CN201984915U - Alloy-foil type planar-installation high-power resistor - Google Patents
Alloy-foil type planar-installation high-power resistor Download PDFInfo
- Publication number
- CN201984915U CN201984915U CN2010206976128U CN201020697612U CN201984915U CN 201984915 U CN201984915 U CN 201984915U CN 2010206976128 U CN2010206976128 U CN 2010206976128U CN 201020697612 U CN201020697612 U CN 201020697612U CN 201984915 U CN201984915 U CN 201984915U
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- alloy foil
- power resistor
- alloy
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Details Of Resistors (AREA)
Abstract
The utility model discloses an alloy-foil type planar-installation high-power resistor, comprising a first ceramic substrate (1), a copper sheet (2), a second ceramic substrate (3), alloy foils (4), pins (5), an inner shell (6), an outer shell (7) and copper pillars (8), wherein the copper sheet (2) is welded on the first ceramic substrate (1); the second ceramic substrate (3) is welded on the copper sheet (2); the alloy foils (4) are bonded on the second ceramic substrate (3); the pins (5) are welded at the two ends of the alloy foil (4); and all the parts are integrally arranged in the inner shell (6), the inner shell is filled with silica gel, and the inner shell (6) and the copper pillars (8) are arranged on the outer shell (7). In the alloy-foil type planar-installation high-power resistor, the pulse tolerance characteristic is strong by adopting the laser-cutting alloy foils.
Description
Technical field
The utility model relates to the resistive technologies field, particularly relates to a kind of Alloy Foil chip Plane Installation Power Resistor.
Background technology
In electric equipment, wirewound resistor commonly used is because of its intrinsic cylindrical-shaped structure, makes it can't be directly and system radiating plate (general all is the plane) installation combination, influenced its radiating efficiency greatly, when average power reached the 400W left and right sides, volume tended to very big (as 200mmX Ф 25mm).
Wirewound resistor is thoughts in addition, can not satisfy some application requirements; Thick film power resistor of the same type, its pulse tolerance can not satisfy certain user's requirement.
The utility model content
Problem to be solved in the utility model provides a kind of Alloy Foil chip Plane Installation Power Resistor,, weak heat-dissipating poor with the resistor pulse resistance characteristics that overcomes prior art and bulky shortcoming.
For achieving the above object, the technical solution of the utility model provides a kind of Alloy Foil chip Plane Installation Power Resistor, and described Power Resistor comprises first ceramic substrate, copper sheet, second ceramic substrate, alloy foil sheet, pin, inner casing, shell and copper post;
Described copper sheet is welded on described first ceramic substrate, and described second ceramic substrate is welded on the described copper sheet, and described alloy foil sheet is bonded on second ceramic substrate, and described pin is welded on the two ends of described alloy foil sheet;
The composite entity of described first ceramic substrate, copper sheet, second ceramic substrate, alloy foil sheet and pin is placed in the inner casing, and inner casing is poured into silica gel, and inner casing and copper post are installed on the shell.
Further, the length of described first ceramic substrate is that 56.05mm, width are that 50.8mm, thickness are 0.635mm.
Further, the length of described second ceramic substrate is that 50.8mm, width are that 46.4mm, thickness are 1.27mm.
Further, described first ceramic substrate and second ceramic substrate are 96% alumina ceramic substrate.
Further, the length of described copper sheet is that 55.9mm, width are that 50.3mm, thickness are 0.8mm.
Further, the single line bar length of described alloy foil sheet is that 38mm, width are that 3mm, thickness are 0.15mm.
Further, the diameter of described pin is 0.8mm.
Compared with prior art, the technical solution of the utility model has following advantage:
Alloy Foil chip Plane Installation Power Resistor of the present utility model is by adopting the alloy foil sheet of laser cutting, makes it possess superpower pulse resistance characteristics, have good heat dissipation, characteristic that volume is little with respect to the wire-wound power resistor.
