CN201895192U - Lead welding device for laser gyro piezoelectric ceramic assembly - Google Patents

Lead welding device for laser gyro piezoelectric ceramic assembly Download PDF

Info

Publication number
CN201895192U
CN201895192U CN 201020299200 CN201020299200U CN201895192U CN 201895192 U CN201895192 U CN 201895192U CN 201020299200 CN201020299200 CN 201020299200 CN 201020299200 U CN201020299200 U CN 201020299200U CN 201895192 U CN201895192 U CN 201895192U
Authority
CN
China
Prior art keywords
ceramic element
laser gyro
piezo ceramic
rack body
fixing strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201020299200
Other languages
Chinese (zh)
Inventor
张自国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
No 618 Research Institute of China Aviation Industry
Original Assignee
No 618 Research Institute of China Aviation Industry
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by No 618 Research Institute of China Aviation Industry filed Critical No 618 Research Institute of China Aviation Industry
Priority to CN 201020299200 priority Critical patent/CN201895192U/en
Application granted granted Critical
Publication of CN201895192U publication Critical patent/CN201895192U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Gyroscopes (AREA)

Abstract

The utility model relates to a lead welding device for a laser gyro piezoelectric ceramic assembly, which comprises a bracket main body, compaction threads and two battens, wherein the bracket main body is provided with a round platform, the two battens are symmetrically arranged at the two sides of the round platform, the compaction threads are arranged on the battens, and the bracket main body is provided with a fixing strip C1 and a fixing strip C2 which are used for fixing a small bench clamp. The fixing strip C1 and the fixing strip C2 are respectively positioned on the side surface and the bottom surface of the bracket main body and are vertical to each other in space. A plurality of round holes are arranged round the round platform. The piezoelectric ceramic assembly is arranged through the round platform, is fixed by the compaction threads and the battens and are then fixed on the fixing strip C1 and the fixing strip C2 by the small bench clamp in a clamping way, thereby avoiding deformation of a bracket when a partial oxide layer of the bracket is peeled off and the lead welding is carried out.

