TWI456613B - Improved process for the production of solid-state electrolytic capacitor - Google Patents

Improved process for the production of solid-state electrolytic capacitor Download PDF

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Publication number
TWI456613B
TWI456613B TW101140960A TW101140960A TWI456613B TW I456613 B TWI456613 B TW I456613B TW 101140960 A TW101140960 A TW 101140960A TW 101140960 A TW101140960 A TW 101140960A TW I456613 B TWI456613 B TW I456613B
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TW
Taiwan
Prior art keywords
layer
aluminum
solid electrolytic
conductive
electrolytic capacitor
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Application number
TW101140960A
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Chinese (zh)
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TW201419336A (en
Inventor
Ching Feng Lin
Ming Tsung Chen
Shu Yu Lin
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Apaq Technology Co Ltd
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Publication date
Application filed by Apaq Technology Co Ltd filed Critical Apaq Technology Co Ltd
Priority to TW101140960A priority Critical patent/TWI456613B/en
Priority to CN201310324387.1A priority patent/CN103456502B/en
Publication of TW201419336A publication Critical patent/TW201419336A/en
Application granted granted Critical
Publication of TWI456613B publication Critical patent/TWI456613B/en

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Claims (9)

一種固態電解電容器之改良製法,包括以下步驟:提供一絕緣基板;以局部網印方式於該絕緣基板上形成複數包含鋁粉末之導電膠體,其中相鄰的兩導電膠體間定義有一切割道;進行高溫燒結程序,將該些導電膠體金屬化以形成複數鋁質基片,其中,該高溫燒結程序之溫度範圍介於300℃至500℃之間且時間介於0.5小時至1.5小時之間;於每一鋁質基片之表面形成一介電層;於每一介電層上形成一隔絕層,以定義出一陽極區及一陰極區;以及於每一陰極區之介電層表面覆蓋一導電層,以製成固態電解電容單元。 An improved method for manufacturing a solid electrolytic capacitor, comprising the steps of: providing an insulating substrate; forming a plurality of conductive colloids containing aluminum powder on the insulating substrate by partial screen printing, wherein a scribe line is defined between two adjacent conductive colloids; a high temperature sintering process, the conductive colloids are metallized to form a plurality of aluminum substrates, wherein the high temperature sintering process has a temperature ranging from 300 ° C to 500 ° C and a time between 0.5 hours and 1.5 hours; Forming a dielectric layer on each surface of the aluminum substrate; forming an isolation layer on each dielectric layer to define an anode region and a cathode region; and covering a surface of the dielectric layer of each cathode region Conductive layer to make a solid electrolytic capacitor unit. 如申請專利範圍第1項所述之固態電解電容器之改良製法,其中該覆蓋導電層的步驟中,更包括以下之步驟:於每一陰極區之介電層表面成型一導電高分子層;於每一導電高分子層上成型一碳膠層;以及於每一碳膠層上成型一銀膠層。 The method for improving the solid electrolytic capacitor according to claim 1, wherein the step of covering the conductive layer further comprises the steps of: forming a conductive polymer layer on the surface of the dielectric layer of each cathode region; Forming a carbon glue layer on each conductive polymer layer; and forming a silver glue layer on each carbon glue layer. 如申請專利範圍第2項所述之固態電解電容器之改良製法,其中該碳膠層係由導電碳膠、碳糊或碳膏所製成。 The method for improving the solid electrolytic capacitor according to claim 2, wherein the carbon adhesive layer is made of a conductive carbon paste, a carbon paste or a carbon paste. 如申請專利範圍第1項所述之固態電解電容器之改良製法,其中該些包含鋁粉末之導電膠體包括:0至50重量百分比之熱固性樹脂;30至100重量百分比之鋁粉末;0至50重量百分比之固化劑;以及 0至50重量百分比之無機填充劑。 The method for improving the solid electrolytic capacitor according to claim 1, wherein the conductive colloid comprising aluminum powder comprises: 0 to 50% by weight of a thermosetting resin; 30 to 100% by weight of aluminum powder; and 0 to 50 by weight. a percentage of curing agent; 0 to 50% by weight of inorganic filler. 如申請專利範圍第4項所述之固態電解電容器之改良製法,其中該些鋁粉末之粒徑介於0.05至5微米之間。 An improved method for solid electrolytic capacitors according to claim 4, wherein the aluminum powders have a particle size of between 0.05 and 5 microns. 一種固態電解電容器之改良製法,包括以下步驟:提供鋁粉末;將一引出電極插設於該些鋁粉末中;以壓模對該些鋁粉末與該引出電極進行冷壓,其中冷壓之荷重介於3至15MN(Mega Newton)/m2 之間,以將該些鋁粉末壓合形成一鋁錠;於該鋁錠之表面包覆一介電層;以及於該介電層之表面包覆一導電層。An improved method for solid electrolytic capacitors, comprising the steps of: providing aluminum powder; inserting an extraction electrode into the aluminum powder; and cold pressing the aluminum powder and the extraction electrode by a compression mold, wherein the cold pressing load Between 3 and 15 MN (Mega Newton)/m2 The aluminum powder is pressed together to form an aluminum ingot; a surface of the aluminum ingot is coated with a dielectric layer; and a surface of the dielectric layer is coated with a conductive layer. 如申請專利範圍第6項所述之固態電解電容器之改良製法,其中該包覆導電層的步驟中,更包括以下之步驟:於該介電層之表面包覆一導電高分子層;於該導電高分子層之表面包覆一碳膠層;以及於該碳膠層之表面包覆一銀膠層。 The method for improving the solid electrolytic capacitor according to the sixth aspect of the invention, wherein the step of coating the conductive layer further comprises the steps of: coating a surface of the dielectric layer with a conductive polymer layer; The surface of the conductive polymer layer is coated with a carbon glue layer; and a surface of the carbon glue layer is coated with a silver paste layer. 如申請專利範圍第6項所述之固態電解電容器之改良製法,其中該些鋁粉末具有海綿狀之不平整表面。 The improved method of solid electrolytic capacitors according to claim 6, wherein the aluminum powders have a sponge-like uneven surface. 一種固態電解電容器之改良製法,包括以下步驟:提供一陽極箔及一陰極箔;以及進行捲繞程序,將一隔膜夾置於該陽極箔及該陰極箔之間,並與複數引出電極重疊捲繞成一筒狀芯子;其中該陽極箔係將鋁粉末噴塗於一基箔上,待乾燥後進行高溫燒結程序以形成一鋁多孔質高溫燒結體,之後於該鋁多孔質高溫燒結體之表面化成一氧化膜所製成。 An improved method for solid electrolytic capacitors, comprising the steps of: providing an anode foil and a cathode foil; and performing a winding process, placing a separator between the anode foil and the cathode foil, and overlapping the plurality of extraction electrodes The aluminum foil is sprayed on a base foil, and after being dried, a high-temperature sintering process is performed to form an aluminum porous high-temperature sintered body, and then the surface of the aluminum porous high-temperature sintered body is surfaced. Made of an oxide film.
TW101140960A 2012-11-05 2012-11-05 Improved process for the production of solid-state electrolytic capacitor TWI456613B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101140960A TWI456613B (en) 2012-11-05 2012-11-05 Improved process for the production of solid-state electrolytic capacitor
CN201310324387.1A CN103456502B (en) 2012-11-05 2013-07-30 Improved manufacturing method of solid electrolytic capacitor

