CN201901350U - Novel silicon wafer packaging box - Google Patents
Novel silicon wafer packaging box Download PDFInfo
- Publication number
- CN201901350U CN201901350U CN2010206258419U CN201020625841U CN201901350U CN 201901350 U CN201901350 U CN 201901350U CN 2010206258419 U CN2010206258419 U CN 2010206258419U CN 201020625841 U CN201020625841 U CN 201020625841U CN 201901350 U CN201901350 U CN 201901350U
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- silicon wafer
- silicon chip
- packaging box
- packaging
- wafer packaging
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Abstract
The utility model relates to the technical field of silicon wafer packaging, in particular to a semiconductor/monocrystal in photovoltaic industry/polycrystalline silicon wafer packaging box. The novel silicon wafer packaging box has the characteristics that the packaging box comprises a silicon wafer carrier containing a plurality of independent table cells. The novel silicon wafer packaging box adopts a branching integrated packaging way, the packaging operation steps are more concise, the packaging efficiency is improved, the appearance is more attractive, silicon wafers can be effectively protected, and the fragment rate is reduced.
Description
Technical background
The present invention relates to silicon chip packing technique field, relate in particular to the packing box of a kind of quartz conductor/photovoltaic industry monocrystalline/polycrystalline silicon chips.
Background technology
Worsen at global warming, human ecological environment, conventional energy resources shortage of resources and causing under the form of environmental pollution, solar photovoltaic technology is in fast development period; The fast development of photovoltaic industry in recent years, industry is increasing to the demand of silicon chip, and also when the river rises the boat goes up for the silicon chip price, makes productive costs significantly rise, wherein the higher silicon chip manufacturing enterprise of also always perplexing of fragment rate has wherein occupied cooresponding ratio because silicon chip is packed the fragment that causes.
Traditional EPS packing that traditional silicon chip packing is still used and compound type packing make silicon chip can not be protected effectively in transportation, and fragment rate is general all at 1-2%.
Summary of the invention
The purpose of this utility model designs exactly provides a kind of in transportation, can effectively protect silicon chip, reduces the novel package of fragment rate.
A kind of novel silicon chip packing box is characterized in that described packing box comprises a silicon chip carrier that includes some separate unit lattice.
Described packing box comprises box body and shape and the corresponding lid of box body that includes silicon chip carrier.
Described silicon chip carrier material is the polyethylene foam cotton.
The utility model is to be body with novel environment friendly packing polyethylene foam cotton (EPE), and how many body interior produces the rectangle hollow grid of corresponding size according to packing silicon chip quantity, and hollow grid will hold carrier as silicon chip.
The utility model material polyethylene foam cotton (EPE), it produces countless separated foams by low density polyethylene (LDPE) fat through physical blowing and constitutes, customer service the shortcoming of frangible, the distortion of common foamed glue, recovery difference; Have water proof protection against the tide, shockproof, plurality of advantages such as plasticity is good, toughness is strong, reconstituted circularly, environmental protection, resistance power are strong, also the good chemical resistance of tool is the ideal substitute of Traditional Packing material.This material is to the protective capability of silicon chip, and no matter in the water proof protection against the tide, or the breakage-proof aspect of antidetonation all is greatly improved, and fragment rate is controlled at below 0.5%.
The utility model adopts dichotomous entire package mode, and the packaging operation step is more succinct, has not only improved packaging efficiency, and more attractive in appearance.
Description of drawings
Fig. 1 is the utility model structural representation
Fig. 2 is the utility model carrier structure scheme drawing
Wherein: box body 1, lid 2, carrier 3, cell 4, silicon chip 5.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is further specified:
As Figure 1-3, packing box comprises box body 1, lid 2, and box body 1 includes carrier 3, and carrier 3 is according to packing the rectangle hollow grid how much silicon chip quantity produces corresponding size, and promptly the separate unit lattice 4.For example: after silicon chip 5 skins are used PE film plastic packaging, just can insert respectively in the box as shown in Figure 1, operate convenient and efficient more.
