TWI431650B - Manufacturing method of solid electrolytic capacitor and solid electrolytic capacitor thereof - Google Patents
Manufacturing method of solid electrolytic capacitor and solid electrolytic capacitor thereof Download PDFInfo
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Description
本發明係有關於一種電容器的製作方法及其電容器,尤指一種固態電解電容器的製作方法及其固態電解電容器。The present invention relates to a method of fabricating a capacitor and a capacitor thereof, and more particularly to a method of fabricating a solid electrolytic capacitor and a solid electrolytic capacitor thereof.
按,電子設備已快速朝體積小、重量輕及可攜帶之趨勢發展,因此,尺寸小且輕薄的電子組件之需求已經持續增加。尤其,用於通訊、個人電腦等電子設備之電子組件,如電容器等被動元件,必須滿足體積小而電氣特性佳之需求。According to the trend, electronic devices have rapidly developed toward small size, light weight and portability, so the demand for small and thin electronic components has continued to increase. In particular, electronic components used in electronic devices such as communications and personal computers, such as passive components such as capacitors, must meet the requirements of small size and good electrical characteristics.
電容器依電解液的型態來分類,則有液態電解電容器和固態電解電容器兩種。其中,前者的壽命決定於電解液乾涸的時間,而後者則因使用固態電解質,故無電解質乾涸之虞,而具有壽命長的特點。Capacitors are classified according to the type of electrolyte, and there are two types of liquid electrolytic capacitors and solid electrolytic capacitors. Among them, the life of the former is determined by the time when the electrolyte is dry, while the latter is due to the use of solid electrolyte, so there is no electrolyte dryness and long life.
傳統之表面黏著式鉭質固態電容元件結構具有電容器元件本體,電容器元件本體的內部設有以鉭金屬粉末製成之陽極元件,其為閥門作用金屬;陽極元件的外部被覆一層介電氧化薄膜;介電氧化薄膜的外部依序被覆固態電解層、碳層導體、陰極導體層等。而在傳統的製造方法中,以鉭金屬粉末製作所述的陽極元件具有相當高的技術門檻,舉例來說,為了增加電容量,必須使用小粒徑之鉭金屬粉末以增加其表面積,而鉭金屬粉末需經過高溫燒結步驟後方可成型為鉭燒結體。然而,隨著鉭金屬粉末的粒徑越小,其製作越為困難,亦使得成本增加;再者,小粒徑之鉭金屬粉末亦造成陰極劑難以滲入,且製程中的高溫燒結步驟亦使得整體製程越加複雜。The conventional surface-adhesive tantalum solid-state capacitive element structure has a capacitor element body, the anode of the capacitor element body is provided with an anode element made of ruthenium metal powder, which is a valve action metal; and the exterior of the anode element is coated with a dielectric oxide film; The external portion of the dielectric oxide film is sequentially coated with a solid electrolytic layer, a carbon layer conductor, a cathode conductor layer, and the like. In the conventional manufacturing method, the anode element is made of a base metal powder having a relatively high technical threshold. For example, in order to increase the capacitance, it is necessary to use a small particle size of the base metal powder to increase the surface area thereof. The metal powder is subjected to a high-temperature sintering step to form a sintered body. However, as the particle size of the base metal powder is smaller, the production becomes more difficult and the cost is increased. Furthermore, the small particle size of the base metal powder also makes the cathode agent difficult to infiltrate, and the high-temperature sintering step in the process also makes The overall process is more complicated.
本發明之主要目的,在於提供一種固態電解電容器的製作方法及其固態電解電容器,所述之製作方法可利用鋁粉取代鉭粉,以簡化製程的複雜度,如降低製程溫度等,故可達到降低成本之功效。The main object of the present invention is to provide a method for manufacturing a solid electrolytic capacitor and a solid electrolytic capacitor thereof, which can replace the tantalum powder with aluminum powder to simplify the process complexity, such as reducing the process temperature, etc., so that Reduce the cost of the effect.
