CN201921800U - Nitrogen pressure type photoresist supply system capable of preventing air bubbles - Google Patents
Nitrogen pressure type photoresist supply system capable of preventing air bubbles Download PDFInfo
- Publication number
- CN201921800U CN201921800U CN2011200177889U CN201120017788U CN201921800U CN 201921800 U CN201921800 U CN 201921800U CN 2011200177889 U CN2011200177889 U CN 2011200177889U CN 201120017788 U CN201120017788 U CN 201120017788U CN 201921800 U CN201921800 U CN 201921800U
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- pressure
- photoresist
- valve
- nitrogen
- photoetching
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Abstract
The utility model relates to the field of semiconductor packaging, in particular to a nitrogen pressure type photoresist supply system capable of preventing air bubbles, which is used in the production of semiconductors. A photoresist bottle is placed in a pressure bucket of the system, the pressure bucket is covered by a perforated board seal connector, a photoresist pipe is inserted to the bottom of the photoresist bottle via the perforated board seal connector, the photoresist pipe running through the pressure bucket is connected to a bubble remover, the output end of the bubble remover is sequentially connected to a solution valve and a nozzle, an intake pipeline and an exhaust pipeline are mounted on the pressure bucket, the intake pipeline is connected to a two-position three-way electromagnetic valve, the two-position three-way electromagnetic valve is connected to a reducing valve, the reducing valve is connected with a nitrogen source, and the exhaust pipeline is connected to a relief valve. The system utilizes nitrogen pressure to supply power for pressurizing high-viscosity photoresist, and by automatically controlling pressure supply before photoresist application and pressure relief after photoresist application, the system can prevent long-time pressure supply which can cause nitrogen to be dissolved in photoresist to produce air bubbles during photoresist application.
Description
Technical field
The utility model relates to the semiconductor packages field, be specially a kind of nitrogen pressure mode and supply the photoetching colloid system in order to the prevented bubble in semiconductor production, in the time of semiconductor production, use nitrogen pressure and supply with high-viscosity photolithographic, realize that the photoresist supply system is simple, low-cost and safely and fast.
Background technology
At present, semiconductor packages commonly used all is a high-viscosity photolithographic, and high-viscosity photolithographic is supplied with the high viscosity glue pump that needs special use, and high viscosity glue pump costs an arm and a leg, and safeguards also very inconvenient.
In addition, if adopt simple nitrogen pressure supply system, again can be owing to the long-time pressure effect of nitrogen, can make in gluing, to produce bubble by a large amount of nitrogen of dissolving in the photoresist, cause defective workmanship, have a strong impact on product quality.
The utility model content
In order to overcome above-mentioned all deficiencies, the purpose of this utility model is to provide a kind of nitrogen pressure mode of bubble that prevents to supply the photoetching colloid system, finish the mode that the supply of nitrogen pressure and pressure release are finished in the back by the supply of nitrogen pressure before the technology gluing begins with in technology, solve nitrogen gas dissolved in the problem of photoresist.
The technical solution of the utility model is:
A kind of nitrogen pressure mode of bubble that prevents is supplied the photoetching colloid system, this system is provided with pressure-reducing valve, two-bit triplet magnetic valve, glue bottle, pressure pot, soup valve, row's bulb apparatus, photoetching sebific duct, threading seal nipple, shower nozzle, air inlet pipeline, gas exhaust piping, in pressure pot, place photoresist glue bottle, be covered with the threading seal nipple on the pressure pot, the photoetching sebific duct is inserted into photoresist bottle bottom by the threading seal nipple, the photoetching sebific duct that passes pressure pot is connected to row's bulb apparatus, and the output of row's bulb apparatus is connected to soup valve and shower nozzle successively; Air inlet pipeline and gas exhaust piping are housed on pressure pot, and air inlet pipeline is connected to the two-bit triplet magnetic valve, and the two-bit triplet magnetic valve is connected to pressure-reducing valve, and pressure-reducing valve is connected to the nitrogen source of the gas, and gas exhaust piping is connected to safety relief valve.
The described nitrogen pressure mode of bubble that prevents is supplied the photoetching colloid system, the pressure of pressure-reducing valve is adjusted to specified pressure, automatic control by the two-bit triplet magnetic valve switches to the supply nitrogen pressure before being implemented in and dripping glue, finishes back cut-out nitrogen pressure and drainage pressure dripping glue.
The described nitrogen pressure mode of bubble that prevents is supplied the photoetching colloid system, electronic scale is arranged below the glue bottle.
The described nitrogen pressure mode of bubble that prevents is supplied the photoetching colloid system, and manual three-way valve is set on air inlet pipeline.
Advantage of the present utility model and beneficial effect are:
1, the utility model is simple and practical, the convenient and safe and reliable automatic supply system of photoresist of photoresist replacing, and it is simple in structure, and cost is low.
2, the utility model gives warning in advance, and photoresist is changed in prompting automatically.
3, the utility model avoids and solves the problem that nitrogen pressure supply photoresist produces bubble by two methods, adopt special-purpose row's bulb apparatus to get rid of bubble, use automatic decompression valve to guarantee pressure security, use electronic scale to feed back the photoresist that prompting more renews automatically simultaneously.
Description of drawings
Fig. 1 is that the utility model can prevent that the nitrogen pressure mode of bubble from supplying photoetching colloid system schematic diagram.
Among the figure, 1 pressure-reducing valve; 2 two-bit triplet magnetic valves; 3 manual three-way valves; 4 glue bottles; 5 pressure pots; 6 electronic scales; 7 safety relief valves; 8 soup valves; 9 row's bulb apparatus; 10 photoetching sebific ducts; 11 threading seal nipples; 12 shower nozzles; 13 air inlet pipelines; 14 gas exhaust pipings.
The specific embodiment
As shown in Figure 1, the utility model can prevent that in semiconductor production the nitrogen pressure mode of bubble from supplying the photoetching colloid system and mainly comprising: pressure-reducing valve 1, two-bit triplet magnetic valve 2, manual three-way valve 3, glue bottle 4, pressure pot 5, electronic scale 6, safety relief valve 7, soup valve 8, row's bulb apparatus 9, photoetching sebific duct 10, threading seal nipple 11, shower nozzle 12, air inlet pipeline 13, gas exhaust piping 14 etc., specific as follows:
In pressure pot 5, place photoresist glue bottle 4, be covered with threading seal nipple 11 on the pressure pot 5, photoetching sebific duct 10 is inserted into photoresist bottle 4 bottoms by threading seal nipple 11, pass photoetching sebific duct 10 row's of being connected to bulb apparatus 9 of pressure pot 5, the output of row's bulb apparatus 9 is connected to soup valve 8 and shower nozzle 12 successively.Air inlet pipeline 13 and gas exhaust piping 14 are housed on pressure pot 5, air inlet pipeline 13 is connected to two-bit triplet magnetic valve 2, two-bit triplet magnetic valve 2 is connected to pressure-reducing valve 1, pressure-reducing valve 1 is connected to the nitrogen source of the gas, gas exhaust piping 14 is connected to safety relief valve 7, when system met accident the pressure overload, the safety relief valve 7 automatic discharge pressures of meeting and the feedback of reporting to the police played the effect of safety guarantee.
The nitrogen source of the gas is connected on the pressure-reducing valve 1, pressure by pressure-reducing valve 1 is adjusted to specified pressure, be connected on the two-bit triplet magnetic valve 2, the automatic control by two-bit triplet magnetic valve 2 switches to the supply nitrogen pressure before being implemented in and dripping glue, finishes back cut-out nitrogen pressure and drainage pressure dripping glue.Reach: do not have the effect of pressure when pressure, inoperative are arranged during work.
When gluing at first, after nitrogen pressure was supplied with, the high-viscosity photolithographic of glue bottle 4 the insides was forced out, and filtered through 9 pairs of bubbles of row's bulb apparatus earlier, and then was transported on the wafer that needs gluing through soup valve 8, shower nozzle 12.
