CN201893245U - Sealing structure of solid electrolytic capacitor - Google Patents
Sealing structure of solid electrolytic capacitor Download PDFInfo
- Publication number
- CN201893245U CN201893245U CN 200920292787 CN200920292787U CN201893245U CN 201893245 U CN201893245 U CN 201893245U CN 200920292787 CN200920292787 CN 200920292787 CN 200920292787 U CN200920292787 U CN 200920292787U CN 201893245 U CN201893245 U CN 201893245U
- Authority
- CN
- China
- Prior art keywords
- layer
- terminal
- solid electrolytic
- negative pole
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 43
- 239000007787 solid Substances 0.000 title claims abstract description 29
- 238000007789 sealing Methods 0.000 title abstract description 6
- 239000010410 layer Substances 0.000 claims abstract description 31
- 239000005030 aluminium foil Substances 0.000 claims abstract description 14
- 229920000123 polythiophene Polymers 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 9
- 238000003475 lamination Methods 0.000 claims abstract description 8
- 239000011247 coating layer Substances 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 28
- 229920003002 synthetic resin Polymers 0.000 claims description 25
- 239000000057 synthetic resin Substances 0.000 claims description 25
- 238000010276 construction Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 239000007784 solid electrolyte Substances 0.000 claims description 7
- 239000005871 repellent Substances 0.000 claims description 6
- 230000009471 action Effects 0.000 claims description 4
- 230000008901 benefit Effects 0.000 abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052799 carbon Inorganic materials 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000805 composite resin Substances 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005755 formation reaction Methods 0.000 description 5
- 208000034189 Sclerosis Diseases 0.000 description 4
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 4
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- 241000790917 Dioxys <bee> Species 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229930192474 thiophene Natural products 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- YVSCCMNRWFOKDU-UHFFFAOYSA-N hexanedioic acid Chemical compound OC(=O)CCCCC(O)=O.OC(=O)CCCCC(O)=O YVSCCMNRWFOKDU-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model discloses a sealing structure of a solid electrolytic capacitor, which comprises a plurality of pieces of capacitor components arranged in a lamination way, wherein a positive pole terminal and a negative pole terminal are arranged below the lowest layer; the lower surfaces of the positive pole terminal and the negative pole terminal are used as conductive junctions; composite resin is adopted to package the pieces of capacitor components, the positive pole terminal and the negative pole terminal; in the pieces of capacitor components, a metal aluminum foil is used as a positive pole body and has a valve function; a dielectric substance oxide film and a negative pole layer are arranged on the surface of the aluminium foil; the negative pole layer comprises a solid electrolytic layer formed by polythiophene conductive polymer, a carbon layer and a silver coating layer; and on the dielectric substance oxide film, the part formed with the negative pole layer is the negative pole part ,and the part formed without the negative pole layer is the positive pole part. The sealing structure of the solid electrolytic capacitor has the advantages of close package and good sealability.
Description
Technical field
The utility model relates to the capacitor Sealing Technology, particularly, relates to a kind of hermetically-sealed construction of solid electrolytic capacitor.
Background technology
At notification number is in the TaiWan, China patent of " I28387 number ", and a kind of solid electrolytic capacitor is provided.Shown in Fig. 1 a and Fig. 1 b, solid electrolytic capacitor 10 comprises the multi-plate condenser assembly 6 that lamination is provided with, below multi-plate condenser assembly 6 undermost, anode terminal 12 and cathode terminal 13 are installed, stay the lower surface of anode terminal 12 and cathode terminal 13, can pass through synthetic resin 14, multi-plate condenser assembly 6, anode terminal 12 and cathode terminal 13 are encapsulated covering.
