CN103042465A - Modified grinding clamp for quartz crystal wafers - Google Patents
Modified grinding clamp for quartz crystal wafers Download PDFInfo
- Publication number
- CN103042465A CN103042465A CN2012105754896A CN201210575489A CN103042465A CN 103042465 A CN103042465 A CN 103042465A CN 2012105754896 A CN2012105754896 A CN 2012105754896A CN 201210575489 A CN201210575489 A CN 201210575489A CN 103042465 A CN103042465 A CN 103042465A
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- CN
- China
- Prior art keywords
- clamp
- locating clip
- grinding clamp
- quartz wafer
- quartz crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a grinding clamp for quartz crystal wafers. The grinding clamp which is convenient to operate comprises a seamless positioning clamp, adjusting clamp plates and a locking screw. The adjusting clamp plates are disposed on two opposite positions of the seamless positioning clamp respectively. An a angle is always kept between each adjusting clamp plate and the inner wall of a through cavity of the positioning clamp. By the modified grinding clamp which is simpler to operate, cutting of quartz crystal wafers of different widths is achieved, and cost is saved greatly.
Description
Technical field
The present invention relates to a kind of process equipment of quartz wafer, relate in particular to the anchor clamps that use in the quartz wafer size attrition process process.
Background technology
In the quartz wafer process, after crystal bar cut into wafer, can produce hypotenuse about 35 ° in wafer one side, in the attrition process process after cutting, this hypotenuse can change the angle of wafer, cause the increase of defective work in the grinding step, so before carrying out attrition process, this hypotenuse must be removed.
It is rectangular-shaped locating clip that the grinding clamp of the quartz wafer that uses at present has a profile, has a cuboid cavity in the middle of this locating clip, the width of cavity is corresponding with the hypotenuse size of quartz wafer, the height of cavity is less than the height of quartz wafer, and tie down screw passes behind the screw on the locating clip end face the people, regulate clamping plate is fixed in the locating clip inner chamber.Because this grinding tool width is can't regulating of fixing, the quartz wafer of different size need to be changed different grinding clamps, time-consuming taking a lot of work.
Summary of the invention
Technical problem to be solved by this invention is the grinding clamp that a kind of easy to operate quartz wafer is provided for above drawback.
For solving the problems of the technologies described above, technical scheme of the present invention is:
A kind of grinding clamp of quartz wafer of improvement, comprise seamless locating clip, regulate clamping plate and tie down screw composition, wherein, described adjusting clamping plate respectively are provided with one at seamless locating clip relative position, and remain identical a angle with locating clip cavity inwall, can the quartz wafer of different in width be cut, greatly saved cost, operate easier.
The grinding clamp of the quartz wafer of above-mentioned a kind of improvement, wherein, a angle angle of described adjusting clamping plate is between 0 °-30 °.
Description of drawings
Fig. 1 is structural representation of the present invention
Fig. 2 is top view of the present invention
Symbol description among the figure: seamless locating clip 1, regulate clamping plate 21,22, tie down screw 3, quartz wafer 4, locating clip cavity 5, regulate clamping plate 21,22 with a angle of locating clip cavity 5 inwalls formation.
The specific embodiment
Such as figure, the present invention is a kind of grinding clamp of quartz wafer of improvement, comprise seamless locating clip 1, regulate clamping plate 21,22 and tie down screw 3 form, wherein, described adjusting clamping plate 21,22 respectively are provided with one at seamless locating clip relative position, and remain with locating clip cavity 5 inwalls and identical a angle can the quartz wafer of different in width be cut, greatly saved cost, operated easier.
During operation, different in width quartz wafer 4 is put into the cuboid cavity 5 of locating clip 1, form an a angle with locating clip cavity inwall, adjust tie down screw 3 and make to regulate and put into grinder after clamping plate clamp quartz wafer 4 extruding relatively and process.
Claims (2)
1. the grinding clamp of the quartz wafer of an improvement, comprise seamless locating clip, regulate clamping plate and tie down screw composition, it is characterized by, described adjusting clamping plate respectively are provided with one at seamless locating clip relative position, and remain identical a angle with locating clip cavity inwall.
2. the grinding clamp of the quartz wafer of a kind of improvement as claimed in claim 1 is characterized by, and a angle angle of described adjusting clamping plate is between 0 °-30 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105754896A CN103042465A (en) | 2012-12-26 | 2012-12-26 | Modified grinding clamp for quartz crystal wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105754896A CN103042465A (en) | 2012-12-26 | 2012-12-26 | Modified grinding clamp for quartz crystal wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103042465A true CN103042465A (en) | 2013-04-17 |
Family
ID=48055448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105754896A Pending CN103042465A (en) | 2012-12-26 | 2012-12-26 | Modified grinding clamp for quartz crystal wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103042465A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105834892A (en) * | 2016-05-12 | 2016-08-10 | 苏州市展进机电设备有限公司 | Clamping device for silicon wafer grinding |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010030143A1 (en) * | 1998-01-13 | 2001-10-18 | Nec Corporation | Semiconductor wafer accommodating jig, handling method and production system |
| CN2801376Y (en) * | 2005-07-12 | 2006-08-02 | 厉国苗 | Slabstone location gripping apparatus |
| CN201385245Y (en) * | 2009-03-30 | 2010-01-20 | 镇江市港南电子有限公司 | Grinding clamp for quartz crystal wafers |
| CN201645330U (en) * | 2010-04-30 | 2010-11-24 | 武汉一冶钢结构有限责任公司 | Inclination-type clamping fixture for shot blasting machine |
| CN201979396U (en) * | 2011-01-17 | 2011-09-21 | 江阴市江海光伏科技有限公司 | Piezoid grinding clamp |
| CN102633052A (en) * | 2012-03-21 | 2012-08-15 | 李莉 | Triangular transfer support |
| CN202592069U (en) * | 2012-05-07 | 2012-12-12 | 长沙建鑫机械制造有限公司 | Groove milling tool |
| CN203003661U (en) * | 2012-12-26 | 2013-06-19 | 镇江市港南电子有限公司 | Grinding fixture of improved quartz wafer |
-
2012
- 2012-12-26 CN CN2012105754896A patent/CN103042465A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010030143A1 (en) * | 1998-01-13 | 2001-10-18 | Nec Corporation | Semiconductor wafer accommodating jig, handling method and production system |
| CN2801376Y (en) * | 2005-07-12 | 2006-08-02 | 厉国苗 | Slabstone location gripping apparatus |
| CN201385245Y (en) * | 2009-03-30 | 2010-01-20 | 镇江市港南电子有限公司 | Grinding clamp for quartz crystal wafers |
| CN201645330U (en) * | 2010-04-30 | 2010-11-24 | 武汉一冶钢结构有限责任公司 | Inclination-type clamping fixture for shot blasting machine |
| CN201979396U (en) * | 2011-01-17 | 2011-09-21 | 江阴市江海光伏科技有限公司 | Piezoid grinding clamp |
| CN102633052A (en) * | 2012-03-21 | 2012-08-15 | 李莉 | Triangular transfer support |
| CN202592069U (en) * | 2012-05-07 | 2012-12-12 | 长沙建鑫机械制造有限公司 | Groove milling tool |
| CN203003661U (en) * | 2012-12-26 | 2013-06-19 | 镇江市港南电子有限公司 | Grinding fixture of improved quartz wafer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105834892A (en) * | 2016-05-12 | 2016-08-10 | 苏州市展进机电设备有限公司 | Clamping device for silicon wafer grinding |
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Legal Events
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130417 |