Description

A kind of device that is used for laser gyro piezo ceramic element wire bonds
Technical field
The utility model relates to a kind of device that is used for laser gyro piezo ceramic element wire bonds.
Background technology
Piezo ceramic element owing to the wire bonds position is on the different azimuth and surface of assembly, thereby causes the wire bonds difficulty when carrying out wire bonds.And before welding, require to peel off localized oxide on the assembly support.When peeling off oxide layer, need apply active force,, can cause the assembly support distortion in this process, thereby influence the assembling and the result of use of entire mechanism because modular construction complexity and wall are thin to support.
The utility model content
The utility model purpose is: in order to solve the problem that deformation of timbering takes place prior art laser gyro piezo ceramic element easily when peeling off oxide layer and wire bonds, the utility model provides the on-deformable laser gyro piezo ceramic element of a kind of support lead bonding device.
The technical solution of the utility model is: a kind of device that is used for laser gyro piezo ceramic element wire bonds, it comprises rack body, collet threaded and two press strips, wherein, has circular platform on the described rack body, described press strip is symmetricly set on the both sides of circular platform, collet threaded is arranged on the press strip, and described rack body has two and can be used for little bench vice fixing fixed strip C1 and C2, and fixed strip C1 and C2 are in the side and the bottom surface of rack body respectively.
Described fixed strip C1 is spatially vertical mutually with C2.
Describedly be provided with some circular holes around circular platform.
Described fixed strip C1 and C2 and rack body are connected to an integral body.
The beneficial effects of the utility model are: the utility model laser gyro piezo ceramic element lead bonding device is arranged on piezo ceramic element on the circular platform of rack body, and fix by collet threaded and press strip, clamp by small-sized bench vice then and be fixed on fixed strip C1 and the fixed strip C2, increased stressed fulcrum, thereby when peeling off support localized oxide and wire bonds, can avoid support to produce distortion.And the utility model is applicable to the wire bonds of a plurality of diverse locations on the piezo ceramic element support; This frock cooperates small-sized bench vice, makes welding operation very convenient, has improved operating efficiency.
Description of drawings
Fig. 1 is the structural representation of the utility model laser gyro piezo ceramic element lead bonding device one better embodiment;
Fig. 2 is the stereogram of Fig. 1;
Fig. 3 is the assembling schematic diagram when carrying out the welding of first bond pad locations;
Fig. 4 is the assembling schematic diagram when carrying out the welding of second bond pad locations;
Fig. 5 is the assembling schematic diagram when carrying out the welding of the 3rd bond pad locations;
Wherein, 1-rack body, 2-collet threaded, 3-press strip, 4-circular platform, 5-circular hole, 6-first bond pad locations, 7-second bond pad locations, 8-the 3rd bond pad locations, 9-piezo ceramic element.
The specific embodiment
The utility model is described in further detail below by the specific embodiment:
Please consult Fig. 1 and Fig. 2 simultaneously, wherein Fig. 1 is the structural representation of the utility model laser gyro piezo ceramic element lead bonding device one better embodiment, and Fig. 2 is the stereogram of Fig. 1.Described laser gyro piezo ceramic element welder is made up of rack body 1, two collet threaded 2 and two press strips 3.Wherein have circular platform 4 on the rack body 1, be provided with 6 circular holes 5, to make things convenient for the placement of piezoelectric ceramics support around circular platform 4.Described press strip 3 is symmetricly set on the both sides of circular platform 4, and collet threaded 2 is arranged on the press strip 3.In addition, described rack body 1 has two and can be used for little bench vice fixing fixed strip C1 and C2, and fixed strip C1 and C2 are in the side and the bottom surface of rack body 1 respectively, and spatially vertical mutually.
Present embodiment needs the position of welding to mainly contain three, is respectively first bond pad locations 6, second bond pad locations 7 and the 3rd bond pad locations 8.Wherein, first welding position 6 is positioned at the rack body both sides, and the circular platform 4 that second bond pad locations 7 and the 3rd bond pad locations 8 are closed at rack body 1 is provided with.
See also Fig. 3, it is the assembling schematic diagram when carrying out 6 welding of first bond pad locations.For this kind assembly manipulation mode, piezo ceramic element 9 fronts place on the circular platform 4 of rack body 1, and 6 bonding arms place circular hole 5, by collet threaded 2 and press strip 3 piezo ceramic element 9 are fixed on this frock; And clamp fixed strip C1, thereby conveniently carry out the welding operation at first bond pad locations, 6 places with small-sized bench vice.
See also Fig. 4, it is the assembling schematic diagram when carrying out 7 welding of second bond pad locations.Among the figure, piezo ceramic element 9 fronts are arranged on the circular platform 4, and 6 bonding arms of piezo ceramic element 9 are arranged in the circular hole 5.By collet threaded 2 and press strip 3 piezo ceramic element 9 is fixed on this insidious welder, and clamps fixed strip C2, thereby conveniently carry out the weld job of second bond pad locations 7 with small-sized bench vice.
See also Fig. 5, it is the assembling schematic diagram when carrying out 8 welding of the 3rd bond pad locations.For this kind assembly manipulation mode, the 3rd welding position is at the back side of piezo ceramic element, so piezo ceramic element 9 back sides place on the circular platform 4 of rack body 1, by collet threaded 2 and press strip 3 piezo ceramic element 9 is fixed on this frock; And clamp fixed strip C2, thereby conveniently carry out the welding operation at the 3rd bond pad locations 8 places with small-sized bench vice.
The utility model laser gyro piezo ceramic element lead bonding device is provided with piezo ceramic element by circular platform, and fix by collet threaded and press strip, clamp by small-sized bench vice then and be fixed on fixed strip C1 and the fixed strip C2, thereby when peeling off support localized oxide and wire bonds, can avoid support to produce distortion.And the utility model laser gyro piezo ceramic element lead bonding device increases stressed fulcrum by two orthogonal fixing points, is applicable to the wire bonds of a plurality of diverse locations on the piezo ceramic element support; This frock cooperates small-sized bench vice, makes welding operation very convenient, has improved operating efficiency.

