CN201979396U - Piezoid grinding clamp - Google Patents
Piezoid grinding clamp Download PDFInfo
- Publication number
- CN201979396U CN201979396U CN2011200118946U CN201120011894U CN201979396U CN 201979396 U CN201979396 U CN 201979396U CN 2011200118946 U CN2011200118946 U CN 2011200118946U CN 201120011894 U CN201120011894 U CN 201120011894U CN 201979396 U CN201979396 U CN 201979396U
- Authority
- CN
- China
- Prior art keywords
- cavity
- quartz wafer
- cuboid
- grinding clamp
- clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a grinding clamp for processing a piezoid, which is provided with a cuboidal positioning clamp. The positioning clamp is provided with a cuboidal through cavity in the middle, the width of the through cavity is corresponding to the size of the bevel edge of the piezoid, the height of the through cavity is smaller than the height of the piezoid, and a locking screw penetrates the screw hole on the end surface of the positioning clamp and then fixes an adjusting clamping plate in the cavity in the positioning clamp. By overlapping the piezoids after being arranged regularly and positioning the piezoids into the through cavity of the positioning clamp, and by fixing the adjusting clamping plate by moving the locking screw, the original process of bonding the piezoids through adhesive is replaced, thus greatly improving the production efficiency and the yield rate of products.
Description
Technical field
The utility model relates to a kind of process equipment of quartz wafer, relates in particular to the anchor clamps that use in the quartz wafer size attrition process process.
Background technology
In the quartz wafer process, after crystal bar cut into wafer, can produce hypotenuse about 35 in wafer one side, in the attrition process process after cutting, this hypotenuse can change the angle of wafer, cause the increase of defective work in the grinding step, so before carrying out attrition process, this hypotenuse must be removed.
At present the operation of attrition process is: again the hypotenuse of quartz wafer is carried out size and grind quartz wafer is earlier bonding.For quartz wafer is bonded together, rosin commonly used is bonding with the bonded adhesives that paraffin mixes by a certain percentage, but is to use bonded adhesives following weak point to occur:
1, after the size grinding step finishes, the bonded adhesives fusing must be opened and could carry out the thickness grinding to wafer, and the fusing bonded adhesives need be through three road cleaning processes, each road cleaning process all can produce a certain proportion of fragmentation, causes the wafer yield low.
2, owing to behind bondingization of the wafer material, surface residual rosin of meeting and paraffin organic substance, these materials can influence wafer angle and the isoparametric measurement of frequency.
3, in the wafer adhesion process, the rosin of use can produce volume of smoke and penetrating odor, healthy influential to operating personnel.
The utility model content
To use the bonding quartz wafer of bonded adhesives to grind existing defective in order solving in the prior art, to the utility model proposes and a kind ofly directly quartz wafer is carried out the anchor clamps that size is ground after fixing.
The technical solution adopted in the utility model is: a kind of grinding clamp of quartz wafer, it is characterized in that, the profile of described grinding clamp is a cuboid, be provided with the cavity of a cuboid at the middle part of described cuboid, be provided with some support bars in the bottom of described cavity, middle part in a side of described cuboid length direction is provided with screw, in described screw, screw rod is housed, described screw rod is positioned at an end of cuboid cavity and the back side of positioning splint flexibly connects, the front of described positioning splint is used to clamp quartz wafer, and described screw rod is positioned at the outer end of cuboid and is connected with the first run; The width of described cavity is corresponding with the projection size of quartz wafer hypotenuse, and the height of described cavity is less than the height of the short straight flange of quartz wafer.
Wherein optimized technical scheme is, described grinding clamp is a jointless structure.
Wherein optimized technical scheme also has, and is provided with a pilot hole at least in the lower end of described positioning splint, and at least one in the described some support bars is passed described pilot hole.
The utility model is by stacking after the quartz wafer marshalling, be placed in the cavity of grinding clamp, and move by screw rod and to regulate positioning splint and will arrange the quartz wafer of getting well and be fixedly clamped, hypotenuse one side of quartz wafer is positioned on the cavity of grinding clamp, puts it in the grinder then hypotenuse is ground away.This grinding clamp has substituted the bonding quartz wafer technology of original bonded adhesives, has improved production efficiency and product yield greatly.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is the schematic top plan view of the utility model grinding clamp when being unkitted quartz wafer;
Fig. 2 is the A-A cross-sectional schematic of Fig. 1, and on the basis of Fig. 1 and the quartz wafer of having packed into.
