CN202021434U - Recovery dispersing device - Google Patents
Recovery dispersing device Download PDFInfo
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- CN202021434U CN202021434U CN2011200425624U CN201120042562U CN202021434U CN 202021434 U CN202021434 U CN 202021434U CN 2011200425624 U CN2011200425624 U CN 2011200425624U CN 201120042562 U CN201120042562 U CN 201120042562U CN 202021434 U CN202021434 U CN 202021434U
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- solder flux
- recovery
- opening port
- funnel
- chassis
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Abstract
The utility model provides a recovery dispersing device which is provided with a recovery dispersing trolley carrying a hopper accumulated with a welding flux, disperses the welding flux and recovers used welding flux. The hopper is provided with an upper opening which is opened towards the upper part, a lower opening formed at the inner bottom of the hopper, and an opening and closing valve for opening and closing the lower opening. The length of the carrying direction of the lower opening is more than 1/5 of that of the carrying direction of the upper opening. The area of the inner bottom is more than 20% of that of the upper opening. According to the structure, the accumulation capacity of the welding flux is large, and a great quantity of the welding flux can be carried and a proper amount of welding flux is dispersed.
Description
Technical field
The utility model relates to and a kind ofly carries out single face when welding automatically at the bonding wire along temporary transient fixing soldered material, the liner solder flux that is crimped onto the bonding wire back side (Li is as Off ラ Star Network ス) is provided, and will weld the recovery dissemination apparatus that uses the solder flux recovery that generates.
Background technology
The steel plate that generally is used for boats and ships etc. is because the big steel plate area of needs, so will form by the steel plate that is welded to connect a certain size.In the employed one side welding device of the weld job of this steel plate, by bonding machine from one-sided when soldered material (welded steel) is carried out arc welding, in order to form welding bead at the steel plate back side, along the bonding wire of soldered material on one side with pallet device with groove (ト ラ Off) on one side in the liner solder flux be crimped onto the steel plate back side and weld.
This liner solder flux, the bottom liner solder flux of laying in the lower floor of liner solder flux (following deposited Off ラ Star Network ス), the liner solder flux that uses generally carry out conveyance, supply with, remove and reclaim by reclaiming dissemination apparatus, described recovery dissemination apparatus mainly scatters chassis formations such as (chassis) by reclaiming, on recovery distribution chassis, be equipped with funnel, in funnel, accumulate above-mentioned these solder flux (for example with reference to TOHKEMY 2006-175447 number, the Japanese special permission No. 3930793).
This reclaims and scatter chassis owing to moving along bonding wire in the backside space that forms that descended by lowering or hoisting gear, therefore, reclaiming the height of distribution chassis and the size of width is restricted, the size of chassis integral body is restricted, and wherein lowering or hoisting gear is positioned at the bottom of panel line and is arranged on the pallet device.
As TOHKEMY 2006-175447 number and No. 3930793 communique record of Japan special permission, reclaim to scatter the existing infundibulate of carrying on the chassis become main look and during side-looking towards below the shape of roughly del of undergauge, form from the top opening port towards the shape of bottom opening port volume-diminished for the rotation shape.Be formed with the bottom opening port that scatters solder flux at the interior end of this funnel.So, infundibulate becomes the internal face of incorporating section from the fall quadrangular pyramid shape of top opening port towards interior slanted floor, with the solder flux that successfully accumulates in lower floor supplies with funnel from the upper strata.
But, in the recovery dissemination apparatus of above-mentioned two pieces of prior art documents record, because the height of chassis is scattered in recovery and the appearance and size of width is restricted, so the size of funnel integral body also is restricted.Therefore, can also be restricted by the capacity that accumulates that reclaim to scatter the solder flux that chassis once carries, scatters.
The utility model content
The utility model is to propose in view of the above problems, and its objective is provides a kind of recovery dissemination apparatus, and this recovery dissemination apparatus possesses the suitable funnel of amount that capacity greatly, once can be carried a large amount of solder flux and scatter solder flux that accumulates of solder flux.
In order to solve described problem, recovery dissemination apparatus of the present utility model, it possesses the distribution of recovery chassis, described recovery distribution chassis carries and is provided with the funnel that accumulates solder flux, described solder flux is using when the bonding wire that soldered material is docked each other carries out single-sided welding, and described recovery is scattered chassis and moved along described bonding wire, and described recovery dissemination apparatus scatters described solder flux, reclaims the solder flux that uses, wherein
Described funnel has: towards the top of top opening opening port, the bottom opening port that forms at the interior end of described funnel and the open and close valve that described bottom opening port is opened and closed,
The length of the carrying direction of described bottom opening port forms the length more than 1/5 of length of the carrying direction of described top opening port,
The area at the end forms the size more than 20% of the area of described top opening port in described.
According to this structure, the funnel that reclaims dissemination apparatus is than the funnel that generally uses at present, and the area ratio of the interior end with respect to the top opening port becomes big.The funnel of Xing Chenging can be maintained given size with the appearance and size of height, length and the width of funnel integral body like this, and the area at the end is followed therewith in increasing simultaneously, can make the capacity that accumulates of solder flux become big than the capacity that accumulates of existing funnel.And then the length of the carrying direction by making the bottom opening port is more than 1/5 of top opening port of funnel, can not use the solder flux of funnel inside lavishly.So, be restricted even reclaim to scatter the appearance and size of chassis, also can be under the big or small constant situation in the restriction that keeps its outside dimension, what make solder flux accumulates the tremendous increase of capacity, can once carry a large amount of solder flux and with suitable amount distribution.Therefore, reclaiming dissemination apparatus can be at a large amount of carrying of short time solder flux, so can improve the handling efficiency of solder flux.
In above-mentioned recovery dissemination apparatus, the inwall of the front and back of the carrying direction side of preferred described funnel vertically forms.
According to described structure, funnel is vertical by the inwall that makes the front and back of carrying the direction side, the shape of rectangle when forming side-looking.Therefore, the part that the inwall before and after the volume in the funnel (solder flux accumulate capacity) can correspondingly increase does not tilt.
In above-mentioned recovery dissemination apparatus, the maximum open area of preferred described bottom opening port when maximum is open forms more than 10% of area of described top opening port.
According to described structure, because funnel is formed with the bottom opening port of the size 10% or more of the area of top opening port at the interior end, so the area at its interior end further enlarges formation than the area of bottom opening port.Therefore, be accompanied by long-pending expansion of inner bottom surface and form, funnel also increases than the capacity that accumulates of existing funnel the capacity that accumulates of solder flux.So, be restricted, also can be no more than under the situation of its outside dimension,, can once carry a large amount of solder flux and distribution than the capacity that accumulates of existing funnel increase solder flux even reclaim the appearance and size of scattering chassis.Therefore, reclaim dissemination apparatus and can carry solder flux and distribution at short notice in a large number,, can improve the handling efficiency and the dissemination efficiency of solder flux so can cut down with solder flux stow and the additional operation number of times that reclaims the distribution chassis of giving.
In above-mentioned recovery dissemination apparatus, preferred described solder flux is made of for these two kinds the liner solder flux of the dorsal part of the described bonding wire that is laid on described soldered material and the bottom liner solder flux that is laid on the downside of liner solder flux, described funnel possesses and will be divided into the liner solder flux incorporating section of taking in described liner solder flux in this funnel and take in the demarcation strip of the bottom liner solder flux incorporating section of described bottom liner solder flux, described open and close valve is separately positioned on the below at the interior end of described funnel, makes described bottom opening port open and scatter described liner solder flux or described bottom liner solder flux.
According to described structure, to reclaim in the funnel of dissemination apparatus, the bottom surface of taking in the liner solder flux incorporating section of liner solder flux and taking in these two incorporating sections, bottom liner solder flux incorporating section of bottom liner solder flux enlarges respectively, so that the volume of two resettlement sections also becomes is big.Therefore, reclaim the distribution chassis and can once carry liner solder flux and bottom liner solder flux in a large number,, just can scatter an amount of solder flux respectively if make open and close valve open.So, the recovery of carrying funnel is scattered chassis in carrying, when scattering liner solder flux and bottom liner solder flux, just can efficiently scatter operation with a chassis, therefore, can improve the operating efficiency that scatters operation.
In above-mentioned recovery dissemination apparatus, preferred described open and close valve is configured in the below of described bottom opening port in the mode that can slide in the horizontal direction, and be formed with the distribution mouth of discharging described solder flux, when in described open and close valve slip described distribution mouth being overlapped with described bottom opening port, described solder flux is by described bottom opening port and from described distribution mouthful distribution.
According to described structure, reclaim dissemination apparatus open and close valve is carried out suitable opening and closing operations, just can scatter the liner solder flux or the bottom liner solder flux of stow in the funnel.
At this, preferred described bottom opening port forms the long rectangle of carrying direction that scatters chassis in described recovery, and the carrying direction that described distribution mouth scatters chassis towards described recovery is formed with a plurality of, and described distributions mouth forms a line along described bonding wire.
According to described structure, the distribution mouth that reclaims dissemination apparatus is formed with a plurality ofly towards reclaiming the carrying direction of scattering chassis, and scatter and mouthful form a line along bonding wire, thus can be with on the position that solder flux correctly is dispersed in bonding wire docks.Therefore, when welding, suppress to obtain good welding shape because of the bad failure welding that produces of connecting airtight of solder flux with one side welding device.
Description of drawings
Fig. 1 is that the major part of the one side welding device of expression use recovery dissemination apparatus of the present utility model is amplified longitudinal section;
Fig. 2 is the major part stereogram with partial cross section that the one side welding device of recovery dissemination apparatus of the present utility model is used in expression;
Fig. 3 is the major part enlarged front view with partial cross section of expression recovery dissemination apparatus of the present utility model;
Fig. 4 is the figure of expression recovery dissemination apparatus of the present utility model, is the major part enlarged front view with partial cross section of the state of expression when pushing solder flux with wheel;
Fig. 5 is the figure of expression recovery dissemination apparatus of the present utility model, is the major part enlarged front view with partial cross section of the state when representing solder flux is risen;
Fig. 6 is the side view of expression recovery dissemination apparatus of the present utility model;
Fig. 7 is the figure of expression recovery dissemination apparatus of the present utility model, is the amplification plan view of the state of expression bottom opening port when closing;
Fig. 8 is the figure of expression recovery dissemination apparatus of the present utility model, is the amplification plan view of the state of expression bottom opening port when opening;
Fig. 9 is the approximate three-dimensional map of the funnel of expression recovery dissemination apparatus of the present utility model;
Figure 10 is the approximate three-dimensional map of the comparative example of the expression funnel that reclaims dissemination apparatus.
The specific embodiment
Describe the embodiment of recovery dissemination apparatus 50 of the present utility model with reference to the accompanying drawings in detail.Wherein, in the explanation of embodiment, length direction is the direction parallel with the bonding wire M of soldered material E, and width is the direction with bonding wire M quadrature.Before dissemination apparatus 50 was reclaimed in explanation, explanation earlier used this to reclaim the one side welding device 1 of dissemination apparatus 50.
" formation of one side welding device "
As shown in Figure 1, one side welding device 1 is to use solder flux F that soldered material E, E are carried out single fillet welded welder along bonding wire M each other by bonding machine 30.One side welding device 1 possesses bonding machine 30 described later, chassis framework 104, the carrying of soldered material and fixed mechanism 105, pallet device 10, supporting structure 20, pallet framework 27, lowering or hoisting gear 26 respectively, reclaims solder flux Handling device 28 and reclaim dissemination apparatus 50 (with reference to figure 2).
The formation of＜solder flux 〉
As shown in Figure 2, solder flux F is by in order to remove oxide that welding produces or nuisance, weld part and atmospheric isolation to be opened, the weld part shape is carried out purpose such as integer and pulverous material of using constitutes.Solder flux F for example comprises the liner solder flux F1 and these two kinds of the bottom liner solder flux F2 that is laid on liner solder flux F1 downside of the dorsal part that is laid on bonding wire M (with reference to figure 1).The recovery that liner solder flux F1 and bottom liner solder flux F2 are separately stored in recovery dissemination apparatus 50 described later is respectively scattered in the funnel 52 of chassis 51 and is handled upside down, and scatters, lamination is on groove 40.Afterwards, when welding, supply the liner solder flux F1 on upper strata to connect airtight in the rear side of the weld part of soldered material E (with reference to figure 1).
" formation of soldered material "
As shown in Figure 1, soldered material E be uses such as boats and ships have a large-area steel plate etc., Yi Bian for example constitute by the large-scale metal system flat-sheet material that is the length of 10～30m.Combination forms this soldered material E by the bonding wire M of the steel plate of a certain size of bonding machine 30 welding.
" formation of bonding machine "
As shown in Figure 1, bonding machine 30 is configured in the top of pallet device 10, is the machinery that meets soldered material E from the table face down bonding of bonding wire M.Bonding machine 30 possesses: the length direction along the backing plate parts 11 of pallet device 10 extend the bonding machine driving car 31 that travels on the bonding machine beam 101 that is provided with, movably be installed in adjustment anchor clamps 32 on the bonding machine driving car 31, be installed in the welding gun of adjusting on the anchor clamps 32 33.
And, rigid bearing 31a on bonding machine driving car 31, move with guide rail 32a and move by be arranged on the bonding machine of adjusting on the anchor clamps 32 through fixing bearing 31a, adjust anchor clamps 32 and on the width of backing plate parts 11, move, thereby the welding gun 33 that is installed on the adjustment anchor clamps 32 moves.
" formation of chassis framework "
As Fig. 2 and shown in Figure 3, chassis framework 104 is the angle of steel material framework is got up and to be in cross sectional view that concavity ground forms, open interior support pallet device 10 and extend the framework of setting along the length direction of pallet device 10 up.Chassis framework 104 possesses: two girder 104a that are set up in parallel along its length; At right angles be attached at the binding beam 104b between girder 104a, the 104a; Vertically erect and be arranged on the binding beam 104c that links on the beam 104b; The floor stringer 104d, the 104d that above girder 104a, 104a, be arranged in parallel respectively; And from floor stringer 104d, 104d towards the outstanding cantilever beam 104e of the opposition side of pallet device 10.In addition, chassis framework 104 is provided with wheel 108 below binding beam 104b, be set up in parallel on a plurality of bar-shaped guide rail 107 on the length direction of pallet device 10 and move separating predetermined distance by wheel 108, chassis framework 104 moves on the width of pallet device 10.
Soldered material carrying and fixed mechanism 105 are configured in the top of the floor stringer 104d of chassis framework 104, and soldered material E (with reference to figure 1) is moved horizontally, and soldered material carrying and fixed mechanism 105 move roller 105a and magnet arrangement 105b etc. by panel and constitute.In addition, for the carrying of auxiliary soldered material carrying and 105 couples of soldered material E of fixed mechanism (with reference to figure 1), dispose help roll 106 on the top of chassis framework 104 (cantilever beam 104e).
" formation of pallet device "
As shown in Figure 1, pallet device 10 is solder flux F to be crimped onto the device at the back side that makes the bonding wire M that described soldered material E, E dock each other, and is arranged on the one side welding device 1 that carries out single face submerged-arc welding.
As shown in Figure 3, the steam hose 25 that pallet device 10 possesses backing plate parts described later 11 respectively and makes these backing plate parts 11 rise and descend, and be set at supporting structure 20 above.
" formations of backing plate parts "
As shown in Figure 3, backing plate parts 11 are to be crimped onto the part at the back side of bonding wire M with being accommodated in solder flux F in the groove 40.These backing plate parts 11 for example constitute by being accommodated in the member of pallet device 10 that solder flux F in the groove 40 are crimped onto the grooved (trough type) at the back side of bonding wire M.Backing plate parts 11 possess solder flux F, keep groove 40 and the groove framework 41 of solder flux F.As shown in Figure 4, dispose recovery dissemination apparatus 50 on the top of pallet device 10, reclaim dissemination apparatus 50 and on the direction of bonding wire M, move (with reference to figure 1) freely, reclaim dissemination apparatus 50 and supply with liner solder flux F1 and bottom liner solder flux F2 to groove 40.
