CN201966133U - Crack pass of metal light and heat drive - Google Patents
Crack pass of metal light and heat drive Download PDFInfo
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- CN201966133U CN201966133U CN201120018370XU CN201120018370U CN201966133U CN 201966133 U CN201966133 U CN 201966133U CN 201120018370X U CN201120018370X U CN 201120018370XU CN 201120018370 U CN201120018370 U CN 201120018370U CN 201966133 U CN201966133 U CN 201966133U
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Abstract
The utility model discloses a crack pass of metal light and heat drive. The utility model adopts synchrotron radiation LIGA technique to prepare the crack pass of this kind of metal light and heat drive, and adopts chemical sputtering method to the surface of metal light and heat to drive crack pass on the black coating to reduce the reflection of light, and to increase it to the light absorption. It adopts laser as the driving source and carry out shining after the collimation focus actuating arm of the crack pass of metal light and heat to drive with the laser beam on, and utilize the light and heat inflation effect of metal to make the crack pass of metal take place deformation, thus the switching function can come true. The system includes parts such as laser instrument, focusing lens, basement, expanding arm, contact. The advantage of the utility model is that : adopts the preparation of LIGA technique, and its crack pass precision is high, and it can produce in batches; can utilize laser directly to carry out non-contact control to crack pass; The crack pass's electric conductivity is good, and the invention can directly be applied to the circuit.
Description
Technical field
The utility model relates to a kind of metal photo-thermal and drives micro switch, is used for the non-contact control of Micro-Opto-Electro-Mechanical Systems circuit.
Background technology
Development along with micro-nano technology, Micro-Opto-Electro-Mechanical Systems (micro-optical-electro-mechanical system, MOEMS) as important branch in the micro-nano technology, developed rapidly in countries in the world, and obtained extensive use at numerous areas.Microdrive is the important component part among numerous MOMES, and by the difference of drive principle, it is driving etc. that common driver can be divided into electromagnetic drive type, static driven type, piezoelectric driven, thermal expansion.Micro switch is a kind of in the numerous application of microdrive.The contact micro switch low in energy consumption, isolation is high, the linearity good, and can be integrated with other electronic devices, therefore become the focus of people's research just day by day.
Utilize Electromagnetic Drive, static driven, Piezoelectric Driving or electric heating expansion driven to realize switching function,, need to introduce external drive circuit inevitably though be used widely in many occasions.For this reason, the utility model is used for reference the electrothermal drive principle, adopt laser as drive source, laser beam collimated shine metal photo-thermal after focusing on and drive on the actuating arm of micro switch, utilize the photo-thermal bulking effect of metal to make metal micro switch generation deformation, thereby the realization switching function need not to introduce external drive circuit, can utilize laser directly micro switch to be carried out non-contact control.And the preparation of the driving of the metal photo-thermal in the utility model micro switch employing synchrotron radiation LIGA technology, micro switch precision height can be produced in batches; Conductivity is good, can directly apply to circuit, satisfies the demand in national economy such as industry, agricultural, national defence and science and technology and each field of social development.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of metal photo-thermal to drive micro switch.
Metal photo-thermal drives micro switch and comprises laser, condenser lens, substrate down, micro-cantilever, center disk, cantilever contact, substrate contact, goes up substrate.Be provided with micro-cantilever, center disk, cantilever contact in the following substrate in turn; Substrate contact is positioned in the substrate, laser shines metal photo-thermal and drives on the center disk of micro switch after laser and the focusing of condenser lens collimation, center disk absorbs the energy of laser, to micro-cantilever conduction heat, upwards elongation after the micro-cantilever local temperature raises, thereby the cantilever contact is contacted with substrate contact, realize switching function.
Metal photo-thermal drives micro switch and comprises light device, condenser lens, wide arm, narrow arm, narrow arm contact, right substrate contact, left substrate, right substrate; Substrate right side wall in a left side is provided with wide arm, narrow arm, narrow arm is provided with narrow arm contact, right substrate is provided with the right substrate contact that matches with narrow arm contact, laser shines metal photo-thermal and drives on the wide arm of micro switch after laser and the focusing of condenser lens collimation, wide arm absorbs the energy of laser, local temperature deflects down after raising, thereby narrow arm contact is contacted with right substrate contact, realizes switching function.
The material of micro switch is the electric conductivity good metal, can directly use in the Micro-Opto-Electro-Mechanical Systems circuit as switch after substrate connects lead.Laser and condenser lens constitute drive source jointly, can directly carry out non-contact control to micro switch.Laser beam collimated to shine metal photo-thermal after focusing on and drives on the actuating arm of micro switch, utilizes the photo-thermal bulking effect of metal to make metal micro switch generation deformation, thereby realizes switching function.
Description of drawings
Fig. 1 is that metal photo-thermal drives micro switch (I type) operation principle schematic diagram;
Fig. 2 is that metal photo-thermal drives micro switch (II type) operation principle schematic diagram;
Fig. 3 is that metal photo-thermal drives micro switch (I type) CAD design drawing example;
Fig. 4 is that metal photo-thermal drives micro switch (II type) CAD design drawing example;
Fig. 5 is a synchrotron radiation LIGA process chart;
Fig. 6 is an overall system diagram;
Among the figure: laser 1, condenser lens 2, substrate 3 down, micro-cantilever 4, center disk 5, cantilever contact 6, substrate contact 7, upward substrate 8, wide arm 9, narrow arm 10, narrow arm contact 11, right substrate contact 12, left substrate 13, right substrate 14.
Embodiment
As shown in Figure 1, metal photo-thermal driving micro switch (I type) comprises laser 1, condenser lens 2, substrate 3 down, micro-cantilever 4, center disk 5, cantilever contact 6, substrate contact 7, goes up substrate 8; Be provided with micro-cantilever 4, center disk 5, cantilever contact 6 in the following substrate 3 in turn; Substrate contact 7 is positioned in the substrate 8, laser shines metal photo-thermal and drives on the center disk 5 of micro switch after laser 1 and condenser lens 2 collimation focusing, center disk 5 absorbs the energy of laser, to micro-cantilever 4 conduction heats, upwards elongation after micro-cantilever 4 local temperatures raise, thereby cantilever contact 6 is contacted with substrate contact 7, realize switching function.
The parallel laser that sends in laser 1 is converged to a bit by condenser lens 2, shining metal photo-thermal drives on the center disk 5 of micro switch, center disk 5 absorbs the energy of laser, to micro-cantilever 4 conduction heats, the micro-cantilever 4 local temperatures back that raises produces the expansion elongation of one dimension, and substrate is fixed in micro-cantilever 4 lower ends, the deformation that can only the make progress center disk that arches upward, thereby cantilever contact 6 is contacted with substrate contact 7, realize switching function.
As shown in Figure 2, metal photo-thermal driving micro switch (II type) comprises light device 1, condenser lens 2, wide arm 9, narrow arm 10, narrow arm contact 11, right substrate contact 12, left substrate 13, right substrate 14; Substrate 13 right side walls in a left side are provided with wide arm 9, narrow arm 10, narrow arm 10 is provided with narrow arm contact 11, right substrate 14 is provided with the right substrate contact 12 that matches with narrow arm contact 11, laser shines metal photo-thermal and drives on the wide arm 9 of micro switch after laser 1 and condenser lens 2 collimation focusing, wide arm 9 absorbs the energy of laser, local temperature deflects down after raising, thereby narrow arm contact 11 is contacted with right substrate contact 12, realizes switching function.
The parallel laser that sends in laser 1 is converged to a bit by condenser lens 2, shine metal photo-thermal and drive micro switch, shining metal photo-thermal drives on the wide arm 9 of micro switch, wide arm 9 absorbs the energy of laser, the local temperature expansion that the back produces one dimension that raises, and do not have expanded by heating with the wide arm 9 terminal narrow arms 10 that link to each other causes the expansion of wide arm 9 one dimensions to be converted into whole micro switch and deflects down, thereby narrow arm contact 11 is contacted with right substrate contact 12, realize switching function.
As shown in Figure 3, Figure 4, metal photo-thermal drives the structure of micro switch, is with the AutoCAD design, can be according to actual needs, and micro switch length can be designed to 500 ~ 5000 microns, and width is 200 ~ 1000 microns, and thickness is 40 ~ 100 microns, and contact spacing is 5 ~ 50 microns.