Among the figure: 1, grinding clamp; 2, cavity; 3, support bar; 4, screw; 5, screw rod; 6, positioning splint; 7, quartz wafer; 8, the first run; 9, pilot hole.
The specific embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present utility model is further described.Following examples only are used for the technical solution of the utility model more clearly is described, and can not limit protection domain of the present utility model with this.
As shown in the figure, the utility model is a kind of grinding clamp of quartz wafer, the profile of this grinding clamp 1 is a cuboid, be provided with the cavity 2 of a cuboid at the middle part of described cuboid, be provided with 3 support bars 3 in the bottom of described cavity 2, middle part in a side of described cuboid length direction is provided with screw 4, in described screw 4, screw rod 5 is housed, described screw rod 5 is positioned at an end of cuboid cavity 2 and the back side of positioning splint 6 flexibly connects, the front of described positioning splint 6 is used to clamp quartz wafer 7, and described screw rod 5 is positioned at the outer end of cuboid and is connected with the first run 8; The width of described cavity 2 is corresponding with the projection size of quartz wafer hypotenuse, and the height of described cavity 2 is less than the height of the short straight flange of quartz wafer.Because it is hypotenuse that quartz wafer 7 has a limit, therefore two limits adjacent with this hypotenuse have one to be long limit, and another is a minor face.
Good in order to guarantee to contact between positioning splint 6 and the quartz wafer 7, at the pilot hole 9 in the lower end of described positioning splint 6, pass this pilot hole 9 with one in the described support bar 3.Make positioning splint 6 under the driving of adjusting screw(rod) 5, move forward and backward along support bar 3.
In order to guarantee that quartz wafer 7 grinding clamp 1 in process of lapping can not deform, grinding clamp 1 adopts the one-time formed structure of no seam, with line cutting processing grinding clamp 1, can obtain by the mid portion of the monoblock piece of stainless steel of shooting off.
During adjusting screw(rod) 5, positioning splint 6 can correspondingly move towards quartz wafer 7, reinforces up to quartz wafer 7 is clamped.The grinding clamp that quartz wafer 7 is housed is put into grinder can be processed quartz wafer, removes the hypotenuse that quartz wafer cutting back produces.
The above only is a preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (3)
1. the grinding clamp of a quartz wafer, it is characterized in that, the profile of described grinding clamp is a cuboid, be provided with the cavity of a cuboid at the middle part of described cuboid, be provided with some support bars in the bottom of described cavity, middle part in a side of described cuboid length direction is provided with screw, in described screw, screw rod is housed, described screw rod is positioned at an end of cuboid cavity and the back side of positioning splint flexibly connects, the front of described positioning splint is used to clamp quartz wafer, and described screw rod is positioned at the outer end of cuboid and is connected with the first run; The width of described cavity is corresponding with the projection size of quartz wafer hypotenuse, and the height of described cavity is less than the height of the short straight flange of quartz wafer.
2. the grinding clamp of quartz wafer according to claim 1 is characterized in that, described grinding clamp is a jointless structure.
