CN201888022U - 陶瓷粉填充led铝基电路板 - Google Patents

陶瓷粉填充led铝基电路板 Download PDF

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Publication number
CN201888022U
CN201888022U CN2010206507093U CN201020650709U CN201888022U CN 201888022 U CN201888022 U CN 201888022U CN 2010206507093 U CN2010206507093 U CN 2010206507093U CN 201020650709 U CN201020650709 U CN 201020650709U CN 201888022 U CN201888022 U CN 201888022U
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China
Prior art keywords
ceramic powder
circuit board
aluminum substrate
filled
led
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Expired - Fee Related
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CN2010206507093U
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English (en)
Inventor
金壬海
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Zhejiang Jiutong Electronic and Technology Ltd.
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金壬海
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Priority to CN2010206507093U priority Critical patent/CN201888022U/zh
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Publication of CN201888022U publication Critical patent/CN201888022U/zh
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Abstract

本实用新型公开了陶瓷粉填充LED铝基电路板，旨在提供一种结构简单、重量轻，散热性能好的陶瓷粉填充LED铝基电路板。它包括有铝质的基板，其特征是在铝质的基板表面涂有改性的陶瓷粉绝缘材料层，在改性的陶瓷粉绝缘材料层表面制有连接LED灯珠的电路。该实用新型具有很好的热传导性和散热，能够将电路上的热量经陶瓷粉绝缘材料释放并传递到铝质的基板释放，可有效地降低线路板和LED灯珠的温度，延长LED灯珠的使用寿命。

Description

陶瓷粉填充LED铝基电路板
技术领域
本实用新型涉及线路板的结构，尤其是涉及陶瓷粉填充LED铝基电路板。
背景技术
LED作为新型的光源具有省电、使用寿命长，已得到普遍推广和使用，在LED灯珠集中使用时，需要用线路板来连接，但由于普通的线路板散热性能差，由于线路板的温度过高，导致所连接的LED灯珠也一直在高温的环境中工作，使得LED灯珠的使用寿命也大为缩短。
实用新型内容
本实用新型的目的是提供一种结构简单、重量轻，散热性能好的陶瓷粉填充LED铝基电路板。
为了满足上述要求，本实用新型是通过以下技术方案实现的：它包括有铝质的基板，其特征是在铝质的基板表面涂有改性的陶瓷粉绝缘材料层，在改性的陶瓷粉绝缘材料层表面制有连接LED灯珠的电路。
改性的陶瓷粉绝缘材料是用陶瓷粉与环氧树脂混合制成，该种材料具有很好的热传导性和散热，能够将电路上的热量经陶瓷粉绝缘材料释放并传递到铝质的基板释放，可有效地降低线路板和LED灯珠的温度，延长LED灯珠的使用寿命。
附图说明
图1是陶瓷粉填充LED铝基电路板的剖面放大图。
其中：1、基板；2、陶瓷粉绝缘材料层；3、电路。
具体实施方式
下面结合附图及实施例对本实用新型作进一步的描述。
图1是陶瓷粉填充LED铝基电路板结构示意图。从图中看出，它包括有铝质的基板1，在铝质的基板1表面涂有改性的陶瓷粉绝缘材料层2，在改性的陶瓷粉绝缘材料层2表面制有连接LED灯珠的电路3。所述的改性的陶瓷粉绝缘材料是用陶瓷粉与环氧树脂混合制成的。

Claims (1)

1.陶瓷粉填充LED铝基电路板，它包括有铝质的基板，其特征是在铝质的基板表面涂有改性的陶瓷粉绝缘材料层，在改性的陶瓷粉绝缘材料层表面制有连接LED灯珠的电路。
CN2010206507093U 2010-11-30 2010-11-30 陶瓷粉填充led铝基电路板 Expired - Fee Related CN201888022U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206507093U CN201888022U (zh) 2010-11-30 2010-11-30 陶瓷粉填充led铝基电路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206507093U CN201888022U (zh) 2010-11-30 2010-11-30 陶瓷粉填充led铝基电路板

Publications (1)

Publication Number Publication Date
CN201888022U true CN201888022U (zh) 2011-06-29

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Family Applications (1)

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CN2010206507093U Expired - Fee Related CN201888022U (zh) 2010-11-30 2010-11-30 陶瓷粉填充led铝基电路板

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CN (1) CN201888022U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102355796A (zh) * 2011-10-14 2012-02-15 格瑞电子（厦门）有限公司 一种新型铝基板的制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102355796A (zh) * 2011-10-14 2012-02-15 格瑞电子（厦门）有限公司 一种新型铝基板的制造方法

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Zhejiang Jiutong Electronic and Technology Ltd.

Assignor: Jin Renhai

Contract record no.: 2011330001219

Denomination of utility model: LED circuit board adopting aluminum substrate and filled with ceramic powder

Granted publication date: 20110629

License type: Exclusive License

Record date: 20111026

ASS Succession or assignment of patent right

Owner name: ZHEJIANG JIUTONG ELECTRONIC AND TECHNOLOGY LTD.

Free format text: FORMER OWNER: JIN RENHAI

Effective date: 20120920

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120920

Address after: Dry kiln Town North Bridge No. 9 nine Zhejiang Electronics Technology Co. Ltd. 314107 Zhejiang County of Jiashan Province

Patentee after: Zhejiang Jiutong Electronic and Technology Ltd.

Address before: Dry kiln Town North Bridge No. 9 nine Zhejiang Electronics Technology Co. Ltd. 314107 Zhejiang County of Jiashan Province

Patentee before: Jin Renhai

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110629

Termination date: 20161130