CN201993789U - Production equipment for anti-counterfeiting IC (Integrated Circuit) card - Google Patents
Production equipment for anti-counterfeiting IC (Integrated Circuit) card Download PDFInfo
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- CN201993789U CN201993789U CN2010206007406U CN201020600740U CN201993789U CN 201993789 U CN201993789 U CN 201993789U CN 2010206007406 U CN2010206007406 U CN 2010206007406U CN 201020600740 U CN201020600740 U CN 201020600740U CN 201993789 U CN201993789 U CN 201993789U
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Abstract
The utility model relates to production equipment for an anti-counterfeiting IC (Integrated Circuit) card, which is used for producing the IC card and carrying out IC-chip packaging through an adhesive with high bonding force, high resistant temperature and strong corrosion resistance to prevent the IC card from being molten and the molten IC card from being counterfeited. On the basis of a traditional IC-card packaging machine, a glue-dripping program-controlled machine is added, IC-card packaging is carried out through a GDIC adhesive, and the industry technical bottlenecks of low resistant temperature, weak corrosion resistance and easy counterfeited-card manufacture of a traditional IC card are overcome, so that in the IC-card packaging process, not only can the stability and the yield of IC-card packaging be kept, but also the counterfeited-card manufacturing difficulty of the IC card can be greatly enhanced. The equipment comprises card-base production equipment, a slot-milling device, an IC-chip glue-preparing device, the glue-dripping program-controlled machine, an IC-chip hot-pressing device, an IC-chip cold-pressing device and a card-discharging device; and the glue-dripping program-controlled machine comprises a glue-dripping control device, a master control device, a light-sensitive inducing device, a pneumatic device, a glue-dripping device, a card-feeding tray and a worktable.
Description
Technical field
The utility model belongs to transactional cards manufacturing equipment technical field, relates in particular to the production equipment that a kind of antifalse is made IC-card, is used for the automated production of anti-counterfeiting IC-card.
Background technology
Along with the popularization and application of IC-card, IC-card has been widely used in fields such as finance, social security, traffic, and pseudo-simultaneously card swindle phenomenon is also more and more, and the fraud loss amount is also increasing.
IC-card production implementation method generally comprises following five steps in the prior art:
The first step: IC-card card base is produced;
Second step: IC-card card base groove milling;
The 3rd step: the IC chip is equipped with hot melt adhesive;
The 4th step: IC chip hot pressing;
The 5th step: the IC chip is colded pressing.
Be by the hot melt adhesive pressing between IC chip and the Ka Ji, hot melt adhesive is a kind of solvent, polymkeric substance of water content, 100% solid meltability not of not needing, be solid at normal temperatures, heating and melting is light brown translucent body or this white after its fusion to a certain degree becoming the liquid adhesive that can flow and have certain viscosity.
Hot melt adhesive has following characteristics:
1. at room temperature be generally solid, fusion is a liquid when being heated to a certain degree, in case be cooled to below the fusing point, becomes solid again rapidly, (promptly solidifying again);
2. have quick solidifying, public hazards are low, clinging power is strong, the existing certain flexibility of glue-line, hardness, again certain toughness arranged;
3. glue spreads upon the glue-line behind the cooling curing on the adherend, and heating and melting becomes adherent again and bonds with adherend more again, has certain viscosity again;
4. when using,, and spread upon on the adherend body, after pressing, in seconds just can finish adhesive solidification, just can reach the degree of sclerosis cool drying in a few minutes as long as the hot melt adhesive heating and melting is become required liquid state.
Have reversible characteristics according to hot melt adhesive, under the situation more than 70 ℃, the hot melt adhesive between IC chip and the Ka Ji begins to soften, and can easily former IC chip piece be taken off from blocking base.
Therefore adopt the IC-card that IC-card packaging technology and implementation method are produced in the prior art, have great potential safety hazard, mainly include but not limited to following three kinds of pseudo-making methods:
Pseudo-making method 1, its IC chip can take off former IC chip piece under hot-water soak easily from blocking base, change then and forge the IC chip, and former IC chip can the normal use in applying back on forgery card base.
Pseudo-making method 2, its IC chip can take off former IC chip piece in flatiron wet ironing process easily from blocking base, change then and forge the IC chip, and former IC chip can the normal use in applying back on forgery card base.
Pseudo-making method 3, its IC chip can take off former IC chip piece under chemical solvent soaks easily from blocking base, change then and forge the IC chip, and former IC chip can block the normal use in back of fitting on the base in forgery.
In order to improve the anti-counterfeiting technology of IC-card, need the manufacture method and the equipment of IC-card be improved.
Summary of the invention
The purpose of this utility model is the deficiency at existing IC-card anti-counterfeiting technology, a kind of production equipment of anti-counterfeiting IC-card is provided, in order to produce IC-card, make IC chip and card have bonding strength height, heatproof height, corrosion resistance between the base and reach characteristics such as high temperature is irreversible by force, the IC chip of the IC-card after the encapsulation can't be separated from blocking base, thereby prevent the pseudo-generation that blocks.
The utility model is achieved through the following technical solutions:
The production equipment of anti-counterfeiting IC-card includes: block that basic production equipment, slotting attachment, IC chip are equipped with adhesive dispenser, drip that glue is programme-controlled, IC chip hot-press arrangement, IC chip cold press device and emerging device; Described glue drips glue control device, master control device, light-inductive device, pneumatic means, Beverage bottle cover and card feed pallet and worktable programme-controlled comprising; Described master control device, a glue control device and card feed pallet are placed on the table top of worktable, pneumatic means and light-inductive device are separately fixed on the worktable by fastener, pneumatic means and light-inductive device be positioned at the card feed pallet directly over, Beverage bottle cover is fixed on the pneumatic means by positioning fixture; Described glue control device, pneumatic means and light-inductive device are connected by data line with the master control device, and Beverage bottle cover is connected the motor-driven Beverage bottle cover vertical moving of pneumatic means with a glue control device with the bonding agent conduit by data line.
The beneficial effects of the utility model are as follows:
The production equipment of anti-counterfeiting IC-card of the present utility model, the anti-counterfeiting IC-card of production, include sheet the card base, from the card primary surface to recessed vallecular cavity and IC chip; Described IC chip embeds in the vallecular cavity, and the IC chip is combined in the vallecular cavity wall by melt viscosity; Wherein, also accommodate high-intensity bonding agent between the bottom of described vallecular cavity and the IC chip.Described vallecular cavity includes bottom vallecular cavity and first floor vallecular cavity, and the width dimensions of described first floor vallecular cavity is greater than the width dimensions of bottom vallecular cavity, and is consistent with the stepped cross-section shape of IC chip; It between first floor vallecular cavity and the IC chip the bonding layer of hot melt adhesive; Be the bonding agent adhesive linkage between bottom vallecular cavity and the IC chip.
The production equipment of anti-counterfeiting IC-card of the present utility model, the IC-card of production is owing to also accommodate high-intensity bonding agent between the bottom of vallecular cavity and the IC chip; Vallecular cavity includes bottom vallecular cavity and first floor vallecular cavity, and the width dimensions of described first floor vallecular cavity is greater than the width dimensions of bottom vallecular cavity, and is consistent with the stepped cross-section shape of IC chip; It between first floor vallecular cavity and the IC chip the bonding layer of hot melt adhesive; Be the bonding agent adhesive linkage between bottom vallecular cavity and the IC chip.The utility model has adopted the GDIC bonding agent, bond strength, corrosion resistance and temperature tolerance are much better than traditional hot-melt adhesive, and has the irreversible characteristic of high temperature, make the IC chip have bonding strength height, heatproof height, corrosion resistance and reach the irreversible characteristics of high temperature by force with the card base, make the IC-card after the encapsulation can't be by means such as forgery such as heating grade, the IC chip is separated from IC-card card base, thereby prevent the pseudo-generation that blocks.
Because to have increased a glue programme-controlled, make to keep stability, reliability and the yield of IC-card encapsulation in the IC-card encapsulation process, and can not influence the production efficiency that IC-card is produced.
Because it is programme-controlled to increase a glue on traditional IC-card packaging machine, does not need to redesign the IC-card packaging machine, maximum using has traditional IC-card packaging machine now, has the advantage of low cost of development.
Description of drawings
Fig. 1 is the structural representation of the anti-counterfeiting IC-card produced of the production equipment of the utility model anti-counterfeiting IC-card;
Fig. 2 is the production equipment framework synoptic diagram of the utility model anti-counterfeiting IC-card;
Fig. 3 is a programme-controlled structural representation of glue of the production equipment of the utility model anti-counterfeiting IC-card.
Description of reference numerals:
Bonding agent 1, bottom vallecular cavity 2, first floor vallecular cavity 3, hot melt adhesive 4, IC chip 5, card base 6, the basic production equipment 7 of card, slotting attachment 8, IC chip be equipped with adhesive dispenser 9, drip that glue is programme-controlled 10, IC chip hot-press arrangement 11, IC chip cold press device 12, emerging device 12, drip glue control device 14, master control device 15, light-inductive device 16, pneumatic means 17, Beverage bottle cover 18 and card feed pallet 19, worktable 20.
Embodiment
Below in conjunction with accompanying drawing and example the technical solution of the utility model is further described.