In above-mentioned multi-plate condenser assembly 6, shown in Fig. 1 b, the aluminium foil 1 of metal has valve action as anode bodies, and the surface of aluminium foil 1 is formed with dielectric medium oxide-film 2 and cathode layer 3; Cathode layer 3 is solid electrolyte layer 3a, carbon-coating 3b and silver coating layer 3c formations that the electric conductive polymer by polythiophene system (polythiophene) forms; On dielectric medium oxide-film 2, the part that is formed with cathode layer 3 is a negative pole part 8, and the part that is not formed with cathode layer 3 is an anode portion 7; Like this, in multi-plate condenser assembly 6, the anode portion 7 of adjacent two chip capacitor device assemblies 6 is welded to one another fixing, and the negative pole part 8 of adjacent two chip capacitor device assemblies 6 is then fixing by conductivity solid 18 each other, thereby forms the solid electrolytic capacitor 10 of lamination-type.
Near the negative pole part 8 in anode terminal 12 bottom surfaces of above-mentioned anode portion 7 and the boundary 15 of anode portion 7, be provided with the 1st stress and relax the 16 and the 2nd stress that cracks and relax and crack 17, anode portion 7 can relax the 16 and the 2nd stress that cracks at the 1st stress and relax 17 bendings of cracking.Like this, in the boundary 15 of anode portion 7 and negative pole part 8 or can suppress applying of bending stress near it, therefore, the stress that puts on this part can diminish.Yet, in this patent case, when encapsulation coverage of synthetic resin 14, because synthetic resin 14 is different with the coefficient of expansion of anode terminal 12, cathode terminal 13, and can't compact package, can't realize airtight and watertight, easily cause problems such as short circuit and leakage current to take place, therefore, how to improve above-mentioned can't compact package etc. problem, will be the problem that relevant industry is demanded urgently making great efforts.
Summary of the invention
The purpose of this utility model is, at the problems referred to above, proposes a kind of hermetically-sealed construction of solid electrolytic capacitor, so that realize can compact package and the advantage of good airproof performance.
For achieving the above object, the technical solution adopted in the utility model is: a kind of hermetically-sealed construction of solid electrolytic capacitor, comprise the multi-plate condenser assembly that lamination is provided with, in described multi-plate condenser assembly, anode terminal and cathode terminal are installed below undermost capacitor assembly, and the lower surface of described anode terminal and cathode terminal is as conductive junction point; Adopt synthetic resin, described multi-plate condenser assembly, anode terminal and cathode terminal are encapsulated, the process of described encapsulation is specially: at first, encapsulation one deck secondary or the hardened material more than the secondary on described anode terminal and cathode terminal, under first section dry hardening temperature, make described hardened material when the dry sclerosis of coating,, form parcel closely attached to the surface of anode terminal and cathode terminal; Secondly, adopt described synthetic resin, described multi-plate condenser assembly, anode terminal and cathode terminal are encapsulated covering, under second section package temperature and pressure, described hardened material, anode terminal, cathode terminal are formed closely with synthetic resin combine.Here, described hardened material utilizes package temperature and pressure under package temperature, described hardened material is formed closely with anode terminal, cathode terminal and synthetic resin combine.
Further, described first section dry hardening temperature is 60-150 ℃.
Further, described second section package temperature is 150-300 ℃.
Further, in described multi-plate condenser assembly, the aluminium foil of metal has valve action as anode bodies, at described aluminium foil surface dielectric medium oxide-film and cathode layer is arranged; Described cathode layer is solid electrolyte layer, carbon-coating and the silver coating layer formation that the electric conductive polymer by polythiophene system (polythiophene) forms; On described dielectric medium oxide-film, the part that is formed with cathode layer is a negative pole part, and the part that is not formed with cathode layer is an anode portion.
Further, in described hardened material, comprise water-repellent substance.
Further, in described water-repellent substance, comprise getter or drier.
The hermetically-sealed construction of the solid electrolytic capacitor of each embodiment of the utility model, owing to comprise the multi-plate condenser assembly that lamination is provided with, in the multi-plate condenser assembly, anode terminal and cathode terminal are installed below undermost capacitor assembly, and the lower surface of anode terminal and cathode terminal is as conductive junction point; Adopt synthetic resin, multi-plate condenser assembly, anode terminal and cathode terminal are encapsulated, the process of encapsulation is specially: at first, encapsulation one deck secondary or the hardened material more than the secondary on anode terminal and cathode terminal, under first section dry hardening temperature, make hardened material when the dry sclerosis of coating,, form parcel closely attached to the surface of anode terminal and cathode terminal; Secondly, adopt synthetic resin, multi-plate condenser assembly, anode terminal and cathode terminal are encapsulated covering, under second section package temperature and pressure, hardened material, anode terminal, cathode terminal are formed closely with synthetic resin combine.Here, hardened material utilizes package temperature and pressure under package temperature, hardened material is formed closely with anode terminal, cathode terminal and synthetic resin combine, make product not because of the thermal coefficient of expansion of different materials cause be knotted bad; Can't compact package and the defective of sealing difference thereby can overcome in the prior art, so that realize can compact package and the advantage of good airproof performance.
