CN102126356A - Physical seam-free heat sensitive printing head - Google Patents
Physical seam-free heat sensitive printing head Download PDFInfo
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- CN102126356A CN102126356A CN 201110024828 CN201110024828A CN102126356A CN 102126356 A CN102126356 A CN 102126356A CN 201110024828 CN201110024828 CN 201110024828 CN 201110024828 A CN201110024828 A CN 201110024828A CN 102126356 A CN102126356 A CN 102126356A
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- mounting groove
- printing head
- thermal printing
- heat sensitive
- base plate
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Abstract
The invention discloses a physical seam-free heat sensitive printing head, which comprises a mounting base plate ant at least two heat sensitive printing heads arranged on the mounting base plate along the longitudinal direction; the plate surface of the mounting base plate is provided with two mounting grooves at interval along the longitudinal direction, one mounting groove is a horizontal mounting groove, and the other mounting groove is an inclined mounting groove included towards the direction of the horizontal mounting groove; the included angle alpha of the vertical lines of the bottom surfaces of the two mounting grooves is more than 5 degrees and less than 50 degrees; the at least two heat sensitive printing heads are staggered in the two mounting grooves along the longitudinal direction respectively; and heating areas, consisting of semiconductor elements, of the two adjacent heat sensitive printing heads are mutually engaged in the radial direction of the mounting base plate. The physical seam-free heat sensitive printing head has the advantages of avoiding the defect that the printed patterns have spliced gap lines because the conventional wide heat sensitive printing head has physical seams, greatly improving the printing quality of a heat sensitive printing machine, and greatly reducing the production and manufacturing costs and the maintenance, replacement and operation expenses of the wide heat sensitive printing head.
Description
Technical field
The present invention relates to the wide cut thermal printer, especially relate to the no physics seam thermal printing head that is used for the wide cut thermal printer.
Background technology
Thermal printing head is owing to be subjected to the restriction of equipment and technology, and its print span is generally in 230 millimeter.In order to increase print span, take to realize at present by the method that a plurality of thermal printing heads longitudinally splice on installation base plate more.Therefore, adjacent thermal printing head physics splicing slit is narrow more good more; This just makes to the requirement of splice ends surface accuracy very high, causes the very strictness of thermal printing head splicing end face cutting technique, has improved processing and manufacturing cost and difficulty.Even like this, because the error of splicing installation accuracy often causes the literal, the pattern that print to have the splicing slot line and reduce print quality even cause waste product.And because there is thermal resistance in physics splicing slit, after date also easily caused the picture and text that print that the splicing slot line is arranged when thermal printing head used one section.Simultaneously, if after certain thermal printing head damages,, splicing precision in replacing back often do not cause the integral body of wide cut thermal printing head to scrap because reaching requirement.
Summary of the invention
The object of the invention is to provide the no physics seam thermal printing head that a kind of processing and manufacturing cost is low, print quality is good.
For achieving the above object, the present invention can take following technical proposals:
No physics seam thermal printing head of the present invention comprises installation base plate, longitudinally arranges at least two thermal printing heads that are arranged on the described installation base plate; Being spaced along the longitudinal on the plate face of described installation base plate is provided with two mounting grooves, and a mounting groove is horizontal mounting groove, and another is the inclination mounting groove that tilts towards horizontal mounting groove direction; The baseplane vertical line angle α of described two mounting grooves is: 5 °＜α＜50 °; Described at least two thermal printing heads longitudinally are crisscross arranged respectively in described two mounting grooves; The heating region that is made of semiconductor element of adjacent two thermal printing heads is connected in the radial direction mutually at installation base plate.
On described installation base plate, longitudinally be disposed with three thermal printing heads; Be provided with backing plate in corresponding to the horizontal mounting groove of the thermal printing head in the described inclination mounting groove and in the inclination mounting groove corresponding to the thermal printing head in the described horizontal mounting groove, the height of described backing plate is equal to or less than the height of corresponding thermal printing head.
In described installation base plate, longitudinally offer the passage that cools.
The invention has the advantages that described a plurality of thermal printing heads that longitudinally splice mutually are crisscross arranged in described two mounting grooves, and two mounting groove baseplane vertical line angles are made between 5 °-50 °; Therefore, the heating region that is made of semiconductor element of adjacent two thermal printing heads is accomplishing at an easy rate that in the radial direction not having the physics seam is connected, stop existing wide cut thermal printing head fully and had the physics seam and cause the pattern that prints to have the deficiency of splicing slot line, improved the print quality of thermal printer greatly.Simultaneously, because by after the above-mentioned improvement, thermal printing head splice ends surface accuracy is required greatly reduction, thereby greatly reduce the manufacturing cost of wide cut thermal printing head and maintenance, replacing, operating cost.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Fig. 2 be Fig. 1 look up the structure for amplifying schematic diagram.
Fig. 3 is the I portion structure for amplifying schematic diagram of Fig. 1.
