CN201931730U - Thermal printing head without physical seam - Google Patents
Thermal printing head without physical seam Download PDFInfo
- Publication number
- CN201931730U CN201931730U CN2011200214483U CN201120021448U CN201931730U CN 201931730 U CN201931730 U CN 201931730U CN 2011200214483 U CN2011200214483 U CN 2011200214483U CN 201120021448 U CN201120021448 U CN 201120021448U CN 201931730 U CN201931730 U CN 201931730U
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- China
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- thermal printing
- mounting groove
- base plate
- printing head
- installation base
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Abstract
The utility model discloses a thermal printing head without a physical seam, comprising a mounting base plate and at least two thermal printing heads, wherein the at least two thermal printing heads are arrayed and arranged on the mounting base plate along the longitudinal direction. Two mounting grooves are formed on the plane of the mounting base plate at intervals along the longitudinal direction, one mounting groove is a horizontal mounting groove, while the other mounting groove is an inclined mounting groove inclined to the horizontal mounting groove. The included angle alpha between the perpendicular lines of the base planes of the two mounting grooves is more than 5 degrees and less than 50 degrees. The at least two thermal printing heads are intersected inside the two mounting grooves along the longitudinal direction respectively. The heating areas, which are composed of semiconductor elements, of two adjacent thermal printing heads are engaged with each other in the radial direction of the mounting base plate. The utility model has the advantages that the defect that a printed pattern has splicing crack lines due to the physical seam of the existing wide thermal printing head is avoided; the printing quality of a thermal printer is greatly improved; and the production and manufacturing cost and maintenance, replacement and running expense of the wide thermal printing head are greatly reduced.
Description
Technical field
The utility model relates to the wide cut thermal printer, especially relates to the no physics seam thermal printing head that is used for the wide cut thermal printer.
Background technology
Thermal printing head is owing to be subjected to the restriction of equipment and technology, and its print span is generally in 230 millimeter.In order to increase print span, take to realize at present by the method that a plurality of thermal printing heads longitudinally splice on installation base plate more.Therefore, adjacent thermal printing head physics splicing slit is narrow more good more; This just makes to the requirement of splice ends surface accuracy very high, causes the very strictness of thermal printing head splicing end face cutting technique, has improved processing and manufacturing cost and difficulty.Even like this, because the error of splicing installation accuracy often causes the literal, the pattern that print to have the splicing slot line and reduce print quality even cause waste product.And because there is thermal resistance in physics splicing slit, after date also easily caused the picture and text that print that the splicing slot line is arranged when thermal printing head used one section.Simultaneously, if after certain thermal printing head damages,, splicing precision in replacing back often do not cause the integral body of wide cut thermal printing head to scrap because reaching requirement.
Summary of the invention
The utility model purpose is to provide the no physics seam thermal printing head that a kind of processing and manufacturing cost is low, print quality is good.
For achieving the above object, the utility model can be taked following technical proposals:
No physics seam thermal printing head described in the utility model comprises installation base plate, longitudinally arranges at least two thermal printing heads that are arranged on the described installation base plate; Being spaced along the longitudinal on the plate face of described installation base plate is provided with two mounting grooves, and a mounting groove is horizontal mounting groove, and another is the inclination mounting groove that tilts towards horizontal mounting groove direction; The baseplane vertical line angle α of described two mounting grooves is: 5 °＜α＜50 °; Described at least two thermal printing heads longitudinally are crisscross arranged respectively in described two mounting grooves; The heating region that is made of semiconductor element of adjacent two thermal printing heads is connected in the radial direction mutually at installation base plate.
On described installation base plate, longitudinally be disposed with three thermal printing heads; Be provided with backing plate in corresponding to the horizontal mounting groove of the thermal printing head in the described inclination mounting groove and in the inclination mounting groove corresponding to the thermal printing head in the described horizontal mounting groove, the height of described backing plate is equal to or less than the height of corresponding thermal printing head.
In described installation base plate, longitudinally offer the passage that cools.
The utility model advantage is described a plurality of thermal printing heads that longitudinally splice mutually are crisscross arranged in described two mounting grooves, and two mounting groove baseplane vertical line angles are made between 5 °-50 °; Therefore, the heating region that is made of semiconductor element of adjacent two thermal printing heads is accomplishing at an easy rate that in the radial direction not having the physics seam is connected, stop existing wide cut thermal printing head fully and had the physics seam and cause the pattern that prints to have the deficiency of splicing slot line, improved the print quality of thermal printer greatly.Simultaneously, because by after the above-mentioned improvement, thermal printing head splice ends surface accuracy is required greatly reduction, thereby greatly reduce the manufacturing cost of wide cut thermal printing head and maintenance, replacing, operating cost.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 be Fig. 1 look up the structure for amplifying schematic diagram.
