light bead packaging technology; generally be form by pressure injection; silica gel is injected in the PC cover of having buckled well; fill full PC cover by silica gel; air is discharged; play the protection chip and not disturbed by extraneous oxidation, and the light rising angle is carried out catadioptric control lighting angle and improve light emission rate.The shortcoming of prior art scheme is that the PC cover that is adopted is limited by material behavior, its heatproof is relatively poor, be difficult to adapt to the requirement of 260 ℃ of Reflow Soldering making technologies, simultaneously because of needing in the processing procedure to every bracket cover PC lens or mould bar, and then every injection silica gel, injecting glue process production efficiency is low and be easy to generate and also entire bracket will be moved into baking box segmentation baking behind bubble, the injecting glue, and technology is loaded down with trivial details, the processing procedure time long, homogeneity of product control is relatively poor.And PC and two kinds of light transmissive materials of silica gel use simultaneously, can be easy to generate interlayer because of the coefficient of expansion and material hardness difference, the loss luminous flux.

Summary of the invention

At above-mentioned technological deficiency, the technical problems to be solved in the utility model provides a kind of production efficiency of LED lamp bead seal dress and mould of homogeneity of product of significantly improving.

The technical problems to be solved in the utility model is achieved through the following technical solutions: a kind of LED bulb-forming packaging technology mould, it comprises upper die and lower die, on the land area of patrix, be provided with support bracket fastened fixture, described film down is provided with the bottom film chamber that holds silica gel, and the opening surface of described bottom film chamber is consistent with land area.Described fixture be the clamping support and can with the screen frame of patrix dismounting.

Compared with prior art, in the above-mentioned LED bulb-forming encapsulating mould, be provided with support bracket fastened fixture on the land area of patrix, described film down is provided with the bottom film chamber that holds silica gel, and the opening surface of described bottom film chamber is consistent with land area.Utilize this mould, realize LED bulb-forming encapsulation molding automation, significantly shorten process time, reduce processing step, improve working (machining) efficiency more than 60%, thereby cut down finished cost.

Description of drawings

Fig. 1 installs standoff mould vertical profile structure diagram;

Fig. 2 is the vertical profile structure diagram of matched moulds up and down;

Fig. 3 is the vertical profile structure diagram of branch film;

Wherein, 1 led chip, 2 supports, 3 patrixes, 4 times films, 5 lower mode cavities, 6 screen frames.

The specific embodiment:

For the ease of those skilled in the art's understanding, the utility model structural principle is further described in detail below in conjunction with the specific embodiment and accompanying drawing.

As Fig. 1-3, a kind of LED bulb-forming mould, it comprises patrix 3, counterdie 4, is provided with the fixture of fixed support 3 on the land area of patrix 3, and described film 4 down is provided with the bottom film chamber 5 that holds silica gel, and the opening surface of described bottom film chamber 5 is consistent with land area.Described fixture be clamping support 3 and can with the screen frame 6 of patrix dismounting, shown in 1.Its processing step is: at first led chip 1 is welded on the support 2 admittedly; Admittedly the support that welds led chip is fixed on the patrix 3 of mould, silica gel is injected the lower mode cavity 5 that is located at down film 4 in advance and fills up lower mould chamber 5, promptly utilize the gravitational principle of the earth, silica gel is injected in the lower mould chamber 5 in advance, utilize the mobile and deadweight of silica gel self, fill up the cavity that mould needs moulding.After treating that silica gel is filled with the need molding cavity, remove the injecting glue bucket.The upper and lower mould of mould is closed membrane operations, in closing membrane process, need the temperature and pressure that raises, so that the air in the discharge die cavity, silica gel in die cavity is curing molding on support 2, as shown in Figure 2, and the pressurization of in this process, will heating, it is 150 ℃～180 ℃ that temperature must raise, pressure must raise and be 18MPa～20MPa, by pore and the runner that designs in the mould, fills up silica gel with unnecessary air discharge and according to lower mode cavity 5 shapes.The upper and lower mould of mould is carried out the branch membrane operations, and the support 2 that the silica gel moulding is packaged takes off from lower mode cavity 5, forms the silica gel 7 as the lower mode cavity shape on the support, so just finishes the silica gel moulding packaging operation of a pack support, as shown in Figure 3.Repeat above-mentioned steps, finished the mass operation of silica gel moulding encapsulation.

By the way, finished the existing pattern of single operation of silica gel encapsulation molding automation replacement, the lifting of implementation efficiency and quality.

The foregoing description only is a preferred implementation of the present utility model, and under the prerequisite that does not break away from the utility model design, any conspicuous replacement all should fall within the protection domain of the present utility model.

Claims

1. LED bulb-forming encapsulating mould, it comprises patrix (3), counterdie (4), it is characterized in that: the fixture that on the land area of patrix (3), is provided with fixed support (2), described film (4) down is provided with the bottom film chamber (5) that holds silica gel, and the opening surface of described bottom film chamber (5) is consistent with land area.

2. LED bulb-forming encapsulating mould according to claim 1 is characterized in that: described fixture be clamping support (2) and can with the screen frame (6) of patrix dismounting.