Description of drawings
Fig. 1 is the structural representation of Alloy Foil chip Plane Installation Power Resistor of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail.Following examples are used to illustrate the utility model, but are not used for limiting scope of the present utility model.
The structure of Alloy Foil chip Plane Installation Power Resistor of the present utility model as shown in Figure 1, described Power Resistor comprises first ceramic substrate (1), copper sheet (2), second ceramic substrate (3), alloy foil sheet (4), pin (5), inner casing (6), shell (7) and copper post (8);
Described copper sheet (2) is welded on described first ceramic substrate (1), described second ceramic substrate (3) is welded on the described copper sheet (2), described alloy foil sheet (4) is bonded on second ceramic substrate (3), and described pin (5) is welded on the two ends of described alloy foil sheet (4);
The composite entity of described first ceramic substrate (1), copper sheet (2), second ceramic substrate (3), alloy foil sheet (4) and pin (5) is placed in the inner casing (6), and inner casing is poured into silica gel, and inner casing (6) and copper post (8) are installed on the shell (7).
The length of described first ceramic substrate (1) is that 56.05mm, width are that 50.8mm, thickness are 0.635mm.
The length of described second ceramic substrate (3) is that 50.8mm, width are that 46.4mm, thickness are 1.27mm.
Described first ceramic substrate (1) and second ceramic substrate (3) are 96% alumina ceramic substrate.
The length of described copper sheet (2) is that 55.9mm, width are that 50.3mm, thickness are 0.8mm.
The single line bar length of described alloy foil sheet (4) is that 38mm, width are that 3mm, thickness are 0.15mm.
The diameter of described pin (5) is 0.8mm.
The preparation process of Alloy Foil chip Plane Installation Power Resistor of the present utility model is as follows:
First ceramic substrate (1), copper sheet (2), second ceramic substrate (3) integral body are put into vacuum brazing stove and welded, form the assembly of three-decker.Then alloy foil sheet (4) is bonded on second ceramic substrate (3), and the pin (5) of the Ф 0.8mm that burn-ons at the two ends of alloy foil sheet (4), adorns inner casing again, irritate silica gel, dress copper post, casing get final product.
Alloy Foil chip Plane Installation Power Resistor of the present utility model is by adopting the alloy foil sheet of laser cutting, makes it possess superpower pulse resistance characteristics, have good heat dissipation, characteristic that volume is little with respect to the wire-wound power resistor.
Described only is preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (7)
1. Alloy Foil chip Plane Installation Power Resistor, it is characterized in that described Power Resistor comprises first ceramic substrate (1), copper sheet (2), second ceramic substrate (3), alloy foil sheet (4), pin (5), inner casing (6), shell (7) and copper post (8); Described copper sheet (2) is welded on described first ceramic substrate (1), described second ceramic substrate (3) is welded on the described copper sheet (2), described alloy foil sheet (4) is bonded on second ceramic substrate (3), and described pin (5) is welded on the two ends of described alloy foil sheet (4); The composite entity of described first ceramic substrate (1), copper sheet (2), second ceramic substrate (3), alloy foil sheet (4) and pin (5) is placed in the inner casing (6), and inner casing (6) is poured into silica gel, and inner casing (6) and copper post (8) are installed on the shell (7).
2. a kind of Alloy Foil chip Plane Installation Power Resistor as claimed in claim 1 is characterized in that, the length of described first ceramic substrate (1) is that 56.05mm, width are that 50.8mm, thickness are 0.635mm.
3. a kind of Alloy Foil chip Plane Installation Power Resistor as claimed in claim 1 is characterized in that, the length of described second ceramic substrate (3) is that 50.8mm, width are that 46.4mm, thickness are 1.27mm.
4. a kind of Alloy Foil chip Plane Installation Power Resistor as claimed in claim 1 is characterized in that described first ceramic substrate (1) and second ceramic substrate (3) are 96% alumina ceramic substrate.