" formation of groove "
As shown in Figure 4, groove 40 is to be made of rectangular container-like member, is used to support the solder flux F that supplies with from recovery dissemination apparatus 50, and this solder flux F is supplied to the position of the below of bonding wire M (with reference to figure 1).Groove 40 is along bonding wire M configuration, and form in front view, roughly be U word shape, in vertical view roughly linearly groove, groove 40 constitutes by having stable on heating elastomer.In a pair of groove scaffold 41a of groove framework 41, the inboard, two upper ends of 41a, clipping the both upper ends thereof portion of this groove 40, be close under the state of fixed head 41b, groove 40, groove scaffold 41a and fixed head 41b fixture 41c together fix, thus, with the mode configured slot 40 between two upper ends that are erected at groove scaffold 41a, 41a.The material of distortion formed when the bottom of groove 40 divided the expansion by the first steam hose 25a by configuration below dividing in the bottom of groove 40 or the second steam hose 25b to be urged upward.
" formation of groove framework "
As shown in Figure 5, groove framework 41 is the frame parts that keep the left and right end portions of groove 40.Groove framework 41 will be fixed as the lower member one and form, and described parts have: the groove scaffold 41a, the 41a that erect setting in the left and right sides of groove 40; Be used for groove 40 is fixed on fixed frame 41b, 41b on this groove scaffold 41a, the 41a; Be used for fixed frame 41b, 41b are fixed on fixture 41c, 41c on groove scaffold 41a, the 41a; Make described groove scaffold 41a, 41a erect the support plate 42 of setting, central portion hangs down below support plate 42 guide bar 24 and recovery described later and scatter the track 44 (with reference to figure 6) that the wheel 59 of chassis 51 rolls.This groove framework 41 constitutes by the expansion of the 3rd ventilation flexible pipe 25c and contraction and lowering or hoisting gear 26 these two kinds of lifting means and can rise and descend.
" formation of steam hose "
As Fig. 4 and shown in Figure 5, steam hose 25 is flexible pipes of alterable height by sending into compressed-air actuated expansion in this steam hose 25 or contraction.The effect of the lowering or hoisting gear of lifting thereby steam hose 25 plays in order to make the groove 40 of taking in solder flux F rise directly or indirectly and descend solder flux F is crimped onto the back side of bonding wire M of soldered material E.
For example, steam hose 25 is made of three kinds of flexible pipes, and these three kinds of flexible pipes are one first steam hose 25a, second a steam hose 25b and two the 3rd ventilation flexible pipe 25c, add up to four flexible pipes.The first steam hose 25a, the second steam hose 25b and the 3rd ventilation flexible pipe 25c are connected to pressue device (diagram is omitted), thus supply compressed air.
The first steam hose 25a, the second steam hose 25b, flexible pipe band (diagram is omitted) and flexible pipe band are fixing year to be located at below the groove 40 of cross section U word shape with clip (diagram is omitted) at the interior end that forms the groove framework 41 that is concavity when the cross section is seen.The first steam hose 25a and the second steam hose 25b between the top of groove 40 and groove framework 41 with following state along the configuration of the length direction of groove framework 41, to be diameter be overlapping state about vertical arrangement ground less than the second steam hose 25b of the first steam hose 25a and the first steam hose 25a to described state.
" formation of supporting structure "
As shown in Figure 5, supporting structure 20 is the frameworks that carry backing plate parts 11 on top, and disposes along bonding wire M.Supporting structure 20 possesses: the length direction along backing plate parts 11 extends the top board 23 that is provided with; The vertical side plate 22,22 that is located at the width both sides of top board 23; Level is attached at the base plate 21 between two sides' the side plate 22,22; Be arranged on the chain support rails 71,72 on a side the side plate 22; And be arranged on the top of chain support rails 71,72 and suppress solder flux F and drop to cover 29 on the annular link chain (not shown).
As shown in Figure 3, base plate 21 is supported on the backing plate roller 27a of portion that is disposed at pallet framework described later 27 tops, is used for the position of adjusting pad plate member 11 with respect to the width of bonding wire M.At this base plate 21, the limiting section 24a of the guide bar 24 during rising is connected to base plate 21.And, supporting structure 20 under the effect that possesses the supporting construction body drive of the holding section that is sticked in base plate 21 (diagram omit) on the backing plate roller 27a of portion (with reference to figure 2) broad ways move horizontally.
" formation of pallet framework "
As shown in Figure 3, pallet framework 27 is configured under the supporting structure 20 and is the framework of case shape roughly along the framework of vertical direction lifting, and it is supported by lowering or hoisting gear 26, and disposes the backing plate roller 27a of portion on top.Pallet framework 27 has: extend the following framework 27b that is provided with at width; Form side frame 27c, the 27c of ladder shape at the two ends of following framework 27b; And a pair of grip block 27d, 27d between side frame 27c, 27c.
" reclaiming the formation of solder flux Handling device "
As shown in Figure 3, reclaiming solder flux Handling device 28 is to be configured in the solder flux F that uses recovery that scrapes after the inboard and welding with bonding wire M of pallet framework 27 and the Handling device of carrying, and reclaims solder flux Handling device 28 and for example is made of screw conveyor (screw conveyor).Reclaiming solder flux Handling device 28 possesses: the rake 28a that opens to V word shape is expanded in the top to pallet framework 27; And the spiral helicine Handling device 28b of portion that the solder flux F that reclaims is discharged to the outside.
" reclaiming the formation of dissemination apparatus "
As shown in Figure 6, reclaiming dissemination apparatus 50 is to be used for carrying, be dispersed in liner solder flux F1 and bottom liner solder flux F2 that soldered material E, E are used each other when bonding wire M carrying out single-sided welding, and the device of the recovery of the liner solder flux F1 after will using.Reclaiming dissemination apparatus 50 possesses: liner solder flux F1 and bottom liner solder flux F2 are spread to respectively on the groove 40 (with reference to figure 5), and chassis 51 is scattered in the recovery that the liner solder flux F1 that uses that will solidify scrapes and reclaims; By driving not shown chain or band supporting structure 20 is moved along its length direction, reclaim the driving mechanism (diagram is omitted) that scatters chassis 51 and move thereby make with CD-ROM drive motor (diagram is omitted); And link this driving mechanism and reclaim the traction carriage 53b that scatters chassis 51.
The formation of chassis is scattered in＜recovery 〉
As shown in Figure 6, reclaiming distribution chassis 51 is to carry the chassis that funnel 52 is set and travels on track 44 along bonding wire M.Reclaiming distribution chassis 51 possesses: the funnel 52 that accumulates liner solder flux F1 and bottom liner solder flux F2, lift-launch is provided with the chassis main body 53 of funnel 52, the curing solder flux that is provided with a side of the carrying direction (bonding wire M direction) of chassis main body 53 scrapes device 54, be used to adjust the distribution mouth 57a of solder flux F, the apparatus for adjusting position 55 of the position of 58a, the scraper 56 that is provided with in the bottom, front and back of chassis main body 53, be arranged on the chassis main body 53 and link traction carriage 53b the other end tractive unit 53a and at the wheel 59 of track 44 first-class rollings.
" reclaiming the formation of scattering chassis "
Reclaiming distribution chassis 51 mainly possesses: the funnel 52 that accumulates two kinds of solder flux F, establish demarcation strip 52g in it, demarcation strip 52g is divided into incorporating section 52a at liner solder flux incorporating section 52b that accumulates liner solder flux F1 and the bottom liner solder flux incorporating section 52c that accumulates bottom liner solder flux F2; Open and close valve 57,58, it is used to scatter liner solder flux F1 and bottom liner solder flux F2.
" formation of funnel "
As shown in Figure 6, funnel 52 is the parts with the container-like incorporating section 52a that accumulates solder flux F, and is carried on recovery distribution chassis 51.Funnel 52 mainly possesses funnel body 52d, and funnel body 52d has top and expands the incorporating section 52a that open form becomes.
The formation of＜funnel body 〉
As shown in Figure 9, the appearance and size of height H, length L and the width W of the funnel integral body of funnel 52 is below the predefined given size.The width of interior end 52h, the 52h ' of this funnel 52 forms the length of 1/5W of the width W of top opening port 52e, 52e '.And the length of the carrying direction of interior end 52h, 52h ' forms the length of the L identical with the length of the carrying direction of top opening port 52e, 52e '.And the inwall of the front and back of funnel 52 is not formed by vertical walls 52j, 52j '.And then the whole area S2 of interior end 52h, the 52h ' of funnel 52 forms the size more than 20% of area S1 of the integral body of top opening port 52e, 52e '.Therefore, the area S2 of end 52h, 52h ' followed therewith with respect to the big shape of magnitude proportion of the area S1 of top opening port 52e, 52e ' in funnel 52 formed, and formed the big shape of internal capacity (solder flux F accumulate capacity) of funnel 52.
The formation of＜incorporating section 〉
As Fig. 6 and shown in Figure 7, incorporating section 52a forms roughly the accommodation space of quadrangle cone shape.This incorporating section 52a is divided into the liner solder flux incorporating section 52b that takes in liner solder flux F1 and takes in these two parts of bottom liner solder flux incorporating section 52c of bottom liner solder flux F2.
The formation of＜top opening port 〉
The formation of＜bottom opening port 〉
In addition, as shown in Figure 9, the total of maximum open area S3, S3 when bottom opening port 52f, 52f ' form maximum the opening is more than 10% of area S1 of the integral body of top opening port 52e, 52e '.
The formation of＜demarcation strip 〉
As Fig. 6 and shown in Figure 7, described demarcation strip 52g is by constituting from top opening port 52e, 52e ' in the funnel 52 to interior end 52h, 52h ' towards the vertically disposed flat board member of width.
The formation of＜open and close valve 〉
As shown in Figure 7, open and close valve the 57, the 58th at the bottom opening port 52f of interior end 52h, the 52h ' of funnel body 52d formation, a pair of valve that 52f ' opens and closes, for example is a slidingtype.Open and close valve 57,58 is by constituting at the valve body of substantially planar of below that width is slidingly arranged in interior end 52h, the 52h ' of funnel 52, open by manually or automatically moving in the horizontal direction, thereby scatter liner solder flux F1 and bottom liner solder flux F2 respectively.
The open and close valve of using at liner solder flux F1 57 is formed with and slides and the operating portion 57b of operator's operation dominated by hand when discharging the distribution mouth 57a of liner solder flux F1 and switching with bottom opening port 52f, when 52f ' overlaps.Same therewith, the open and close valve of using at bottom liner solder flux F2 58 is formed with and slides and the operating portion 58b of operator's operation dominated by hand when discharging the distribution mouth 58a of bottom liner solder flux F2 and switching with bottom opening port 52f, when 52f ' overlaps.That is, open and close valve 57 and open and close valve 58 are same structures, front and back alignment arrangements in the 52a of incorporating section.
Scatter mouthful 57a, 58a and be formed with a plurality ofly towards the carrying direction reclaiming the central portion that scatters chassis 51, and on the carrying direction, form a line along bonding wire M.That is, scatter mouthful 57a, a 58a and in interior end 52h, the 52h ' of funnel body 52d, be configured on the relative center line S of bonding wire M, and be arranged on groove 40, scatter solder flux F (with reference to figure 2) along bonding wire M.
The formation of＜chassis main body and tractive unit 〉
As shown in Figure 6, chassis main body 53 is to form the frame structure body that reclaims the main body of scattering chassis 51, is mainly formed by skeletal frame that forms skeleton and the metal panel that is fixed on this skeletal frame.On chassis main body 53, be provided with: the tractive unit 53a that traction carriage 53b is installed; Described funnel 52; The solder flux that scrapes the unwanted solder flux F such as solder flux F of curing scrapes device 54; The apparatus for adjusting position 55 of the position of distribution mouth 57a, the 58a of adjustment solder flux F; Scraper 56; Described switching 57,58 and wheel 59.
＜solder flux scrapes the formation of device 〉
It is the parts that are used to scrape the liner solder flux F1 that uses of the curing on the low water 40 that solder flux scrapes device 54.Solder flux scrapes device 54 to be possessed: with respect to carrying the blade 54a that direction is obliquely installed; And be arranged on that described blade 54a goes up and leading section is inserted into broach 54b among the solder flux F in the groove 40.Solder flux scrapes device 54 and is provided in upward movable (with reference to figure 6) such as above-below directions.
In addition, as shown in Figure 5, the jack-up groove 40 by the second steam hose 25b is expanded, thus under the state that solder flux F is held high from the upper end of groove framework 41, scrape the solder flux F of curing.
The formation of＜apparatus for adjusting position 〉
As shown in Figure 6, apparatus for adjusting position 55 is the parts of height that are used for regulating distribution mouth 57a, the 58a of solder flux F, and possesses to be used to make and scatter the binding parts 55a that mouthful 57a, 58a move up and down and be arranged on operating handle 55b on these binding parts 55a.When scattering solder flux F, rotating operation handle 55b uses under the decline state and scatters mouth 57a, a 58a, when recovery solder flux F, makes operating handle 55b counter-rotating, makes and scatters mouthful 57a, a 58a rising, thereby distribution mouthful 57a, a 58a are kept out of the way from groove framework 41.
The formation of＜scraper 〉
The formation of＜wheel 〉
As Fig. 4 and shown in Figure 5, roller is after the solder flux F that uses that has solidified reclaims with wheel 59b, by described wheel 59b is rolled on bottom liner solder flux F2, push bottom liner solder flux F2 and depress groove 40 with appropriate pressing force, thus the device of the shape of adjustment groove 40.Wheel 59b is installed in the front of the carrying direction side of funnel body 52d by wheel support parts 59c, and wheel support parts 59c supports described wheel 59b and makes wheel 59b rotation freely.
" effect of one side welding device "
Below, the effect of one side welding device 1 of the present utility model is described with reference to figure 1～Fig. 9.
When welding with one side welding device 1 of the present utility model, before carrying out weld job, carry out preparatory process such as supply earlier as the solder flux F of its preparation, at this moment, use to reclaim and scatter chassis 51.
Recovery beyond when as shown in Figure 7, scattering distribution before the solder flux F is scattered chassis 51 and is in open and close valve 57,58 and is pressed towards the valve state that closes that closes valve direction (arrow A direction).At this moment, scattering mouthful 57a, a 58a staggers from bottom opening port 52f, 52f '.Therefore, liner solder flux F1 in liner solder flux incorporating section 52b and the bottom liner solder flux incorporating section 52c and bottom liner solder flux F2 can not discharge from scattering mouthful 57a, 58a.
Fig. 9 is the approximate three-dimensional map that the funnel 52 of chassis 51 is scattered in expression recovery of the present utility model.Figure 10 is the approximate three-dimensional map that the comparative example of the funnel 520 that scatters chassis 510 is reclaimed in expression.
At this, describe for the capacity that accumulates of the solder flux F that accumulates capacity and funnel of the present utility model 52 of the solder flux F of the funnel 520 of comparative example with reference to figure 9 and Figure 10.
As Fig. 9 and shown in Figure 10, the funnel 52,520 of the utility model and comparative example measure-alike, the length of top opening port 52e, 520e ' is L, width is W, highly is H.That is, the integral body of funnel 52,520 big or small identical forms the appearance and size of the regulation that is predetermined.
The funnel 520 of comparative example shown in Figure 10 is to be used for the funnel that the size of chassis 510 is scattered in general recovery, and the length of interior end 520h, 520h ' is 1/5L～1/4L, and width is 1/5W.That is, funnel 520 is the shape of roughly falling quadrangular pyramid that the length of carrying direction and width dwindle towards downside when main apparent time and side-looking.Therefore, the area S10 of the top opening port 520e of funnel 520 is:
S10＝W×L
With respect to this, the area S20 of interior end 520h, 520h ' is the shape that reduces significantly, is:
S20＝1/5W×1/4L
In addition, the area S20 of end 520h, 520h ' in being matched with, the area S30 of bottom opening port also diminishes.