The utility model discloses a kind of anti-counterfeiting IC-card, ask for an interview Fig. 1, include the card base 6 of sheet, from blocking basic 6 surfaces to recessed vallecular cavity and IC chip 5; Described IC chip 5 embeds in the vallecular cavity, and IC chip 5 is bonded in the vallecular cavity wall by hot melt adhesive 4; Wherein, also accommodate high-intensity bonding agent 1 between the bottom of described vallecular cavity and the IC chip 5.
Described vallecular cavity includes bottom vallecular cavity 2 and first floor vallecular cavity 3, and the width dimensions of described first floor vallecular cavity 3 is greater than the width dimensions of bottom vallecular cavity 2, and is consistent with the stepped cross-section shape of IC chip 5; Between first floor vallecular cavity 3 and the IC chip 5 hot melt adhesive 4 adhesive linkages; It between bottom vallecular cavity 2 and the IC chip 5 bonding agent 1 adhesive linkage.
Described bonding agent 1 adopts the GDIC bonding agent, and promptly golden Bamda IC bonding agent has intensity height, heatproof height, corrosion resistance and reaches characteristics such as high temperature is irreversible by force, is applicable to adherent inert surface and IC-card card base.The characterisitic parameter of described bonding agent 1 is as follows:
1) heatproof reaches 120 ℃;
2) in 3 seconds, heatproof reaches 300 ℃;
3) bonding strength is 22MPa.
The IC-card card base that described card base 6 is made for a kind of PVC or PET or PETG or ABS material.
Referring to Fig. 2, produce the production equipment of above-mentioned anti-counterfeiting IC-card, include: block that basic production equipment 7, slotting attachment 8, IC chip are equipped with adhesive dispenser 9, drip that glue is programme-controlled 10, IC chip hot-press arrangement 11, IC chip cold press device 12 and emerging device 13.
Referring to Fig. 3, the sealed in unit of producing above-mentioned anti-counterfeiting IC-card includes that to drip glue programme-controlled 10, drips glue programme-controlled 10 and comprises and drip a glue control device 14, master control device 15, light-inductive device 16, pneumatic means 17, Beverage bottle cover 18 and card feed pallet 19 and worktable 20; Described master control device 15, a glue control device 14 and card feed pallet 19 are placed on the table top of worktable 20, pneumatic means 17 and light-inductive device 16 are separately fixed on the worktable by fastener, pneumatic means 17 and light-inductive device 16 be positioned at card feed pallet 19 directly over, Beverage bottle cover 18 is fixed on the pneumatic means 17 by positioning fixture; Described glue control device 14, pneumatic means 17 and light-inductive device 16 and master control device 15 are connected by data line, Beverage bottle cover 18 is connected motor-driven Beverage bottle cover 18 vertical moving of pneumatic means 17 with a glue control device 14 with the bonding agent conduit by data line.
Described master control device 15 is high speed and precision industrial computers, be used to control the duty of whole anti-counterfeiting IC-card automated production, include: CPU, driver, sender unit and signal receiver, master control device 15 is by power lead and data line and characteristics such as drip a glue control device 14, pneumatic means 17 links to each other with light-inductive device 16, and this industrial computer has high-speed computation, accurately controls, able to programme.
Described pneumatic means 17 includes: source of the gas, stop valve, reduction valve, tracheae, vacuum generator and positioning fixture; Source of the gas links to each other by tracheae with the air intake opening of stop valve, and the gas outlet of stop valve is communicated with reduction valve by tracheae, is communicated with vacuum generator again.Described pneumatic means 17 is by the variation of air pressure, and control positioning fixture vertical moving moves up and down thereby control Beverage bottle cover 18.
Described glue control device 14 comprises CPU, precision optical machinery meter and bonding agent conduit, the time parameter of the setting precision optical machinery meter of master control device 15 sends to signal by sender unit and drips glue control device 14, and the plastic emitting time and the gel quantity of glue control device 14 control bonding agent conduits dripped in instruction.
Described light-inductive device 16 comprises fixed support, light-inductive device and data line, and the light-inductive device is fixed on the worktable 20 by fixed support; The light-inductive device adopts visible light sensor, according to detecting the mobile status information of IC-card card base at the card feed pallet, sends signal to master control device 15.
The sealed in unit of the above-mentioned anti-counterfeiting IC-card of production of the present utility model, it is programme-controlled increase to drip glue on existing IC-card packaging machine basis, and it is programme-controlled to be that glue is dripped in a robotization.Do not need to redesign the IC-card packaging machine, maximum using has traditional IC-card packaging machine now, has the advantage of low cost of development.A glue that increases is programme-controlled, can not only keep stability, reliability and the yield of IC-card encapsulation in the IC-card encapsulation process, and can not influence the production efficiency that IC-card is produced.
