CN105438645A - Improved silicon wafer transportation packaging box - Google Patents
Improved silicon wafer transportation packaging box Download PDFInfo
- Publication number
- CN105438645A CN105438645A CN201510819183.4A CN201510819183A CN105438645A CN 105438645 A CN105438645 A CN 105438645A CN 201510819183 A CN201510819183 A CN 201510819183A CN 105438645 A CN105438645 A CN 105438645A
- Authority
- CN
- China
- Prior art keywords
- box body
- packaging box
- transportation packaging
- silicon wafer
- storage layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
Abstract
The invention discloses an improved silicon wafer transportation packaging box. The improved silicon wafer transportation packaging box comprises a box body (1), storage layers (2), shock-resistant layers (3) and packaging openings (4). The four to nine storage layers (2) are distributed in the box body (1). One shock-resistant layer (3) is distributed on the surface of each storage layer (2). The four to nine packaging openings (4) are formed in the side walls, in linkage with the storage layers (2), of the box body (1). The storage layers (2) are as large as the upper bottom surface and the lower bottom surface of the box body (1). According to the improved silicon wafer transportation packaging box, through the arrangement of the shock-resistant layers, collision between the storage layers and silicon wafers can be effectively avoided, the breakage rate of the silicon wafers in the transferring process can be effectively decreased, and the number of the silicon wafers which can be stored in an effective space is larger. The improved silicon wafer transportation packaging box has high promotional value in the technical field of manufacturing of silicon wafer containers.
Description
Technical field
The present invention relates to silicon wafer container manufacturing technology field, be specifically related to a kind of silicon chip transportation packaging box of improvement.
Background technology
The chip that silicon chip is made is famous " miraculous foresight ", has surprising arithmetic capability.No matter how complicated mathematical problem, physical problem and engineering problem, also the work capacity no matter calculated has much, as long as staff tells it by computer keyboard problem, and assign the thinking and instruction of solving a problem, computing machine just can tell you answer within the extremely short time.Like this, those manually calculate the problem needing to spend several years, many decades time, and computing machine may only need a few minutes just can solve.Even some manpower cannot calculate the problem of result, and computing machine also can tell you answer very soon.
In silicon chip of solar cell production process, silicon chip needs packed and transported, conventional packing box adopts up and down to opening structure, at the bottom of box, first puts liner, then set level silicon chip, finally put liner again, then lid cap seal case.This manner of packing is simple, but stacks and can produce a large amount of fragment in handling process, increases productive costs.
Summary of the invention
Instant invention overcomes above-mentioned shortcoming, and a kind of silicon chip transportation packaging box of improvement is provided.
To achieve these goals, the present invention realizes by the following technical solutions: the silicon chip transportation packaging box of this improvement comprises box body, storage layer, anti-impacting layer and encapsulation mouth, the inside of described box body is distributed with 4 ~ 9 storage layer, surface distribution one deck anti-impacting layer of storage layer, the sidewall of the box body linked with storage layer is installed 4 ~ 9 and encapsulates mouth; The size of described storage layer is identical with the upper bottom surface of box body.
Described box body is cuboid.
Preferably, the thickness of described storage layer is 1/19 ~ 1/12 of box body height.
Preferably, described storage layer is identical with the size of anti-impacting layer.
Preferably, described encapsulation mouth is oblong.
The invention has the beneficial effects as follows: scheme is complete, make simple, easy to use; Anti-impacting layer the collision can effectively avoided between storage layer and silicon chip is set, effectively reduce the fragment rate of silicon chip in handling process; The more of silicon chip can be stored in available space; For ease of maintenaince and maintenance.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
The implication of Reference numeral in figure, 1, box body, 2, storage layer, 3, anti-impacting layer, 4, encapsulation mouth.
Detailed description of the invention
The technological means realized for making the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with detailed description of the invention, setting forth the present invention further.