本發明提出一種固態電解電容器的製作方法,包括以下步驟:成型一鋁質陽極;進行一化成步驟,以於該鋁質陽極的表面形成一介電層;形成一導電層於該介電層上;將該鋁質陽極與該導電層分別連接於一陽極電極及一陰極電極;以及進行一封裝步驟。The invention provides a method for fabricating a solid electrolytic capacitor, comprising the steps of: forming an aluminum anode; performing a chemical forming step to form a dielectric layer on the surface of the aluminum anode; forming a conductive layer on the dielectric layer The aluminum anode and the conductive layer are respectively connected to an anode electrode and a cathode electrode; and a packaging step is performed.
本發明更提出一種固態電解電容器,其具有一鋁質陽極;一成型於該鋁質陽極之表面的介電層;一設於該介電層上之導電層;以及一對電極端子,其包括一連接於該鋁質陽極之陽極電極與及一連接於該導電層之陰極電極。The present invention further provides a solid electrolytic capacitor having an aluminum anode, a dielectric layer formed on a surface of the aluminum anode, a conductive layer disposed on the dielectric layer, and a pair of electrode terminals including An anode electrode connected to the aluminum anode and a cathode electrode connected to the conductive layer.
因此,藉由鋁粉本身的特性,使製程被大幅簡化,例如鋁粉不需經過高溫燒結就可以形成結構強度佳的陽極,進而有效降低製程複雜度與成本;再者,鋁粉可先利用前處理使其表面具有高比表面積,故可提高所製成之電容器的特性。Therefore, the process of the aluminum powder itself is greatly simplified by the characteristics of the aluminum powder itself. For example, the aluminum powder can form an anode having good structural strength without high-temperature sintering, thereby effectively reducing process complexity and cost; further, the aluminum powder can be utilized first. The pretreatment has a high specific surface area on the surface, so that the characteristics of the fabricated capacitor can be improved.
本發明提出一種固態電解電容器的製作方法,其係利用鋁(Al)粉取代鉭(Ta)粉,以解決鉭粉在電容器的製作過程中所產生的問題。The invention provides a method for manufacturing a solid electrolytic capacitor, which uses aluminum (Al) powder instead of tantalum (Ta) powder to solve the problems caused by the tantalum powder in the manufacturing process of the capacitor.
本發明之固態電解電容器的製作方法可適用於晶片型或薄片型(或稱薄膜型)的固態電解電容器。針對晶片型固態電解電容器,本發明之固態電解電容器的製作方法至少包括以下步驟:The method for fabricating the solid electrolytic capacitor of the present invention can be applied to a solid-state electrolytic capacitor of a wafer type or a sheet type (or a film type). For the wafer type solid electrolytic capacitor, the manufacturing method of the solid electrolytic capacitor of the present invention includes at least the following steps:
步驟一:成型一鋁質陽極。首先,提供鋁粉末,並接著進行一冷壓步驟,以將所述之鋁粉末壓合成一鋁錠而形成所述之鋁質陽極11(如圖1所示)。在本具體實施例中,鋁粉末中可添加有黏結劑,如樟腦、硬脂酸、聚乙烯醇、萘等,黏結劑的添加量為3至5wt%;而經充分地混合後,藉由利用壓模進行冷壓步驟,將鋁粉末壓製成型為長方體的鋁錠。冷壓時之荷重可為3至15MN(Mega Newton)/m2 ,使冷壓後之鋁錠具有一定的體密度。Step 1: Form an aluminum anode. First, an aluminum powder is supplied, and then a cold pressing step is performed to press the aluminum powder into an aluminum ingot to form the aluminum anode 11 (shown in Fig. 1). In this embodiment, a binder may be added to the aluminum powder, such as camphor, stearic acid, polyvinyl alcohol, naphthalene, etc., and the binder is added in an amount of 3 to 5 wt%; and after being sufficiently mixed, by The cold pressing step is performed by a stamper, and the aluminum powder is press-formed into a rectangular parallelepiped aluminum ingot. The load at cold pressing may be 3 to 15 MN (Mega Newton)/m 2 , so that the aluminum ingot after cold pressing has a certain bulk density.
值得說明的是,由於鋁粉末表面之氧化鋁的物理特性,其在前述的冷壓步驟中即可被製程壓力所破壞,故使鋁粉之間形成以形成具強度的鋁錠,並使鋁粉之間相互連結而電性導通。換言之,本發明不需導入高溫燒結的步驟即可製作出電特性的鋁錠,而所壓製之鋁錠即可被應用為電容器之鋁質陽極11。It is worth noting that due to the physical properties of the alumina on the surface of the aluminum powder, it can be destroyed by the process pressure in the aforementioned cold pressing step, so that aluminum powder is formed to form an aluminum ingot having strength and aluminum is formed. The powders are connected to each other and electrically connected. In other words, the present invention can produce an aluminum ingot having electrical characteristics without introducing a high-temperature sintering step, and the pressed aluminum ingot can be applied as the aluminum anode 11 of the capacitor.
再者,為了提高固態電解電容器之電容量大、漏電流小的特性,在前述之冷壓步驟之前(即在提供鋁粉末的步驟之後),本發明之鋁粉末可藉由蝕刻方法將鋁粉末的表面形成海綿狀之不平整表面,例如將鋁粉末浸滯於酸性蝕刻液中,以於鋁粉末的表面形成凹凸狀之不平整表面,以提高 鋁粉末的比表面積,使所壓製之鋁錠可用於提供較佳的電容特性。Furthermore, in order to improve the characteristics of the solid electrolytic capacitor having a large capacitance and a small leakage current, the aluminum powder of the present invention can be aluminum powder by an etching method before the aforementioned cold pressing step (that is, after the step of providing aluminum powder). The surface of the surface forms a sponge-like uneven surface, for example, immersing the aluminum powder in an acidic etching solution to form an uneven surface on the surface of the aluminum powder to improve The specific surface area of the aluminum powder allows the pressed aluminum ingot to be used to provide better capacitance characteristics.
另一方面,在前述之冷壓步驟中,更包括將一引出電極111插設於鋁粉末中,使該引出電極111與鋁粉末共同被壓合成型。所述之引出電極111可為鉭絲或鋁線,在本具體實施例中,係使用厚度約為20μm之鋁線作為引出電極111,因目前鋁線的厚度較鉭絲為薄,故使用鋁線可進一步縮小電容元件之尺寸,但本發明不以此為限,引出電極111可依據實際的應用選擇適當的電極材料。On the other hand, in the cold pressing step described above, it is further included that an extraction electrode 111 is interposed in the aluminum powder, and the extraction electrode 111 is pressed and synthesized together with the aluminum powder. The extraction electrode 111 can be a wire or an aluminum wire. In the specific embodiment, an aluminum wire having a thickness of about 20 μm is used as the extraction electrode 111. Since the thickness of the aluminum wire is thinner than that of the wire, the aluminum is used. The wire can further reduce the size of the capacitor element, but the invention is not limited thereto, and the extraction electrode 111 can select an appropriate electrode material according to the actual application.
步驟二:進行一化成步驟,以於該鋁質陽極11的表面形成一介電層12(如圖1所示)。在本步驟中,係將壓製出之鋁錠進行化成處理,使氧化被覆膜(即絕緣性之氧化鋁皮膜)形成於鋁質陽極11之表面,以製成介電層12。上述化成反應可依不同的化成電壓、化成液來控制介電層12的厚度,本實施例係以己二酸銨系或磷酸系或兩者混合之化成液來製作所述之介電層12。Step 2: A chemical forming step is performed to form a dielectric layer 12 on the surface of the aluminum anode 11 (as shown in FIG. 1). In this step, the pressed aluminum ingot is subjected to a chemical conversion treatment, and an oxidized coating film (i.e., an insulating alumina film) is formed on the surface of the aluminum anode 11 to form a dielectric layer 12. In the above-described chemical conversion reaction, the thickness of the dielectric layer 12 can be controlled according to different chemical formation voltages and chemical conversion liquids. In the present embodiment, the dielectric layer 12 is formed by a chemical solution of ammonium adipate or phosphoric acid or a mixture of the two. .