The specific embodiment
As shown in Figure 1, 2, 3, no physics seam thermal printing head of the present invention comprises installation base plate 1, longitudinally arranges three thermal printing heads 2,3,4 that are arranged on the described installation base plate 1; Being spaced along the longitudinal on the plate face of described installation base plate 1 is provided with two mounting grooves, and a mounting groove is horizontal mounting groove 5, and another is the inclination mounting groove 6 that tilts towards described horizontal mounting groove 5 directions; The baseplane vertical line angle α of described two mounting grooves is: 5 °＜α＜50 °; Described three thermal printing heads 2,3,4 longitudinally are crisscross arranged respectively in described two mounting grooves; The heating region 7,8 and the heating region 8,12 that are made of semiconductor element of adjacent thermal printing head 2,3 and thermal printing head 3,4 are connected in the radial direction mutually at installation base plate 1.For ease of thermal print media moving in print procedure, on described installation base plate 1, longitudinally be disposed with three thermal printing heads 2,3,4; Be provided with backing plate 9,13,14 in corresponding to the horizontal mounting groove 5 of the thermal printing head 3 in the described inclination mounting groove 6 and in the inclination mounting groove 6 corresponding to the thermal printing head 2,4 in the described horizontal mounting groove 5, the height of described backing plate 9,13,14 is equal to or less than the height of corresponding thermal printing head 3,2,4.For reducing the temperature of thermal printing head 2,3,4 in the print procedure, in installation base plate 1, longitudinally offer the path 10 that cools, 11, can implement cooling by air-cooled or feeding cooling fluid.
Claims (3)
1. a no physics seam thermal printing head comprises installation base plate (1), longitudinally arranges at least two thermal printing heads (2,3) that are arranged on the described installation base plate (1); It is characterized in that: being spaced along the longitudinal on the plate face of described installation base plate (1) is provided with two mounting grooves, and a mounting groove is horizontal mounting groove (5), and another is the inclination mounting groove (6) that tilts towards horizontal mounting groove (5) direction; The baseplane vertical line angle α of described two mounting grooves is: 5 °＜α＜50 °; Described at least two thermal printing heads (2,3) longitudinally are crisscross arranged respectively in described two mounting grooves; The heating region (7,8) that is made of semiconductor element of adjacent two thermal printing heads (2,3) is connected in the radial direction mutually at installation base plate (1).
2. no physics seam thermal printing head according to claim 1 is characterized in that: longitudinally be disposed with three thermal printing heads (2,3,4) on described installation base plate (1); Be provided with backing plate (9,13,14) in corresponding to the horizontal mounting groove (5) of the thermal printing head (3) in the described inclination mounting groove (6) and in the inclination mounting groove (6) corresponding to the thermal printing head in the described horizontal mounting groove (5) (2,4), the height of described backing plate (9,13,14) is equal to or less than the height of corresponding thermal printing head (3,2,4).
3. no physics seam thermal printing head according to claim 1 and 2 is characterized in that: longitudinally offer the passage that cools (10,11) in described installation base plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110024828 CN102126356A (en) | 2011-01-24 | 2011-01-24 | Physical seam-free heat sensitive printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110024828 CN102126356A (en) | 2011-01-24 | 2011-01-24 | Physical seam-free heat sensitive printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102126356A true CN102126356A (en) | 2011-07-20 |
Family
ID=44264751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110024828 Pending CN102126356A (en) | 2011-01-24 | 2011-01-24 | Physical seam-free heat sensitive printing head |
Country Status (1)
| Country | Link |
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| CN (1) | CN102126356A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109605945A (en) * | 2019-01-16 | 2019-04-12 | 曲阜市玉樵夫科技有限公司 | Engineering blueprint print unit, device and method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4626870A (en) * | 1983-08-25 | 1986-12-02 | Sharp Kabushiki Kaisha | Dual density two-sided thermal head |
| JPH02175262A (en) * | 1988-12-28 | 1990-07-06 | Ricoh Co Ltd | Thermal head |
| JPH04226369A (en) * | 1990-08-06 | 1992-08-17 | Ricoh Co Ltd | Long thermal head and jig for regulation of height |
| JPH0585019A (en) * | 1991-09-26 | 1993-04-06 | Ricoh Co Ltd | Cooling device of thermal head |
| JPH08169130A (en) * | 1994-12-16 | 1996-07-02 | Graphtec Corp | Thermal head |
| US5943083A (en) * | 1996-12-16 | 1999-08-24 | Agfa-Gevaert N.V. | Assembly comprising a plurality of thermal heads |
| CN201931730U (en) * | 2011-01-24 | 2011-08-17 | 河南沃达丰数码科技有限公司 | Thermal printing head without physical seam |
-
2011
- 2011-01-24 CN CN 201110024828 patent/CN102126356A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4626870A (en) * | 1983-08-25 | 1986-12-02 | Sharp Kabushiki Kaisha | Dual density two-sided thermal head |
| JPH02175262A (en) * | 1988-12-28 | 1990-07-06 | Ricoh Co Ltd | Thermal head |
| JPH04226369A (en) * | 1990-08-06 | 1992-08-17 | Ricoh Co Ltd | Long thermal head and jig for regulation of height |
| JPH0585019A (en) * | 1991-09-26 | 1993-04-06 | Ricoh Co Ltd | Cooling device of thermal head |
| JPH08169130A (en) * | 1994-12-16 | 1996-07-02 | Graphtec Corp | Thermal head |
| US5943083A (en) * | 1996-12-16 | 1999-08-24 | Agfa-Gevaert N.V. | Assembly comprising a plurality of thermal heads |
| CN201931730U (en) * | 2011-01-24 | 2011-08-17 | 河南沃达丰数码科技有限公司 | Thermal printing head without physical seam |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109605945A (en) * | 2019-01-16 | 2019-04-12 | 曲阜市玉樵夫科技有限公司 | Engineering blueprint print unit, device and method |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110720 |