Entire package effect after this packing box fills up, silicon chips periphery can be played effective protection to silicon chip by complete filling.
Claims (3)
1. a novel silicon chip packing box is characterized in that described packing box comprises a silicon chip carrier that includes some separate unit lattice.
2. packing box according to claim 1 is characterized in that described packing box comprises box body and shape and the corresponding lid of box body that includes silicon chip carrier.
3. packing box according to claim 1 and 2 is characterized in that described silicon chip carrier material is the polyethylene foam cotton.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206258419U CN201901350U (en) | 2010-11-25 | 2010-11-25 | Novel silicon wafer packaging box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206258419U CN201901350U (en) | 2010-11-25 | 2010-11-25 | Novel silicon wafer packaging box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201901350U true CN201901350U (en) | 2011-07-20 |
Family
ID=44271948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206258419U Expired - Fee Related CN201901350U (en) | 2010-11-25 | 2010-11-25 | Novel silicon wafer packaging box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201901350U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102280531A (en) * | 2011-08-17 | 2011-12-14 | 苏州阿波罗光伏科技有限公司 | Silicon wafer transfer device |
| CN102826299A (en) * | 2012-09-17 | 2012-12-19 | 中利腾晖光伏科技有限公司 | Photovoltaic module storage box |
| CN103373539A (en) * | 2012-04-17 | 2013-10-30 | 瓦克化学股份公司 | Packing of polycrystalline silicon |
| CN105438645A (en) * | 2015-11-24 | 2016-03-30 | 无锡普瑞腾传动机械有限公司 | Improved silicon wafer transportation packaging box |
| CN105438605A (en) * | 2015-11-24 | 2016-03-30 | 无锡普瑞腾传动机械有限公司 | Solar cell silicon wafer transportation packaging box |
| CN105764801A (en) * | 2013-11-22 | 2016-07-13 | 瓦克化学股份公司 | Process for producing polycrystalline silicon |
| CN106061845A (en) * | 2014-03-03 | 2016-10-26 | 瓦克化学股份公司 | Process for producing polycrystalline silicon |
-
2010
- 2010-11-25 CN CN2010206258419U patent/CN201901350U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102280531A (en) * | 2011-08-17 | 2011-12-14 | 苏州阿波罗光伏科技有限公司 | Silicon wafer transfer device |
| CN103373539A (en) * | 2012-04-17 | 2013-10-30 | 瓦克化学股份公司 | Packing of polycrystalline silicon |
| CN103373539B (en) * | 2012-04-17 | 2016-09-14 | 瓦克化学股份公司 | The packaging of polysilicon |
| US10221002B2 (en) | 2012-04-17 | 2019-03-05 | Wacker Chemie Ag | Packing of polycrystalline silicon |
| CN102826299A (en) * | 2012-09-17 | 2012-12-19 | 中利腾晖光伏科技有限公司 | Photovoltaic module storage box |
| CN105764801A (en) * | 2013-11-22 | 2016-07-13 | 瓦克化学股份公司 | Process for producing polycrystalline silicon |
| CN106061845A (en) * | 2014-03-03 | 2016-10-26 | 瓦克化学股份公司 | Process for producing polycrystalline silicon |
| CN106061845B (en) * | 2014-03-03 | 2017-12-08 | 瓦克化学股份公司 | method for producing polysilicon |
| CN105438645A (en) * | 2015-11-24 | 2016-03-30 | 无锡普瑞腾传动机械有限公司 | Improved silicon wafer transportation packaging box |
| CN105438605A (en) * | 2015-11-24 | 2016-03-30 | 无锡普瑞腾传动机械有限公司 | Solar cell silicon wafer transportation packaging box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110720 Termination date: 20141125 |
|
| EXPY | Termination of patent right or utility model |