CN201877144U - 一种绝缘包覆的叠层母线结构 - Google Patents
一种绝缘包覆的叠层母线结构 Download PDFInfo
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- CN201877144U CN201877144U CN2010205751254U CN201020575125U CN201877144U CN 201877144 U CN201877144 U CN 201877144U CN 2010205751254 U CN2010205751254 U CN 2010205751254U CN 201020575125 U CN201020575125 U CN 201020575125U CN 201877144 U CN201877144 U CN 201877144U
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CN2010205751254U CN201877144U (zh) | 2010-10-25 | 2010-10-25 | 一种绝缘包覆的叠层母线结构 |
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CN2010205751254U CN201877144U (zh) | 2010-10-25 | 2010-10-25 | 一种绝缘包覆的叠层母线结构 |
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CN201877144U true CN201877144U (zh) | 2011-06-22 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103138537A (zh) * | 2011-11-30 | 2013-06-05 | 永济新时速电机电器有限责任公司 | 用于整流模块的复合母排 |
CN103247984A (zh) * | 2013-05-31 | 2013-08-14 | 上海鹰峰电子科技有限公司 | 一种集成emi滤波功能的dc共模母排 |
CN103929113A (zh) * | 2013-10-10 | 2014-07-16 | 芜湖莫森泰克汽车科技有限公司 | 新能源汽车电机控制器用电容母线集成模块 |
-
2010
- 2010-10-25 CN CN2010205751254U patent/CN201877144U/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103138537A (zh) * | 2011-11-30 | 2013-06-05 | 永济新时速电机电器有限责任公司 | 用于整流模块的复合母排 |
CN103247984A (zh) * | 2013-05-31 | 2013-08-14 | 上海鹰峰电子科技有限公司 | 一种集成emi滤波功能的dc共模母排 |
CN103929113A (zh) * | 2013-10-10 | 2014-07-16 | 芜湖莫森泰克汽车科技有限公司 | 新能源汽车电机控制器用电容母线集成模块 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Insulating wrapped laminated bus structure Effective date of registration: 20120713 Granted publication date: 20110622 Pledgee: Bank of Communications Ltd Shanghai Songjiang branch Pledgor: Shanghai Eagtop Electronic Technology Co., Ltd. Registration number: 2012990000369 |
|
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201604 Shanghai Songjiang District Shihudang Industrial Park Tang Road, No. 158 Patentee after: Shanghai Eagle Peak Polytron Technologies Inc Address before: 201604 Shanghai Songjiang District Shihudang Industrial Park Tang Road, No. 158 Patentee before: Shanghai Eagtop Electronic Technology Co., Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20110622 |