Fig. 3 is the I portion structure for amplifying schematic diagram of Fig. 1.
The specific embodiment
As shown in Figure 1, 2, 3, no physics seam thermal printing head described in the utility model comprises installation base plate 1, longitudinally arranges three thermal printing heads 2,3,4 that are arranged on the described installation base plate 1; Being spaced along the longitudinal on the plate face of described installation base plate 1 is provided with two mounting grooves, and a mounting groove is horizontal mounting groove 5, and another is the inclination mounting groove 6 that tilts towards described horizontal mounting groove 5 directions; The baseplane vertical line angle α of described two mounting grooves is: 5 °＜α＜50 °; Described three thermal printing heads 2,3,4 longitudinally are crisscross arranged respectively in described two mounting grooves; The heating region 7,8 and the heating region 8,12 that are made of semiconductor element of adjacent thermal printing head 2,3 and thermal printing head 3,4 are connected in the radial direction mutually at installation base plate 1.For ease of thermal print media moving in print procedure, on described installation base plate 1, longitudinally be disposed with three thermal printing heads 2,3,4; Be provided with backing plate 9,13,14 in corresponding to the horizontal mounting groove 5 of the thermal printing head 3 in the described inclination mounting groove 6 and in the inclination mounting groove 6 corresponding to the thermal printing head 2,4 in the described horizontal mounting groove 5, the height of described backing plate 9,13,14 is equal to or less than the height of corresponding thermal printing head 3,2,4.For reducing the temperature of thermal printing head 2,3,4 in the print procedure, in installation base plate 1, longitudinally offer the path 10 that cools, 11, can implement cooling by air-cooled or feeding cooling fluid.
Claims (3)
1. a no physics seam thermal printing head comprises installation base plate (1), longitudinally arranges at least two thermal printing heads (2,3) that are arranged on the described installation base plate (1); It is characterized in that: being spaced along the longitudinal on the plate face of described installation base plate (1) is provided with two mounting grooves, and a mounting groove is horizontal mounting groove (5), and another is the inclination mounting groove (6) that tilts towards horizontal mounting groove (5) direction; The baseplane vertical line angle α of described two mounting grooves is: 5 °＜α＜50 °; Described at least two thermal printing heads (2,3) longitudinally are crisscross arranged respectively in described two mounting grooves; The heating region (7,8) that is made of semiconductor element of adjacent two thermal printing heads (2,3) is connected in the radial direction mutually at installation base plate (1).
2. no physics seam thermal printing head according to claim 1 is characterized in that: longitudinally be disposed with three thermal printing heads (2,3,4) on described installation base plate (1); Be provided with backing plate (9,13,14) in corresponding to the horizontal mounting groove (5) of the thermal printing head (3) in the described inclination mounting groove (6) and in the inclination mounting groove (6) corresponding to the thermal printing head in the described horizontal mounting groove (5) (2,4), the height of described backing plate (9,13,14) is equal to or less than the height of corresponding thermal printing head (3,2,4).
3. no physics seam thermal printing head according to claim 1 and 2 is characterized in that: longitudinally offer the passage that cools (10,11) in described installation base plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200214483U CN201931730U (en) | 2011-01-24 | 2011-01-24 | Thermal printing head without physical seam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200214483U CN201931730U (en) | 2011-01-24 | 2011-01-24 | Thermal printing head without physical seam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201931730U true CN201931730U (en) | 2011-08-17 |
Family
ID=44443267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200214483U Expired - Fee Related CN201931730U (en) | 2011-01-24 | 2011-01-24 | Thermal printing head without physical seam |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201931730U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102126356A (en) * | 2011-01-24 | 2011-07-20 | 河南沃达丰数码科技有限公司 | Physical seam-free heat sensitive printing head |
-
2011
- 2011-01-24 CN CN2011200214483U patent/CN201931730U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102126356A (en) * | 2011-01-24 | 2011-07-20 | 河南沃达丰数码科技有限公司 | Physical seam-free heat sensitive printing head |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110817 Termination date: 20130124 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |