CN102280531A - Silicon wafer transfer device - Google Patents
Silicon wafer transfer device Download PDFInfo
- Publication number
- CN102280531A CN102280531A CN2011102356591A CN201110235659A CN102280531A CN 102280531 A CN102280531 A CN 102280531A CN 2011102356591 A CN2011102356591 A CN 2011102356591A CN 201110235659 A CN201110235659 A CN 201110235659A CN 102280531 A CN102280531 A CN 102280531A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- end wall
- several
- diapire
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a silicon wafer transfer device, which comprises a bottom wall, end walls arranged at two ends of the bottom wall and side walls arranged on two sides of the bottom wall, wherein the five walls enclose accommodating space for accommodating silicon wafers; the bottom wall is convexly provided with a plurality of first bulged parts outwards; a plurality of first grooves which are clamped with the first bulged parts are formed below the end walls and the side walls; two ends of the end walls are convexly provided with a plurality of second bulged parts outwards; a plurality of second grooves which are clamped with the second bulged parts are formed at two ends of the side walls; a shaft rod is arranged in the center of each end wall; and operating grooves are formed on the side walls. The silicon wafer transfer device can prevent metal from being polluted, and also can prevent the silicon wafers from being broken.
Description
Technical field
The present invention relates to a kind of silicon chip and reprint device.
Background technology
In the prior art, in the production process of solar battery sheet, often silicon chip need be transferred to next procedure from last process.Thereby just need provide a kind of reprinting device that silicon chip is stacked in batch into wherein, thereby finish the transfer of inter process.Yet in the prior art, reprint device and generally fix, thereby may bring metallic pollution hidden danger, in addition,, usually cause the silicon chip fragmentation because the axostylus axostyle Position Design of reprinting inside the device is unreasonable to silicon chip by the metal screw.
Therefore, be necessary to provide a kind of silicon chip that solves the problems of the technologies described above to reprint device.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of silicon chip of metallic pollution that prevents to reprint device.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of silicon chip is reprinted device, it comprises: diapire, be installed on the end wall at diapire two ends and be installed on the diapire side walls, above-mentioned five walls are around forming the receiving space of accommodating silicon chip, described diapire outwards convexes with several first protuberances, described end wall and the below of sidewall are provided with and above-mentioned first protuberance several first grooves of buckle mutually, the two ends of described end wall outwards convex with several second protuberances, the two ends of described sidewall are provided with and second protuberance several second grooves of buckle mutually, the central authorities of described end wall are provided with axostylus axostyle, and described sidewall is provided with operating groove.
The invention has the beneficial effects as follows: outwards convex with several first protuberances by described diapire, described end wall and the below of sidewall are provided with and above-mentioned first protuberance several first grooves of buckle mutually, the two ends of described end wall outwards convex with several second protuberances, the two ends of described sidewall are provided with and second protuberance several second grooves of buckle mutually, the central authorities of described end wall are provided with axostylus axostyle, described sidewall is provided with operating groove, thereby not only can prevent metallic pollution, and can prevent the silicon chip fragmentation.
Description of drawings
Fig. 1 reprints the structural representation of device for silicon chip.
Among Fig. 1: 1, diapire, 10, first protuberance, 2, end wall, 20,30 first grooves, 21, second protuberance, 22, axostylus axostyle, 3, sidewall, 31, second groove, 32, operating groove, 4, receiving space.
Embodiment
See also Fig. 1, a kind of silicon chip is reprinted device, it comprises: diapire 1, be installed on the end wall 2 at diapire 1 two ends and be installed on diapire 1 side walls 3, above-mentioned five walls are around forming the receiving space 4 of accommodating silicon chip, described diapire 1 outwards convexes with several first protuberances 10, described end wall 2 and the below of sidewall 3 are provided with and above-mentioned first protuberance 10 several first grooves 20 of buckle mutually, 30, the two ends of described end wall 2 outwards convex with several second protuberances 21, the two ends of described sidewall 3 are provided with and second protuberance 21 several second grooves 31 of buckle mutually, the central authorities of described end wall 2 are provided with axostylus axostyle 22, thereby a receiving space is divided into two receiving spaces.Described sidewall 3 is provided with operating groove 32, thereby device is reprinted in convenient carrying, and described first, second protuberance 10,21 is the isosceles trapezoid setting, thereby makes the buckle better effects if.Described operating groove 32 ovalize settings, thus make things convenient for the workman to carry, and described silicon chip is reprinted device and is made by polytetrafluoroethylene.
Among the present invention, because of not re-using the metal screw, do not fix by silicon chip reprinting device, thereby not only can prevent metallic pollution,, have a segment distance with the top of end wall 2 because of axostylus axostyle 22 is arranged at the nearly middle part of end wall 2, therefore, after in silicon chip is installed on silicon chip reprinting device, when needs take out silicon chip a slice a slice, can silicon chip be taken out from position directly over the axostylus axostyle 22, thereby take out silicon chip at operating personnel's the hand middle part that can touch silicon chip from reprint device like this, thereby can prevent the silicon chip fragmentation.
Claims (4)
1. a silicon chip is reprinted device, it is characterized in that: described silicon chip is reprinted device and is comprised: diapire, be installed on the end wall at diapire two ends and be installed on the diapire side walls, above-mentioned five walls are around forming the receiving space of accommodating silicon chip, described diapire outwards convexes with several first protuberances, described end wall and the below of sidewall are provided with and above-mentioned first protuberance several first grooves of buckle mutually, the two ends of described end wall outwards convex with several second protuberances, the two ends of described sidewall are provided with and second protuberance several second grooves of buckle mutually, the central authorities of described end wall are provided with axostylus axostyle, and described sidewall is provided with operating groove.