The silicon chip transportation packaging box of this improvement to achieve these goals, the present invention realizes by the following technical solutions: the silicon chip transportation packaging box of this improvement comprises box body 1, storage layer 2, anti-impacting layer 3 and encapsulation mouth 4, the inside of described box body 1 is distributed with 4 ~ 9 storage layer 2, surface distribution one deck anti-impacting layer 3 of storage layer 2, the sidewall of the box body 1 linked with storage layer 2 installs 4 ~ 9 and encapsulates mouth 4; The size of described storage layer 2 is identical with the upper bottom surface of box body 1; Box body 1 is cuboid; The thickness of storage layer 2 is 1/19 ~ 1/12 of box body 1 height; Storage layer 2 is identical with the size of anti-impacting layer 3; Encapsulation mouth 4 is oblong.
More than show and describe groundwork of the present invention and principal character and advantage of the present invention.The technical personnel of the industry should be understood; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification sheets just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (5)
1. the silicon chip transportation packaging box improved, it is characterized in that, comprise box body (1), storage layer (2), anti-impacting layer (3) and encapsulation mouth (4), the inside of described box body (1) is distributed with 4 ~ 9 storage layer (2), surface distribution one deck anti-impacting layer (3) of storage layer (2), the sidewall of the box body (1) linked with storage layer (2) installs 4 ~ 9 and encapsulates mouth (4); The size of described storage layer (2) is identical with the upper bottom surface of box body (1).
2. the silicon chip transportation packaging box of improvement according to claim 1, is characterized in that, described box body (1) is cuboid.
3. the silicon chip transportation packaging box of improvement according to claim 1, is characterized in that, the thickness of described storage layer (2) is 1/19 ~ 1/12 of box body (1) height.
4. the silicon chip transportation packaging box of improvement according to claim 1, is characterized in that, described storage layer (2) is identical with the size of anti-impacting layer (3).
5. the silicon chip transportation packaging box of improvement according to claim 1, is characterized in that, described encapsulation mouth (4) is oblong.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510819183.4A CN105438645A (en) | 2015-11-24 | 2015-11-24 | Improved silicon wafer transportation packaging box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510819183.4A CN105438645A (en) | 2015-11-24 | 2015-11-24 | Improved silicon wafer transportation packaging box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105438645A true CN105438645A (en) | 2016-03-30 |
Family
ID=55549383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510819183.4A Pending CN105438645A (en) | 2015-11-24 | 2015-11-24 | Improved silicon wafer transportation packaging box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105438645A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201181694Y (en) * | 2008-01-29 | 2009-01-14 | 江阴浚鑫科技有限公司 | Transfer case used for containing silicon slice |
| CN201484901U (en) * | 2009-08-17 | 2010-05-26 | 天威新能源(成都)硅片有限公司 | Solar cell silicon chip transportation package box |
| CN201901350U (en) * | 2010-11-25 | 2011-07-20 | 浙江昱辉阳光能源有限公司 | Novel silicon wafer packaging box |
| CN202940265U (en) * | 2012-10-31 | 2013-05-15 | 广东爱康太阳能科技有限公司 | Crystal silicon solar cell for epicyclic vehicle |
| CN203544701U (en) * | 2013-10-29 | 2014-04-16 | 高佳太阳能股份有限公司 | Silicon wafer transportation packing box |
| CN205366545U (en) * | 2015-11-24 | 2016-07-06 | 无锡普瑞腾传动机械有限公司 | Modified silicon chip transport package box |
-
2015
- 2015-11-24 CN CN201510819183.4A patent/CN105438645A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201181694Y (en) * | 2008-01-29 | 2009-01-14 | 江阴浚鑫科技有限公司 | Transfer case used for containing silicon slice |
| CN201484901U (en) * | 2009-08-17 | 2010-05-26 | 天威新能源(成都)硅片有限公司 | Solar cell silicon chip transportation package box |
| CN201901350U (en) * | 2010-11-25 | 2011-07-20 | 浙江昱辉阳光能源有限公司 | Novel silicon wafer packaging box |
| CN202940265U (en) * | 2012-10-31 | 2013-05-15 | 广东爱康太阳能科技有限公司 | Crystal silicon solar cell for epicyclic vehicle |
| CN203544701U (en) * | 2013-10-29 | 2014-04-16 | 高佳太阳能股份有限公司 | Silicon wafer transportation packing box |
| CN205366545U (en) * | 2015-11-24 | 2016-07-06 | 无锡普瑞腾传动机械有限公司 | Modified silicon chip transport package box |
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Legal Events
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160330 |
|
| WD01 | Invention patent application deemed withdrawn after publication |