The result is that the capacity V10 that accumulates of the funnel 520 of comparative example is:
With respect to this, funnel 52 of the present utility model be when side-looking, be rectangle, the identical shape of length L of the length L of the carrying direction of interior end 52h, 52h ' and top opening port 52e, 52e '.That is, the length L of the carrying direction of interior end 52h, 52h ' forms the above length of 1/2L of length of the carrying direction of top opening port 52e, 52e ', and is longer than the length of the carrying direction of interior end 520h, the 520h ' of comparative example.
About the width of interior end 52h, 52h ', because the distribution width of solder flux F is identical, thus identical with the funnel 520 of comparative example, be 1/5W.
In addition, the length L of the carrying direction of end 52h, 52h ' in the length L 1+L2 of the carrying direction of bottom opening port 52f, 52f ' can be matched with and form longlyer forms the length more than 1/5 of length L of the carrying direction of top opening port 52e, 52e '.
That is, the interior end 52h of funnel 52 of the present utility model, the area S2 of 52h ' are S2=L * 1/5W, and form the size more than 20% of the area S1 of top opening port 52e, 52e '.Therefore, the capacity V that accumulates of funnel 52 of the present utility model is V=3/5W * L * H, compares with the capacity V10 that accumulates of the funnel 520 of comparative example, be its 1.5 times accumulate capacity.Therefore, funnel 52 of the present utility model is compared with the funnel 520 of comparative example, and it is big to accumulate capacity, therefore can once carry a large amount of solder flux F.
And, under the situation of scattering solder flux F, as shown in Figure 2, scatter the groove 40 supply solder flux Fs of chassis 51 to backing plate parts 11 from the recovery of stow solder flux F.At this moment, as shown in Figure 4, steam hose 25 is in the state of contraction.Therefore, groove framework 41 is in support plate 42 and is positioned in the upper end of side plate 22,22 and the state of decline.When supplying with solder flux F, make drive unit (diagram is omitted) driving and make to reclaim and scatter chassis 51 to a direction running, scatter solder flux F simultaneously.
Under the situation of scattering solder flux F, the open and close valve that closes the valve state shown in Figure 7 57,58 is pulled to the open direction of arrow B.So as shown in Figure 8, open and close valve 57,58 moves to valve opening position (arrow B direction), a plurality of distribution mouth 57a, 58a and bottom opening port 52f, 52f ' overlaps and be in open connected state.So liner solder flux F1 in liner solder flux incorporating section 52b and the bottom liner solder flux incorporating section 52c and bottom liner solder flux F2 discharge and scatter from scattering mouthful 57a, 58a.
And, as shown in Figure 5, to steam hose 25 injecting compressed airs it is expanded by pressue device (diagram is omitted), the solder flux F in the groove 40 is risen, thereby be crimped onto the dorsal part of the bonding wire M of soldered material E.Under this state, as shown in Figure 1, Yi Bian bonding machine 30 is moved with fixing speed on bonding machine beam 101, the backing plate parts 11 of the bonding wire M crimping pallet device 10 of the soldered material E in an edge, implement single-sided welding from the table side of bonding wire M with welding gun 33, weld soldered material E, E.
Then, under situation, discharge the air in the steam hose 25,25, groove framework 41 and groove 40 are descended, solder flux F is left from the dorsal part of soldered material E with a plurality of bonding wire M.Then, pallet framework 27 is descended, backing plate parts 11 are further descended from the dorsal part of soldered material E, solder flux F is left from the back side of soldered material E by lowering or hoisting gear 26.Afterwards, remove the part that uses of solder flux F on the groove 40.That is, after with bonding machine 30 welding, solder flux F solidifies because of sweating heat, so for welding next time, must remove the solder flux F that has solidified.
When removing deflux F, scatter chassis 51 from recovery shown in Figure 6 and drop under the state on the groove 40 making solder flux scrape device 54, scatter chassis 51 and travel by making to reclaim, scrape device 54 with solder flux and will scrape at the solder flux F after the use of solidifying on the groove 40 and remove.
Meanwhile, the solder flux F that removes as shown in Figure 3, when described recovery distribution chassis 51 is travelled, utilize solder flux to scrape device 54 (with reference to figure 6) solder flux F is dropped on the recovery solder flux Handling device 28 from groove 40, the recovery place that is transported to regulation by the 28b of Handling device portion is reclaimed, is discarded.
Afterwards, pulling open and close valve 57,58 reclaim to scatter chassis 51 and travels making to make under bottom opening port 52f, the 52f ' opened state, carries out to the secondary solder flux supply that replenishes new solder flux F on the groove 40.
Carry out repeatedly such action till bonding wire M disappears.And when reclaim scattering chassis 51 carrying solder flux F and scatter, can disposable carrying a large amount of solder flux F also scatters the solder flux F of appropriate amount.Follow therewith, can cut down the operation number of times that replenishes solder flux F to funnel 52 stows, therefore, can improve operating efficiency.
Embodiment of the present utility model more than has been described, but the utility model is not limited to described embodiment, in the scope that does not break away from purport of the present utility model, can suitably changes.
For example, in said embodiment, describe as example with the one side welding device 1 of the pallet device 10 that possesses the grooved that uses groove 40, but also can be the device that pallet device 10 uses the copper coin type of backing plate copper coins.