2. a kind of silicon chip as claimed in claim 1 is reprinted device, and it is characterized in that: described first, second protuberance is the isosceles trapezoid setting.
3. a kind of silicon chip as claimed in claim 2 is reprinted device, it is characterized in that: described operating groove ovalize is provided with.
4. reprint device as claim 1 or 2 or 3 described a kind of silicon chips, it is characterized in that: described silicon chip is reprinted device and is made by polytetrafluoroethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102356591A CN102280531A (en) | 2011-08-17 | 2011-08-17 | Silicon wafer transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102356591A CN102280531A (en) | 2011-08-17 | 2011-08-17 | Silicon wafer transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102280531A true CN102280531A (en) | 2011-12-14 |
Family
ID=45105841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102356591A Pending CN102280531A (en) | 2011-08-17 | 2011-08-17 | Silicon wafer transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102280531A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2133533Y (en) * | 1992-06-29 | 1993-05-19 | 吴启贤 | Multi-purpose dismantling packing box |
| CN201421837Y (en) * | 2008-12-05 | 2010-03-10 | 无锡市奥曼特科技有限公司 | Silicon chip placing device |
| CN201484901U (en) * | 2009-08-17 | 2010-05-26 | 天威新能源(成都)硅片有限公司 | Solar cell silicon chip transportation package box |
| CN201708141U (en) * | 2010-06-22 | 2011-01-12 | 北京市塑料研究所 | Silicon slice bearing flower basket |
| CN201788991U (en) * | 2010-08-26 | 2011-04-06 | 常州亿晶光电科技有限公司 | Special carrying device for texturing silicon wafers |
| CN201901350U (en) * | 2010-11-25 | 2011-07-20 | 浙江昱辉阳光能源有限公司 | Novel silicon wafer packaging box |
| CN202183407U (en) * | 2011-08-17 | 2012-04-04 | 苏州阿波罗光伏科技有限公司 | Silicon wafer trans-carrier |
-
2011
- 2011-08-17 CN CN2011102356591A patent/CN102280531A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2133533Y (en) * | 1992-06-29 | 1993-05-19 | 吴启贤 | Multi-purpose dismantling packing box |
| CN201421837Y (en) * | 2008-12-05 | 2010-03-10 | 无锡市奥曼特科技有限公司 | Silicon chip placing device |
| CN201484901U (en) * | 2009-08-17 | 2010-05-26 | 天威新能源(成都)硅片有限公司 | Solar cell silicon chip transportation package box |
| CN201708141U (en) * | 2010-06-22 | 2011-01-12 | 北京市塑料研究所 | Silicon slice bearing flower basket |
| CN201788991U (en) * | 2010-08-26 | 2011-04-06 | 常州亿晶光电科技有限公司 | Special carrying device for texturing silicon wafers |
| CN201901350U (en) * | 2010-11-25 | 2011-07-20 | 浙江昱辉阳光能源有限公司 | Novel silicon wafer packaging box |
| CN202183407U (en) * | 2011-08-17 | 2012-04-04 | 苏州阿波罗光伏科技有限公司 | Silicon wafer trans-carrier |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102280531A (en) | Silicon wafer transfer device | |
| CN202183407U (en) | Silicon wafer trans-carrier | |
| CN201732778U (en) | Deposition ring and electrostatic sucker | |
| CN208378998U (en) | 12 inches of Multi-function extension chemical deposition processing procedure chamber equipment | |
| CN203304491U (en) | Sand core component for forming cylinder head water jacket in cylinder head casting technology | |
| CN205248402U (en) | Battery heat radiation structure reaches unmanned aerial vehicle who contains it | |
| CN207198735U (en) | A kind of resource shared device of application message technology | |
| CN202909814U (en) | Cylindrical mine separation box | |
| CN106026446A (en) | Compressor, variable frequency motor, stator punching sheet of motor, and machining method thereof | |
| CN103706653B (en) | Micro-channel parallel flow aluminum pipe extruding production mould | |
| CN103659661A (en) | Circuit board fixing device | |
| CN202087824U (en) | Stainless steel mold special for sintering | |
| CN202612547U (en) | Box body mechanism for secondary cylinder gear speed reducer | |
| CN205438162U (en) | A accurate counter weight mechanism for grinding and polishing equipment is last | |
| CN205415658U (en) | Paper robot is got with plain glass substrate to liquid crystal | |
| CN105872422A (en) | Display device and television | |
| CN203546135U (en) | Epitaxial wafer evaporation-plating device | |
| CN201503874U (en) | Semiconductor couple arrangement die | |
| CN202796888U (en) | Graphite boat ceramic loop | |
| CN204063598U (en) | Ceiling mounting type water heater and shell thereof | |
| CN204165306U (en) | There is the semi-conductor cooling box of drip tray | |
| CN204136281U (en) | Mould | |
| CN202367057U (en) | Die-adjustable slotted lower die reinforcing device | |
| CN203400991U (en) | Mobile phone antenna elastic piece die | |
| CN218262271U (en) | Glass hot bending jig and glass hot bending forming equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111214 |