Other features and advantages of the utility model will be set forth in the following description, and, partly from specification, become apparent, perhaps understand by implementing the utility model.The purpose of this utility model and other advantages can realize and obtain by specifically noted structure in the specification of being write, claims and accompanying drawing.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Description of drawings
Accompanying drawing is used to provide further understanding of the present utility model, and constitutes the part of specification, is used from explanation the utility model with embodiment one of the present utility model, does not constitute restriction of the present utility model.In the accompanying drawings:
Fig. 1 a is the structural representation of the cutaway view of solid electrolytic capacitor in the prior art;
Fig. 1 b is the structural representation of the cutaway view of solid electrolytic capacitor assembly in the solid electrolytic capacitor in the prior art;
Fig. 2 is the structural representation according to the cutaway view of solid electrolytic capacitor in the hermetically-sealed construction of the utility model solid electrolytic capacitor;
Fig. 3 is the structural representation according to the cutaway view of solid electrolytic capacitor assembly in the hermetically-sealed construction of the utility model solid electrolytic capacitor.
In conjunction with the accompanying drawings, Reference numeral is as follows among the utility model embodiment:
The 30-solid electrolytic capacitor; The 32-anode terminal; The 33-cathode terminal; 34-synthetic resin; The 36-capacitor assembly; The 361-aluminium foil; 362-dielectric medium oxide-film; The 363a-solid electrolyte layer; The 363b-carbon-coating; 363c-silver coating layer; The 367-anode portion; The 368-negative pole part; 40-post-curing material; The 50-elargol.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described, should be appreciated that preferred embodiment described herein only is used for description and interpretation the utility model, and be not used in qualification the utility model.
According to the utility model embodiment, provide a kind of hermetically-sealed construction of solid electrolytic capacitor.As shown in Figures 2 and 3, in the present embodiment, solid electrolytic capacitor 30 comprises the multi-plate condenser assembly 36 that lamination is provided with, and is positioned at the lower surface of orlop capacitor assembly 36, and anode terminal 32 and cathode terminal 33 are installed; The lower surface of anode terminal 32 and cathode terminal 33 is as conductive junction point, by synthetic resin 34 multi-plate condenser assembly 36, anode terminal 32 and cathode terminal 33 encapsulated to constitute.
Wherein, in encapsulation process, at first, encapsulation one deck secondary or the hardened material more than the secondary 40 on anode terminal 32 and cathode terminal 33, make hardened material 40 under the dry sclerosis of coating (about 60-150 ℃), be attached on the surface of anode terminal 32 and cathode terminal 33, stiff formation coats closely; Secondly, adopt synthetic resin 34 that multi-plate condenser assembly 36, anode terminal 32 and cathode terminal 33 are encapsulated covering, making hardened material 40 (is the package temperature of synthetic resin 34 in package temperature, between about 150-300 ℃) under, under the package temperature and pressure of correspondence, hardened material 40 forms closely with anode terminal 32, cathode terminal 33 and synthetic resin 34 and combines, make solid electrolytic capacitor 30 not because of the thermal coefficient of expansion of unlike material cause be knotted bad, to reach preferable air-tightness.