5. Alloy Foil chip Plane Installation Power Resistor as claimed in claim 1 is characterized in that, the length of described copper sheet (2) is that 55.9mm, width are that 50.3mm, thickness are 0.8mm.
6. a kind of Alloy Foil chip Plane Installation Power Resistor as claimed in claim 1 is characterized in that the diameter of described pin (5) is 0.8mm.
7. a kind of Alloy Foil chip Plane Installation Power Resistor as claimed in claim 1 is characterized in that, the single line bar length of described alloy foil sheet (4) is that 38mm, width are that 3mm, thickness are 0.15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206976128U CN201984915U (en) | 2010-12-31 | 2010-12-31 | Alloy-foil type planar-installation high-power resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206976128U CN201984915U (en) | 2010-12-31 | 2010-12-31 | Alloy-foil type planar-installation high-power resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201984915U true CN201984915U (en) | 2011-09-21 |
Family
ID=44612371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206976128U Expired - Lifetime CN201984915U (en) | 2010-12-31 | 2010-12-31 | Alloy-foil type planar-installation high-power resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201984915U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103632779A (en) * | 2013-12-05 | 2014-03-12 | 蚌埠市德瑞特电阻技术有限公司 | Power thick-film resistor |
| WO2018045935A1 (en) * | 2016-09-07 | 2018-03-15 | 南京南瑞继保电气有限公司 | Housing structure of planar resistor |
-
2010
- 2010-12-31 CN CN2010206976128U patent/CN201984915U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103632779A (en) * | 2013-12-05 | 2014-03-12 | 蚌埠市德瑞特电阻技术有限公司 | Power thick-film resistor |
| CN103632779B (en) * | 2013-12-05 | 2016-04-06 | 蚌埠市德瑞特电阻技术有限公司 | Power thick-film resistor |
| WO2018045935A1 (en) * | 2016-09-07 | 2018-03-15 | 南京南瑞继保电气有限公司 | Housing structure of planar resistor |
| US10636548B2 (en) | 2016-09-07 | 2020-04-28 | Nr Engineering Co., Ltd | Housing structure of planar resistor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2660828B1 (en) | Apparatus comprising thermal fuse and resistor | |
| CN106558676A (en) | Lithium battery collector with defencive function | |
| TW201438034A (en) | Over-current protection device | |
| TW201110158A (en) | Micro resistor | |
| CN201984915U (en) | Alloy-foil type planar-installation high-power resistor | |
| CN201054804Y (en) | A thick film porcelain heating plate | |
| CN202758689U (en) | Thick-film super-power planar resistor of composite base plate | |
| CN110635083A (en) | Rapid heating battery module | |
| CN208368274U (en) | Converter valve flash, ultrahigh power resistor | |
| CN201984912U (en) | Mid-size plane power resistor | |
| CN211238352U (en) | Battery pack with temperature control device | |
| CN210271948U (en) | Resistance card | |
| CN203690029U (en) | Mounting type planar thick-film high-power resistor | |
| CN209625951U (en) | Adjustable type cooling fin ceramic resistor | |
| CN213403607U (en) | Bending-resistant circuit board | |
| CN201984910U (en) | Baseboard directly welded plane type power resistor | |
| CN201130575Y (en) | PTC polymer thermal resistor | |
| CN214013146U (en) | Flexible insulating radiating fin for 5G antenna | |
| CN211530105U (en) | Electricity core structure | |
| CN220674271U (en) | Electronic component | |
| CN217933478U (en) | Aluminum metallized polyester film's two-sided edge structure that remains | |
| CN214753188U (en) | High-power wound resistor | |
| CN204480829U (en) | Straight cutting or the high-accuracy shunting power resistance of plane mount type | |
| CN218772476U (en) | Thick film heating disc for beaker | |
| CN207269270U (en) | Cermet heating element component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110921 |