Claims (4)

1. device that is used for laser gyro piezo ceramic element wire bonds, it is characterized in that: comprise rack body [1], collet threaded [2] and two press strips [3], wherein, has circular platform [4] on the described rack body [1], described press strip [3] is symmetricly set on the both sides of circular platform [4], collet threaded [2] is arranged on the press strip [3], described rack body [1] has two and can be used for little bench vice fixing fixed strip C1 and C2, and fixed strip C1 and C2 are in the side and the bottom surface of rack body [1] respectively.
2. the device that is used for laser gyro piezo ceramic element wire bonds according to claim 1 is characterized in that: described fixed strip C1 is spatially vertical mutually with C2.
3. the device that is used for laser gyro piezo ceramic element wire bonds according to claim 2 is characterized in that: describedly be provided with some circular holes [5] around circular platform [4].
4. the device that is used for laser gyro piezo ceramic element wire bonds according to claim 3 is characterized in that: described fixed strip C1 and C2 and rack body [1] are connected to an integral body.
CN 201020299200 2010-08-19 2010-08-19 Lead welding device for laser gyro piezoelectric ceramic assembly Expired - Fee Related CN201895192U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201020299200 CN201895192U (en) 2010-08-19 2010-08-19 Lead welding device for laser gyro piezoelectric ceramic assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201020299200 CN201895192U (en) 2010-08-19 2010-08-19 Lead welding device for laser gyro piezoelectric ceramic assembly

Publications (1)

Publication Number Publication Date
CN201895192U true CN201895192U (en) 2011-07-13

Family

ID=44253110

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201020299200 Expired - Fee Related CN201895192U (en) 2010-08-19 2010-08-19 Lead welding device for laser gyro piezoelectric ceramic assembly

Country Status (1)

Country Link
CN (1) CN201895192U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104551510A (en) * 2013-10-12 2015-04-29 深圳先进技术研究院 Large-angle spot-welding processing jig for piezoelectric ceramic piece
CN104972259A (en) * 2014-04-10 2015-10-14 深圳先进技术研究院 Spot welding machining fixture for large-angle piezoelectric ceramic piece

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104551510A (en) * 2013-10-12 2015-04-29 深圳先进技术研究院 Large-angle spot-welding processing jig for piezoelectric ceramic piece
CN104972259A (en) * 2014-04-10 2015-10-14 深圳先进技术研究院 Spot welding machining fixture for large-angle piezoelectric ceramic piece

Similar Documents

Publication Publication Date Title
TWI649888B (en) Wire transfer device for tandem device
KR102544587B1 (en) LED chip, display panel assembly device and assembly method
CN201895192U (en) Lead welding device for laser gyro piezoelectric ceramic assembly
TW200915362A (en) Power transformer structure
CN101890605A (en) Power semiconductor chip welding device
JP6444311B2 (en) Electrode bonding apparatus and electrode bonding method
JP2007243535A5 (en)
CN210715452U (en) Pressing clamp for bonding cambered surface structure
JP2012212712A5 (en)
CN207046405U (en) A kind of battery core fixture
JPWO2021085216A5 (en)
CN103552067A (en) Single-finger clamping and overturning manipulator
CN203720802U (en) Device convenient for assembling touch screen
CN201346533Y (en) Piezoelectric ceramic transducer for ultrasonic toothbrush
WO2012128176A1 (en) Method for manufacturing solar cell module
CN201862947U (en) Cooler welding mould base
JP2016087666A (en) Ultrasonic joining method
CN103594458A (en) Lining plate structure
CN105023874A (en) Fixture capable of carrying out independent pressurizing and simultaneous sintering on multiple large-area chips with different thicknesses
CN205201360U (en) Magnetism jar bonding anchor clamps
CN206952433U (en) A kind of weld jig of photovoltaic module
CN216289489U (en) COC wire bonding mechanism
CN218385317U (en) Battery cell positioning structure and welding tool with same
CN216645216U (en) Sensor chip mounting table device for chip mounting of strain gauge
CN215861176U (en) Gum anchor clamps of quick gum

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110713

Termination date: 20170819

CF01 Termination of patent right due to non-payment of annual fee