In above-mentioned multi-plate condenser assembly 36, the structure of every chip capacitor device assembly 36 can be referring to Fig. 2 and Fig. 3, and this as anode bodies, has valve action as the aluminium foil 361 of metal, and the surface of aluminium foil 361 is formed with dielectric medium oxide-film 362 and cathode layer 363; Cathode layer 363 is solid electrolyte layer 363a, carbon-coating 363b and silver coating layer 363c formations that the electric conductive polymer by polythiophene system (polythiophene) forms; On dielectric medium oxide-film 362, the part that is formed with cathode layer 363 is a negative pole part 368, and the part that is not formed with cathode layer 363 is an anode portion 367; Like this, under the layer-by-layer state of multi-plate condenser assembly 36, make the anode portion 367 of adjacent two chip capacitor device assemblies 36 be welded to one another fixing, and the multi-plate condenser assembly 36 that the negative pole part 368 that makes adjacent two chip capacitor device assemblies 36 is provided with by elargol 50, with lamination each other is then fixing, thereby forms the solid electrolytic capacitor 30 of lamination-type.
In the present embodiment, the manufacture method of multi-plate condenser assembly 36, identical with the manufacture method of multi-plate condenser assembly 36 in the prior art, concrete steps are as follows:
In the aqueous solution of the adipic acid (adipic acid) of predetermined concentration etc., change into processing with predetermined voltage for aluminium foil 361, make aluminium foil 361 form the dielectric medium oxide-film 362 that constitutes by metal oxide; Afterwards, aluminium foil 361 is immersed in by 3, in the mixed liquor that 4-second dioxy supports thiophene, the P-toluenesulfonic acid is ferrous and the 1-butanols constitutes, till the precalculated position, and on dielectric medium oxide-film 362, by chemical oxidation heavy and, form by 3 of electroconductive polymer polymer the solid electrolyte layer 363a that 4-second dioxy support thiophene constitutes; Next, repeated multiple times is immersed in the aluminium foil 361 that forms solid electrolyte layer in the solution that makes carbon dust be diffused in the aqueous solution or organic solvent, and with predetermined temperature and time, makes carbon dust drying, formation carbon-coating 363b; At last, form silver coating layer 363c, make the capacitor assembly 36 of present embodiment on the surface of carbon-coating 363b.
Further, in the above-described embodiments, can in the hardened material 40 of second coat, add water-repellent substance,, increase hardened material 40, synthetic resin 34 and the anode terminal 32 of second coat, the waterproof effect of cathode terminal 33 with after finishing encapsulation synthetic resin 34.
Further, in the above-described embodiments, in water-repellent substance, can add getter (getter) and drier (desiccants), with after finishing encapsulation synthetic resin 34, increase the waterproof of the hardened material 40, synthetic resin 34 of second coat and anode terminal 32, cathode terminal 33, the effect of airtight and watertight.
In sum, the hermetically-sealed construction of the solid electrolytic capacitor of each embodiment of the utility model, owing to comprise the multi-plate condenser assembly that lamination is provided with, anode terminal and cathode terminal are installed below undermost capacitor assembly, the lower surface of anode terminal and cathode terminal is as conductive junction point; Adopt synthetic resin, multi-plate condenser assembly, anode terminal and cathode terminal are encapsulated, the process of encapsulation is specially: at first, encapsulation one deck secondary or the hardened material more than the secondary on anode terminal and cathode terminal, under first section dry hardening temperature, make hardened material when the dry sclerosis of coating,, form parcel closely attached to the surface of anode terminal and cathode terminal; Secondly, adopt synthetic resin, multi-plate condenser assembly, anode terminal and cathode terminal are encapsulated covering, under second section package temperature and pressure, hardened material, anode terminal, cathode terminal are formed closely with synthetic resin combine.Here, hardened material utilizes package temperature and pressure under package temperature, hardened material is formed closely with anode terminal, cathode terminal and synthetic resin combine, make product not because of the thermal coefficient of expansion of different materials cause be knotted bad; Can't compact package and the defective of sealing difference thereby can overcome in the prior art, so that realize can compact package and the advantage of good airproof performance.