Combining the above, for a kind of embodiment that the utility model used, is not to be used for limiting practical range of the present utility model only.Be that all equalizations of being done according to the utility model claim change and modification, be all the utility model claim and contain.
Claims (5)
1. the production equipment of anti-counterfeiting IC-card includes: block basic production equipment (7), slotting attachment (8), IC chip and be equipped with adhesive dispenser (9), IC chip hot-press arrangement (11), IC chip cold press device (12) and emerging device (13); It is characterized in that: also include and drip glue programme-controlled (10), described glue programme-controlled (10) comprises a glue control device (14), master control device (15), light-inductive device (16), pneumatic means (17), Beverage bottle cover (18) and card feed pallet (19) and worktable (20); Described master control device (15), a glue control device (14) and card feed pallet (19) are placed on the table top of worktable (20), pneumatic means (17) and light-inductive device (16) are separately fixed on the worktable by fastener, pneumatic means (17) and light-inductive device (16) be positioned at card feed pallet (19) directly over, Beverage bottle cover (18) is fixed on the pneumatic means (17) by positioning fixture; Described glue control device (14), pneumatic means (17) and light-inductive device (16) are connected by data line with master control device (15), Beverage bottle cover (18) is connected motor-driven Beverage bottle cover (18) vertical moving of pneumatic means (17) with a glue control device (14) with the bonding agent conduit by data line.
2. the production equipment of anti-counterfeiting IC-card as claimed in claim 1, it is characterized in that: described master control device (15) is a high speed and precision industrial computer, be used to control the duty of whole anti-counterfeiting IC-card automated production, include: CPU, driver, sender unit and signal receiver, master control device (15) links to each other with light-inductive device (16) with a glue control device (14), pneumatic means (17) with data line by power lead.
3. the production equipment of anti-counterfeiting IC-card as claimed in claim 2 is characterized in that: described pneumatic means (17) includes: source of the gas, stop valve, reduction valve, tracheae, vacuum generator and positioning fixture; Source of the gas links to each other by tracheae with the air intake opening of stop valve, and the gas outlet of stop valve is communicated with reduction valve by tracheae, is communicated with vacuum generator again.
4. the production equipment of anti-counterfeiting IC-card as claimed in claim 2, it is characterized in that: described glue control device (14) comprises CPU, precision optical machinery meter and bonding agent conduit, the time parameter of the setting precision optical machinery meter of master control device (15) sends to signal by sender unit and drips glue control device (14), and the plastic emitting time and the gel quantity of glue control device (14) control bonding agent conduit dripped in instruction.
5. the production equipment of anti-counterfeiting IC-card as claimed in claim 2 is characterized in that: described light-inductive device (16) comprises fixed support, light-inductive device and data line, and the light-inductive device is fixed on the worktable (20) by fixed support; The light-inductive device adopts visible light sensor, according to detecting the mobile status information of IC-card card base at the card feed pallet, sends signal to master control device (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206007406U CN201993789U (en) | 2010-11-09 | 2010-11-09 | Production equipment for anti-counterfeiting IC (Integrated Circuit) card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206007406U CN201993789U (en) | 2010-11-09 | 2010-11-09 | Production equipment for anti-counterfeiting IC (Integrated Circuit) card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201993789U true CN201993789U (en) | 2011-09-28 |
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ID=44670270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206007406U Expired - Lifetime CN201993789U (en) | 2010-11-09 | 2010-11-09 | Production equipment for anti-counterfeiting IC (Integrated Circuit) card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201993789U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102467677A (en) * | 2010-11-09 | 2012-05-23 | 珠海市金邦达保密卡有限公司 | Anti-counterfeiting integrated circuit (IC) card, and equipment and method for producing anti-counterfeiting IC card |
| US11933680B2 (en) | 2017-12-04 | 2024-03-19 | Greenvibe Wn Sensing Technologies Ltd. | System and method for detecting a modification of a compound during a transient period |
-
2010
- 2010-11-09 CN CN2010206007406U patent/CN201993789U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102467677A (en) * | 2010-11-09 | 2012-05-23 | 珠海市金邦达保密卡有限公司 | Anti-counterfeiting integrated circuit (IC) card, and equipment and method for producing anti-counterfeiting IC card |
| US11933680B2 (en) | 2017-12-04 | 2024-03-19 | Greenvibe Wn Sensing Technologies Ltd. | System and method for detecting a modification of a compound during a transient period |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110928 Effective date of abandoning: 20150930 |
|
| RGAV | Abandon patent right to avoid regrant |