As shown in Figure 5, the step of the manufacture method of metal photo-thermal driving micro switch is as follows:
The step of the manufacture method of metal photo-thermal driving micro switch is as follows:
1) with AutoCAD design micro switch drawing;
2) do with Si that framework, SiN are done basement membrane, Ni does absorbing film and adopts electron beam lithography to make mask graph according to drawing;
3) be coated on the metal film as electroplated electrode with the polymethyl methacrylate photoresist, utilize synchrotron radiation X-ray to carry out photoetching, in the X-ray process photoresist part that mask substrate shone, the back of developing is fallen with regard to dissolved, obtain one identical with mask arrangement, thickness hundreds of micron, minimum lateral width reach several microns 3 D stereo plastic structure;
4) utilize the metal level below the photoresist to electroplate as electrode, the gap that photoresist is formed is with metal filled, form a concavo-convex domain of stable metal with the concavo-convex complementation of photoresist figure, then photoresist and the base material that adheres to are removed, obtain moulding the used metal micro switch of casting;
5) resin is injected in the cavity of mould by the aperture on the metal injection molded plate, behind the hardening of resin, remove mould and obtain a plastics microstructure, moulding on the microstructure finished of casting, electroplate the micro switch structure, remove glue and injection molding plates again, obtain a micro switch blank that hundreds of micron thickness, 3-D solid structure are arranged;
6) the blank upper and lower surface is carried out polishing, obtain metal micro switch finished product; Adopt the chemical sputtering method to the processing of turning black of the surface of metal micro switch at last.
Overall system diagram adopts synchrotron radiation LIGA technology processing and preparing metal photo-thermal to drive micro switch as shown in Figure 6; Laser sends the laser of power and frequency adjustable, is used to control amount of deflection and the switching frequency that metal photo-thermal drives micro switch; Metal photo-thermal drives micro switch and is applied to Micro-Opto-Electro-Mechanical Systems, realizes the control to physical circuit.
Claims (2)
1. a metal photo-thermal drives micro switch, it is characterized in that comprising laser (1), condenser lens (2), substrate (3) down, micro-cantilever (4), center disk (5), cantilever contact (6), substrate contact (7), goes up substrate (8); Be provided with micro-cantilever (4), center disk (5), cantilever contact (6) in the following substrate (3) in turn; Substrate contact (7) is positioned in the substrate (8), laser shines metal photo-thermal and drives on the center disk (5) of micro switch after laser (1) and the focusing of condenser lens (2) collimation, center disk (5) absorbs the energy of laser, to micro-cantilever (4) conduction heat, upwards elongation after micro-cantilever (4) local temperature raises, thereby cantilever contact (6) is contacted with substrate contact (7), realize switching function.
2. a metal photo-thermal drives micro switch, it is characterized in that comprising light device (1), condenser lens (2), wide arm (9), narrow arm (10), narrow arm contact (11), right substrate contact (12), left substrate (13), right substrate (14); Substrate (13) right side wall in a left side is provided with wide arm (9), narrow arm (10), narrow arm (10) is provided with narrow arm contact (11), right substrate (14) is provided with the right substrate contact (12) that matches with narrow arm contact (11), laser shines metal photo-thermal and drives on the wide arm (9) of micro switch after laser (1) and the focusing of condenser lens (2) collimation, wide arm (9) absorbs the energy of laser, local temperature deflects down after raising, thereby narrow arm contact (11) is contacted with right substrate contact (12), realize switching function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120018370XU CN201966133U (en) | 2011-01-20 | 2011-01-20 | Crack pass of metal light and heat drive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120018370XU CN201966133U (en) | 2011-01-20 | 2011-01-20 | Crack pass of metal light and heat drive |
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| Publication Number | Publication Date |
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| CN201966133U true CN201966133U (en) | 2011-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201120018370XU Expired - Fee Related CN201966133U (en) | 2011-01-20 | 2011-01-20 | Crack pass of metal light and heat drive |
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| Country | Link |
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| CN (1) | CN201966133U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102096190A (en) * | 2011-01-20 | 2011-06-15 | 浙江大学 | Metallic photo-thermal drive microswitch and manufacturing method thereof |
-
2011
- 2011-01-20 CN CN201120018370XU patent/CN201966133U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102096190A (en) * | 2011-01-20 | 2011-06-15 | 浙江大学 | Metallic photo-thermal drive microswitch and manufacturing method thereof |
| CN102096190B (en) * | 2011-01-20 | 2012-09-19 | 浙江大学 | Metallic photo-thermal drive microswitch and manufacturing method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20130120 |
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| CF01 | Termination of patent right due to non-payment of annual fee |