It should be noted that at last: the above only is preferred embodiment of the present utility model, be not limited to the utility model, although the utility model is had been described in detail with reference to previous embodiment, for a person skilled in the art, it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement.All within spirit of the present utility model and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (3)
1. the hermetically-sealed construction of a solid electrolytic capacitor, comprise the multi-plate condenser assembly that lamination is provided with, in described multi-plate condenser assembly, anode terminal and cathode terminal are installed below undermost capacitor assembly, the lower surface of described anode terminal and cathode terminal is as conductive junction point; Adopt synthetic resin, described multi-plate condenser assembly, anode terminal and cathode terminal encapsulated, it is characterized in that:
In described multi-plate condenser assembly, the aluminium foil of metal has valve action as anode bodies, at described aluminium foil surface dielectric medium oxide-film and cathode layer is arranged; Described cathode layer is to be that solid electrolyte layer, carbon-coating and the silver coating layer that the electric conductive polymer of polythiophene forms constitutes by polythiophene; On described dielectric medium oxide-film, the part that is formed with cathode layer is a negative pole part, and the part that is not formed with cathode layer is an anode portion.
2. the hermetically-sealed construction of solid electrolytic capacitor according to claim 1 is characterized in that, in described hardened material, comprises water-repellent substance.
3. the hermetically-sealed construction of solid electrolytic capacitor according to claim 2 is characterized in that, in described water-repellent substance, comprises getter or drier.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200920292787 CN201893245U (en) | 2009-12-09 | 2009-12-09 | Sealing structure of solid electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200920292787 CN201893245U (en) | 2009-12-09 | 2009-12-09 | Sealing structure of solid electrolytic capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201893245U true CN201893245U (en) | 2011-07-06 |
Family
ID=44222718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200920292787 Expired - Fee Related CN201893245U (en) | 2009-12-09 | 2009-12-09 | Sealing structure of solid electrolytic capacitor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201893245U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103177880A (en) * | 2011-12-21 | 2013-06-26 | Nec东金株式会社 | Solid electrolytic capacitor and method for producing the same |
-
2009
- 2009-12-09 CN CN 200920292787 patent/CN201893245U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103177880A (en) * | 2011-12-21 | 2013-06-26 | Nec东金株式会社 | Solid electrolytic capacitor and method for producing the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100869440B1 (en) | Laminated solid electrolytic condenser | |
CN101060040B (en) | Stacked solid electrolytic capacitor and manufacturing method thereof | |
CN104167490B (en) | Organic photoelectric device packaging method and organic photoelectric device packaging structure | |
CN102215743A (en) | Electroactive polymer transducer | |
JPS61159722A (en) | Solid electrolytic capacitor for mounting surface | |
US20180069206A1 (en) | Encapsulated microbattery having terminal connected to active layer through a via | |
CN101978447B (en) | Electrophoretically deposited cathode capacitor | |
JPWO2019065870A1 (en) | Electrolytic capacitors and their manufacturing methods | |
US20170125818A1 (en) | Method for manufacturing electrode structure for flexible energy storage device, electrode structure manufactured thereby, and energy storage device including same | |
US20120115019A1 (en) | Energy storage module | |
CN110249400A (en) | Solid electrolytic capacitor And Manufacturing approach | |
CN201893245U (en) | Sealing structure of solid electrolytic capacitor | |
US7906200B2 (en) | Composite circuit substrate structure | |
CN102064025B (en) | Protective device for solid electrolytic capacitor body | |
CN105118931A (en) | Array substrate, organic electroluminescence display panel, and display device | |
CN101980345A (en) | Packaging process of solid electrolytic capacitor | |
TWI431650B (en) | Manufacturing method of solid electrolytic capacitor and solid electrolytic capacitor thereof | |
US9490075B2 (en) | Method for fabricating solid electrolytic capacitors | |
CN202585134U (en) | Solid electrolytic capacitor possessing protection structure | |
CN102064022B (en) | Stress absorption device at anode terminal of solid electrolytic capacitor | |
CN103456502B (en) | Improved manufacturing method of solid electrolytic capacitor | |
CN102005300B (en) | Process for preparing solid electrolytic capacitor | |
CN202210472U (en) | Capacitor and electronic device possessing same | |
CN102385986A (en) | Capacitor and electronic device with same | |
CN102646520A (en) | Solid-state electrolytic capacitor with protective structure and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110706 Termination date: 20161209 |