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Application Number Priority Date Filing Date Title
TW101140960A TWI456613B (en) 2012-11-05 2012-11-05 Improved process for the production of solid-state electrolytic capacitor

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TW201419336A TW201419336A (en) 2014-05-16
TWI456613B true TWI456613B (en) 2014-10-11

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Publication number Priority date Publication date Assignee Title
CN107221440A (en) * 2017-06-15 2017-09-29 苏州圣咏电子科技有限公司 A kind of solid capacitor
TWI719517B (en) * 2019-06-27 2021-02-21 立昌先進科技股份有限公司 Package method for attached single small size and array type of chip semiconductor component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101152772A (en) * 2002-12-27 2008-04-02 Tdk株式会社 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
CN101595542A (en) * 2006-12-22 2009-12-02 松下电器产业株式会社 Electronic devices and components and manufacture method thereof
CN102117704A (en) * 2010-01-06 2011-07-06 钰邦电子(无锡)有限公司 Stack type solid electrolytic capacitor and manufacturing method thereof
TWI351046B (en) * 2006-10-25 2011-10-21

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Publication number Priority date Publication date Assignee Title
US5867363A (en) * 1992-09-18 1999-02-02 Pinnacle Research Institute, Inc. Energy storage device
JP4845645B2 (en) * 2006-08-30 2011-12-28 三洋電機株式会社 Solid electrolytic capacitor and manufacturing method thereof
WO2008094893A2 (en) * 2007-01-29 2008-08-07 Daramic Llc An ultracapacitor and method of manufacturing the same
TWI431650B (en) * 2011-07-18 2014-03-21 Apaq Technology Co Ltd Manufacturing method of solid electrolytic capacitor and solid electrolytic capacitor thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101152772A (en) * 2002-12-27 2008-04-02 Tdk株式会社 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
TWI351046B (en) * 2006-10-25 2011-10-21
CN101595542A (en) * 2006-12-22 2009-12-02 松下电器产业株式会社 Electronic devices and components and manufacture method thereof
CN102117704A (en) * 2010-01-06 2011-07-06 钰邦电子(无锡)有限公司 Stack type solid electrolytic capacitor and manufacturing method thereof

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TW201419336A (en) 2014-05-16
CN103456502B (en) 2016-04-20
CN103456502A (en) 2013-12-18

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