步驟三:形成一導電層於該介電層12上。請配合圖1,在本實施例中,導電層可由導電高分子,如聚3,4-乙烯基二氧噻吩(PEDOT)、聚吡咯(polypyrrole)、聚噻吩(polythiophen)及碳膠(或石墨)、銀膠等所構成;具體而言,聚3,4-乙烯基二氧噻吩(PEDOT)材料可形成電解質層13,而配合碳膠層14、銀膠層15等則可形成所述之導電層,以作為電容器之陰極。Step 3: Form a conductive layer on the dielectric layer 12. Referring to FIG. 1 , in this embodiment, the conductive layer may be made of a conductive polymer such as poly 3,4-ethylenedioxythiophene (PEDOT), polypyrrole, polythiophen, and carbon (or graphite). , a silver glue or the like; specifically, a poly 3,4-ethylene dioxythiophene (PEDOT) material can form the electrolyte layer 13, and the carbon rubber layer 14, the silver glue layer 15 and the like can be formed to form the A conductive layer to serve as a cathode for the capacitor.
步驟四:將該鋁質陽極11與該導電層(即電解質層13、碳膠層14與銀膠層15之組合)分別連接於一對 電極端子,例如一陽極電極16A及一陰極電極16B。具體而言,陽極電極16A與陰極電極16B可藉由導電性接合劑或其他連接方法分別連接於引出電極111與銀膠層15。Step 4: connecting the aluminum anode 11 and the conductive layer (ie, the electrolyte layer 13, the carbon glue layer 14 and the silver glue layer 15) to a pair Electrode terminals, such as an anode electrode 16A and a cathode electrode 16B. Specifically, the anode electrode 16A and the cathode electrode 16B may be respectively connected to the extraction electrode 111 and the silver paste layer 15 by a conductive bonding agent or other connection method.
最後,進行一封裝步驟,例如利用樹脂等批覆材料覆蓋電容器,並裸露出陽極電極16A與陰極電極16B,再藉由進行固化、熟化(aging)等步驟以形成封裝體17,即可完成本發明之固態電解電容器。Finally, a packaging step is performed, for example, the capacitor is covered with a coating material such as a resin, and the anode electrode 16A and the cathode electrode 16B are exposed, and the package 17 is formed by performing steps of curing, aging, etc., thereby completing the present invention. Solid electrolytic capacitors.
請配合圖2,針對薄片型固態電解電容器,本發明之固態電解電容器的製作方法至少包括以下步驟:With reference to FIG. 2, for a thin-film solid electrolytic capacitor, the manufacturing method of the solid electrolytic capacitor of the present invention includes at least the following steps:
步驟一:成型一鋁質陽極。首先,提供一基板10;將含鋁粉之膠液塗佈於基板10上,並使含鋁之膠液固化以形成所述之鋁質陽極11′。在本實施例中,係將市售的鋁膠以印刷、噴塗等方法塗佈於基板10上,待其固化後即可形成電容器之鋁質陽極11′。而所述之膠液中所含的鋁粉亦可經過前處理,使其具有凹凸狀之不平整表面,以形成高比表面積的鋁粉。Step 1: Form an aluminum anode. First, a substrate 10 is provided; an aluminum powder-containing glue is applied onto the substrate 10, and the aluminum-containing glue is cured to form the aluminum anode 11'. In the present embodiment, a commercially available aluminum paste is applied to the substrate 10 by printing, spraying, or the like, and after it is cured, the aluminum anode 11' of the capacitor can be formed. The aluminum powder contained in the glue may also be pretreated to have an uneven surface of irregularities to form aluminum powder having a high specific surface area.
另外,同於前述實施例,在將含鋁粉之膠液塗佈於基板10上之步驟中,更包括將一引出電極(圖未示)插設於含鋁之膠液中,例如厚度約為20μm之鋁線,以利後續製程將陽極引出。In addition, in the same step as the foregoing embodiment, the step of applying the aluminum powder-containing glue to the substrate 10 further includes inserting an extraction electrode (not shown) into the aluminum-containing glue, for example, about the thickness. It is a 20 μm aluminum wire to facilitate the subsequent process of taking out the anode.
步驟二:進行一化成步驟,以於該鋁質陽極11′的表面形成一介電層12′(如圖2所示)。在本步驟中,係將基板10與鋁質陽極11′進行藉由化成處理,亦即陽極氧化,使氧化被覆膜(即絕緣性之氧化鋁皮膜)形成於鋁質陽極11′之表面,以製成介電層12′。上述化成 反應可依不同的化成電壓、化成液來控制介電層12′的厚度,本實施例係以己二酸銨系或磷酸系或兩者混合之化成液來製作所述之介電層12′。Step 2: A chemical forming step is performed to form a dielectric layer 12' on the surface of the aluminum anode 11' (as shown in FIG. 2). In this step, the substrate 10 and the aluminum anode 11' are subjected to a chemical conversion treatment, that is, anodization, so that an oxidized coating film (ie, an insulating aluminum oxide film) is formed on the surface of the aluminum anode 11'. To form a dielectric layer 12'. The above formation The reaction can control the thickness of the dielectric layer 12' according to different chemical formation voltages and chemical conversion liquids. In this embodiment, the dielectric layer 12' is formed by a chemical solution of ammonium adipate or phosphoric acid or a mixture of the two. .
步驟三:形成一導電層於該介電層12′上。請配合圖2,在本實施例中,導電層可由導電高分子,如聚3,4-乙烯基二氧噻吩(PEDOT)、聚吡咯(polypyrrole)、聚噻吩(polythiophen)及碳膠(或石墨)、銀膠等所構成;具體而言,聚3,4-乙烯基二氧噻吩(PEDOT)材料可形成電解質層13′,而配合碳膠層14′、銀膠層15′等則可形成所述之導電層,以作為電容器之陰極。Step 3: Form a conductive layer on the dielectric layer 12'. 2, in this embodiment, the conductive layer may be made of a conductive polymer such as poly 3,4-ethylenedioxythiophene (PEDOT), polypyrrole, polythiophen, and carbon (or graphite). And silver colloid, etc.; specifically, the poly 3,4-ethylenedioxythiophene (PEDOT) material can form the electrolyte layer 13', and the carbon glue layer 14', the silver glue layer 15', etc. can be formed. The conductive layer acts as a cathode for the capacitor.
接著,同於前述實施例,將該鋁質陽極11′與該導電層(即電解質層13′、碳膠層14′與銀膠層15′之組合)分別連接於陽極電極及陰極電極(圖未示),並利用樹脂等批覆材料覆蓋電容器,即可製作成薄片型固態電解電容器。Next, in the same manner as the foregoing embodiment, the aluminum anode 11' and the conductive layer (ie, the electrolyte layer 13', the combination of the carbon glue layer 14' and the silver paste layer 15') are respectively connected to the anode electrode and the cathode electrode (Fig. A sheet-type solid electrolytic capacitor can be produced by covering a capacitor with a coating material such as a resin.
因此,本發明可利用鋁粉取代鉭粉,故可大幅簡化電容器之製程,例如不需高溫燒結等步驟;再者,鋁粉可先經過前處理,使其具有高比表面積,進而提高所製成之電容器的特性。Therefore, the present invention can replace the tantalum powder with aluminum powder, so the process of the capacitor can be greatly simplified, for example, steps such as high-temperature sintering are not required; in addition, the aluminum powder can be pretreated to have a high specific surface area, thereby improving the preparation. The characteristics of the capacitor.