3. the grinding clamp of quartz wafer according to claim 1 is characterized in that, is provided with a pilot hole at least in the lower end of described positioning splint, and at least one in the described some support bars is passed described pilot hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200118946U CN201979396U (en) | 2011-01-17 | 2011-01-17 | Piezoid grinding clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200118946U CN201979396U (en) | 2011-01-17 | 2011-01-17 | Piezoid grinding clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201979396U true CN201979396U (en) | 2011-09-21 |
Family
ID=44606864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200118946U Expired - Fee Related CN201979396U (en) | 2011-01-17 | 2011-01-17 | Piezoid grinding clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201979396U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102335870A (en) * | 2011-10-20 | 2012-02-01 | 无锡海特精密模具有限公司 | Clamping jig for grinding machine |
| CN102765024A (en) * | 2012-08-09 | 2012-11-07 | 北京石晶光电科技股份有限公司济源分公司 | Processing method for verticality of non-magnetic sheet-shaped material |
| CN103042465A (en) * | 2012-12-26 | 2013-04-17 | 镇江市港南电子有限公司 | Modified grinding clamp for quartz crystal wafers |
| CN108365501A (en) * | 2017-12-30 | 2018-08-03 | 铜陵日科电子有限责任公司 | quartz crystal connecting terminal patch fixing device |
| CN109483362A (en) * | 2019-01-11 | 2019-03-19 | 珠海东锦石英科技有限公司 | A kind of quartz wafer goes bevel edge technique and goes bevel edge tooling |
| CN112743446A (en) * | 2020-12-29 | 2021-05-04 | 北京无线电计量测试研究所 | Shape modification method for quartz crystal square piece |
-
2011
- 2011-01-17 CN CN2011200118946U patent/CN201979396U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102335870A (en) * | 2011-10-20 | 2012-02-01 | 无锡海特精密模具有限公司 | Clamping jig for grinding machine |
| CN102335870B (en) * | 2011-10-20 | 2015-11-18 | 无锡海特精密模具有限公司 | Clamping jig for grinding machine |
| CN102765024A (en) * | 2012-08-09 | 2012-11-07 | 北京石晶光电科技股份有限公司济源分公司 | Processing method for verticality of non-magnetic sheet-shaped material |
| CN103042465A (en) * | 2012-12-26 | 2013-04-17 | 镇江市港南电子有限公司 | Modified grinding clamp for quartz crystal wafers |
| CN108365501A (en) * | 2017-12-30 | 2018-08-03 | 铜陵日科电子有限责任公司 | quartz crystal connecting terminal patch fixing device |
| CN109483362A (en) * | 2019-01-11 | 2019-03-19 | 珠海东锦石英科技有限公司 | A kind of quartz wafer goes bevel edge technique and goes bevel edge tooling |
| CN109483362B (en) * | 2019-01-11 | 2023-11-24 | 珠海东锦石英科技有限公司 | Beveling process for quartz wafer |
| CN112743446A (en) * | 2020-12-29 | 2021-05-04 | 北京无线电计量测试研究所 | Shape modification method for quartz crystal square piece |
| CN112743446B (en) * | 2020-12-29 | 2022-05-20 | 北京无线电计量测试研究所 | Shape modification method for quartz crystal square plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201979396U (en) | Piezoid grinding clamp | |
| CN203470152U (en) | Iron removing device for silicon carbide micropowder | |
| CN103753715B (en) | The processing method of the defective silico briquette recycling of a kind of chamfering | |
| CN201385245Y (en) | Grinding clamp for quartz crystal wafers | |
| CN204804854U (en) | Cutter head's hobbing cutter fixing device | |
| CN101637930A (en) | One-step forming wire drawing and water milling machine | |
| CN101973081A (en) | Method for cutting head other than tail of 8-inch polycrystalline block by MB wire saw | |
| CN202088318U (en) | Silicon wafer cutting equipment | |
| CN205764118U (en) | A kind of hot shears structure | |
| CN204773076U (en) | Crystal bar cutting device | |
| CN102839419A (en) | Silicon single crystal rod | |
| CN201970408U (en) | Cutting clamp for crystal silicon block | |
| CN104690814B (en) | Groove milling pre-cutting device for autoclaved aerated building block plates | |
| CN105365062A (en) | Method for cutting off heads and tails for squarer | |
| CN207105322U (en) | A kind of novel adamantine line slicer viscose glue flitch | |
| CN103264290A (en) | Fixing method for numerical control to-be-machined parts | |
| CN204052966U (en) | Heterotypic cutting tool is cut in revolution | |
| CN104917029B (en) | A kind of automatic end-beating machine of winding displacement | |
| CN204673154U (en) | A kind of full-automatic infrared laser cutting device | |
| CN204566409U (en) | A kind of diamond saw blade | |
| CN205057713U (en) | Angle grinding frock is decided to bonding tool | |
| CN218837340U (en) | Simple square chamfering fixture | |
| CN202187091U (en) | Monocrystal silicon rod | |
| CN103157896A (en) | Argon arc welding sideward wire feed welding gun | |
| CN102170273A (en) | Application of sulfuric acid stripping in frequency sheet lump melting engineering |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110921 Termination date: 20140117 |