In addition, as Fig. 6～shown in Figure 8, described demarcation strip 52g can be designed to respect to incorporating section 52a loading and unloading freely.For example, under the situation of the pallet device 10 of the copper coin type that possesses backing plate copper coin (diagram omit), owing to only use a kind of liner solder flux F1, so incorporating section 52a can have one.Therefore, under the situation of the pallet device 10 of copper coin type, can not possess demarcation strip 52g.At this moment, be matched with incorporating section 52a, can make open and close valve 57,58 one turn to one.
Claims (6)
1. one kind is reclaimed dissemination apparatus, it possesses the distribution of recovery chassis, described recovery distribution chassis carries and is provided with the funnel that accumulates solder flux, described solder flux is using when the bonding wire that soldered material is docked each other carries out single-sided welding, described recovery is scattered chassis and is moved along described bonding wire, and described recovery dissemination apparatus scatters described solder flux, reclaims the solder flux that uses, wherein
Described funnel has: towards the top of top opening opening port, the bottom opening port that forms at the interior end of described funnel and the open and close valve that described bottom opening port is opened and closed,
The length of the carrying direction of described bottom opening port forms the length more than 1/5 of length of the carrying direction of described top opening port,
The area at the end forms the size more than 20% of the area of described top opening port in described.
2. recovery dissemination apparatus as claimed in claim 1, wherein,
The inwall of the front and back of the carrying direction side of described funnel vertically forms.
3. recovery dissemination apparatus as claimed in claim 1, wherein,
The maximum open area of described bottom opening port when maximum is open forms more than 10% of area of described top opening port.
4. recovery dissemination apparatus as claimed in claim 1, wherein,
Described solder flux is made of for these two kinds the liner solder flux of the dorsal part of the described bonding wire that is laid on described soldered material and the bottom liner solder flux that is laid on the downside of liner solder flux,
Described funnel possesses and will be divided into the liner solder flux incorporating section of taking in described liner solder flux in this funnel and take in the demarcation strip of the bottom liner solder flux incorporating section of described bottom liner solder flux,
Described open and close valve is separately positioned on the below at the interior end of described funnel, makes described bottom opening port open and scatter described liner solder flux or described bottom liner solder flux.
5. recovery dissemination apparatus as claimed in claim 1, wherein,
Described open and close valve is configured in the below of described bottom opening port in the mode that can slide in the horizontal direction, and is formed with the distribution mouth of discharging described solder flux,
When in described open and close valve slip described distribution mouth being overlapped with described bottom opening port, described solder flux is by described bottom opening port and from described distribution mouthful distribution.
6. recovery dissemination apparatus as claimed in claim 5, wherein,
Described bottom opening port forms the long rectangle of carrying direction that scatters chassis in described recovery,
The described distribution mouthful carrying direction towards described recovery distribution chassis is formed with a plurality of, and described distribution mouth forms a line along described bonding wire.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-052355 | 2010-03-09 | ||
| JP2010052355A JP2011183436A (en) | 2010-03-09 | 2010-03-09 | Recovering and scattering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202021434U true CN202021434U (en) | 2011-11-02 |
Family
ID=44598709
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110042111.5A Active CN102189369B (en) | 2010-03-09 | 2011-02-17 | Reclaim dissemination apparatus |
| CN2011200425624U Expired - Lifetime CN202021434U (en) | 2010-03-09 | 2011-02-17 | Recovery dispersing device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110042111.5A Active CN102189369B (en) | 2010-03-09 | 2011-02-17 | Reclaim dissemination apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2011183436A (en) |
| CN (2) | CN102189369B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102189369A (en) * | 2010-03-09 | 2011-09-21 | 株式会社神户制钢所 | Recovery spreading device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102430879A (en) * | 2011-09-30 | 2012-05-02 | 上海市电力公司 | Device and method for preventing melted beads from electrical welding from igniting combustible to cause fire disaster |
| CN108857189B (en) * | 2018-08-31 | 2023-10-24 | 中冶建工集团有限公司 | Welding fire receiving basin convenient for slag discharge |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3930793B2 (en) * | 2002-09-30 | 2007-06-13 | 株式会社神戸製鋼所 | Single-side welding equipment |
| JP4407943B2 (en) * | 2004-12-20 | 2010-02-03 | 株式会社神戸製鋼所 | Backing device for single-sided automatic welding and single-sided automatic welding method |
| JP4859745B2 (en) * | 2007-04-26 | 2012-01-25 | 株式会社神戸製鋼所 | Single-side welding equipment |
| CN101053919A (en) * | 2007-05-28 | 2007-10-17 | 无锡华联精工机械有限公司 | Automatic cleaning spreading for single side welding double-faced forming welding mechanism back face welding agent |
| JP2011183436A (en) * | 2010-03-09 | 2011-09-22 | Kobe Steel Ltd | Recovering and scattering device |
-
2010
- 2010-03-09 JP JP2010052355A patent/JP2011183436A/en active Pending
-
2011
- 2011-02-17 CN CN201110042111.5A patent/CN102189369B/en active Active
- 2011-02-17 CN CN2011200425624U patent/CN202021434U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102189369A (en) * | 2010-03-09 | 2011-09-21 | 株式会社神户制钢所 | Recovery spreading device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011183436A (en) | 2011-09-22 |
| CN102189369A (en) | 2011-09-21 |
| CN102189369B (en) | 2015-12-02 |
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| CX01 | Expiry of patent term |
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