以上所述僅為本發明之較佳可行實施例,非因此侷限本發明之專利範圍,故舉凡運用本發明說明書及圖示內容所為之等效技術變化,均包含於本發明之範圍內。The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalents of the present invention are intended to be included within the scope of the present invention.
10‧‧‧基板10‧‧‧Substrate
11、11′‧‧‧鋁質陽極11, 11'‧‧‧Aluminum anode
111‧‧‧引出電極111‧‧‧Extraction electrode
12、12′‧‧‧介電層12, 12'‧‧‧ dielectric layer
13、13′‧‧‧電解質層13, 13'‧‧‧ electrolyte layer
14、14′‧‧‧碳膠層14, 14'‧‧‧carbon layer
15、15′‧‧‧銀膠層15, 15'‧‧‧ silver glue layer
16A‧‧‧陽極電極16A‧‧‧Anode electrode
16B‧‧‧陰極電極16B‧‧‧Cathode electrode
17‧‧‧封裝體17‧‧‧Package
圖1係顯示本發明第一實施例之固態電解電容器的示意 圖。1 is a schematic view showing a solid electrolytic capacitor of a first embodiment of the present invention; Figure.
圖2係顯示本發明第二實施例之固態電解電容器的示意圖。Fig. 2 is a schematic view showing a solid electrolytic capacitor of a second embodiment of the present invention.
11...鋁質陽極11. . . Aluminum anode
111...引出電極111. . . Lead electrode
12...介電層12. . . Dielectric layer
13...電解質層13. . . Electrolyte layer
14...碳膠層14. . . Carbon layer
15...銀膠層15. . . Silver layer
16A...陽極電極16A. . . Anode electrode
16B...陰極電極16B. . . Cathode electrode
17...封裝體17. . . Package
Claims (9)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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TW100125264A TWI431650B (en) | 2011-07-18 | 2011-07-18 | Manufacturing method of solid electrolytic capacitor and solid electrolytic capacitor thereof |
CN201110322918.4A CN102376456B (en) | 2011-07-18 | 2011-10-21 | Method for manufacturing solid electrolytic capacitor and solid electrolytic capacitor |
CN201120404353XU CN202363267U (en) | 2011-07-18 | 2011-10-21 | Solid electrolytic capacitor |
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TW100125264A TWI431650B (en) | 2011-07-18 | 2011-07-18 | Manufacturing method of solid electrolytic capacitor and solid electrolytic capacitor thereof |
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TWI431650B true TWI431650B (en) | 2014-03-21 |
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TWI456613B (en) * | 2012-11-05 | 2014-10-11 | Apaq Technology Co Ltd | Improved process for the production of solid-state electrolytic capacitor |
CN108172403A (en) * | 2017-12-19 | 2018-06-15 | 湖南艾华集团股份有限公司 | Novel powder aluminium positive electrode and aluminium electrolutic capacitor preparation method |
WO2019176723A1 (en) * | 2018-03-13 | 2019-09-19 | 株式会社村田製作所 | Solid electrolytic capacitor and method for manufacturing solid electrolytic capacitor |
CN113745005B (en) * | 2021-08-17 | 2022-12-30 | 深圳江浩电子有限公司 | Method for manufacturing cast anode capacitor cell |
CN115064387A (en) * | 2022-05-12 | 2022-09-16 | 湖南艾华集团股份有限公司 | Preparation method of anode foil based on sintered aluminum powder |
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JP4660222B2 (en) * | 2005-02-14 | 2011-03-30 | 三洋電機株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
CN101350253B (en) * | 2008-09-17 | 2011-03-23 | 中国振华(集团)新云电子元器件有限责任公司 | Solid electrolyte capacitor and manufacturing method thereof |
CN102074384B (en) * | 2009-11-19 | 2013-04-17 | 钰邦电子(无锡)有限公司 | Manufacture method for solid state capacitor unit used for increasing capacitance |
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CN202363267U (en) | 2012-08-01 |
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