The result shows, the utility model relates to by nitrogen pressure provides power to make high-viscosity photolithographic produce pressure, begin prerequisite voltage supply power by being controlled at gluing automatically, after gluing finishes, lay down pressure, prevent because long-time supply pressure makes the nitrogen gas dissolved defective workmanship that produces bubble when causing gluing in photoresist.
Claims (3)
1. the nitrogen pressure mode that can prevent bubble is supplied the photoetching colloid system, it is characterized in that: this system is provided with pressure-reducing valve, two-bit triplet magnetic valve, glue bottle, pressure pot, soup valve, row's bulb apparatus, photoetching sebific duct, threading seal nipple, shower nozzle, air inlet pipeline, gas exhaust piping, in pressure pot, place photoresist glue bottle, be covered with the threading seal nipple on the pressure pot, the photoetching sebific duct is inserted into photoresist bottle bottom by the threading seal nipple, the photoetching sebific duct that passes pressure pot is connected to row's bulb apparatus, and the output of row's bulb apparatus is connected to soup valve and shower nozzle successively; Air inlet pipeline and gas exhaust piping are housed on pressure pot, and air inlet pipeline is connected to the two-bit triplet magnetic valve, and the two-bit triplet magnetic valve is connected to pressure-reducing valve, and pressure-reducing valve is connected to the nitrogen source of the gas, and gas exhaust piping is connected to safety relief valve.
2. supply the photoetching colloid system according to the described nitrogen pressure mode of bubble that prevents of claim 1, it is characterized in that: below the glue bottle electronic scale is arranged.
3. supply the photoetching colloid system according to the described nitrogen pressure mode of bubble that prevents of claim 1, it is characterized in that: manual three-way valve is set on air inlet pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200177889U CN201921800U (en) | 2011-01-19 | 2011-01-19 | Nitrogen pressure type photoresist supply system capable of preventing air bubbles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200177889U CN201921800U (en) | 2011-01-19 | 2011-01-19 | Nitrogen pressure type photoresist supply system capable of preventing air bubbles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201921800U true CN201921800U (en) | 2011-08-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200177889U Expired - Fee Related CN201921800U (en) | 2011-01-19 | 2011-01-19 | Nitrogen pressure type photoresist supply system capable of preventing air bubbles |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201921800U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104992916A (en) * | 2015-07-21 | 2015-10-21 | 深圳市捷佳伟创新能源装备股份有限公司 | An etchant feeding device and a wet-type etching apparatus using the same |
| CN105314250A (en) * | 2014-05-30 | 2016-02-10 | 盛美半导体设备（上海）有限公司 | Fixing and weighing device for photoresist bottle |
| CN113534610A (en) * | 2021-08-05 | 2021-10-22 | 宁波润华全芯微电子设备有限公司 | Photoresist air isolation system |
| CN114160383A (en) * | 2021-11-25 | 2022-03-11 | 上海大花自动化科技股份有限公司 | Novel glue supply device |
-
2011
- 2011-01-19 CN CN2011200177889U patent/CN201921800U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105314250A (en) * | 2014-05-30 | 2016-02-10 | 盛美半导体设备（上海）有限公司 | Fixing and weighing device for photoresist bottle |
| CN104992916A (en) * | 2015-07-21 | 2015-10-21 | 深圳市捷佳伟创新能源装备股份有限公司 | An etchant feeding device and a wet-type etching apparatus using the same |
| CN104992916B (en) * | 2015-07-21 | 2018-02-23 | 深圳市捷佳伟创新能源装备股份有限公司 | A kind of etching liquid liquid feed device and the humidifying etching apparatus using the device |
| CN113534610A (en) * | 2021-08-05 | 2021-10-22 | 宁波润华全芯微电子设备有限公司 | Photoresist air isolation system |
| CN113534610B (en) * | 2021-08-05 | 2023-10-27 | 宁波润华全芯微电子设备有限公司 | Photoresist air isolation system |
| CN114160383A (en) * | 2021-11-25 | 2022-03-11 | 上海大花自动化科技股份有限公司 | Novel glue supply device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110810 Termination date: 20180119 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |