CN201876524U - Adapting-type testing equipment for electronic part - Google Patents

Adapting-type testing equipment for electronic part Download PDF

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Publication number
CN201876524U
CN201876524U CN2010205874127U CN201020587412U CN201876524U CN 201876524 U CN201876524 U CN 201876524U CN 2010205874127 U CN2010205874127 U CN 2010205874127U CN 201020587412 U CN201020587412 U CN 201020587412U CN 201876524 U CN201876524 U CN 201876524U
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CN
China
Prior art keywords
motherboard
testing apparatus
test
electronic component
processor
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Expired - Fee Related
Application number
CN2010205874127U
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Chinese (zh)
Inventor
罗文贤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WEIHAN TECHNOLOGY CO LTD
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WEIHAN TECHNOLOGY CO LTD
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Priority to CN2010205874127U priority Critical patent/CN201876524U/en
Application granted granted Critical
Publication of CN201876524U publication Critical patent/CN201876524U/en
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Abstract

The utility model discloses an adapting-type testing equipment for an electronic part, comprising a box body component, a plurality of first mainboard components and a processing machine; the first mainboard components are arranged in the box body component; each first mainboard component comprises a mainboard, a first main socket, an adapting plate, a plurality of testing sockets and a central processing unit; the mainboard is vertically arranged in the box body component; the first main socket is arranged on the mainboard and is electrically connected with the mainboard; the adapting plate is electrically connected with the first main socket and is practically vertical to the mainboard; the testing socket is arranged on the adapting plate; the central processing unit is arranged on the mainboard and is electrically connected with the mainboard; a plurality of electronic parts can be inserted into the testing sockets along a plumb direction respectively by the processing machine so as to be tested, and can be pulled out after the test is completed. By adopting the adapting-type testing equipment, more testing productivity can be created under the limited space, and the testing cost can be reduced effectively.

Description

The switching formula testing apparatus of electronic component
Technical field
The utility model relates to a kind of testing apparatus, relates in particular to a kind of switching formula testing apparatus of electronic component.
Background technology
The method of testing of the integrated circuit of traditional memory module all is the testing apparatus by specialty, utilizes artificial mode to carry out test.For example, integrated circuit can be inserted on the special-purpose integrated circuit testing circuit board, utilize the testing circuit board test of starting shooting again, watch test result, according to test result the memory module of testing be classified again by artificial mode.
Though can come action that integrated circuit is plugged by robotic arm, the integrated circuit testing circuit board must level be put, to allow robotic arm integrated circuit can be inserted into slot on the integrated circuit testing circuit board.Yet the integrated circuit testing circuit board needs modules such as central processing unit, radiating module, display module, so accounted for sizable horizontal zone.If will test to numerous integrated circuit, then must utilize numerous integrated circuit testing circuit boards, and these integrated circuit testing circuit boards can only level be put, and have occupied sizable space like this, the miniaturization of unfavorable test site, thereby increased testing cost.
The utility model content
Therefore, a purpose of the present utility model provides a kind of switching formula testing apparatus of electronic component, and reaches the purpose of automatic test, saves the test space and reduces testing cost.
For reaching above-mentioned purpose, the utility model provides a kind of switching formula testing apparatus of electronic component, and it comprises a box assembly, a plurality of first motherboard assembly and a processor.The first motherboard assembly is arranged in the box assembly.Each first motherboard assembly comprises a motherboard, one first baseplug, a card extender, a plurality of test jack and a central processing unit.Motherboard erectly is arranged in the box assembly.First baseplug is arranged on the motherboard, and is electrically connected to motherboard.Card extender is electrically connected to first baseplug, and in fact perpendicular to motherboard.Test jack is arranged on the card extender.Central processing unit is arranged on the motherboard, and is electrically connected to motherboard.Processor is inserted into a plurality of electronic components in these test jacks testing along a vertical direction respectively, and after test finishes these electronic components is extracted.
By above-mentioned switching formula testing apparatus, can under limited space, create more tested productivity, and effectively reduce testing cost.
For foregoing of the present utility model can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Accompanying drawing described herein is used to provide further understanding of the present utility model, constitutes the application's a part, does not constitute qualification of the present utility model.In the accompanying drawings:
Fig. 1 shows the overall schematic according to the switching formula testing apparatus of the utility model first embodiment;
The partial schematic diagram of the switching formula testing apparatus of Fig. 2 displayed map 1;
The sectional perspective synoptic diagram of the switching formula testing apparatus of Fig. 3 displayed map 1;
Fig. 4 shows the cut-open view according to the location pressing mechanism of the utility model second embodiment;
Fig. 5 shows the partial schematic diagram according to the switching formula testing apparatus of the utility model second embodiment;
Fig. 6 and Fig. 7 show the partial schematic diagram according to the switching formula testing apparatus of the utility model second embodiment;
Fig. 8 shows the annexation according to processor of the present utility model, power supply unit and motherboard.
Drawing reference numeral:
DV: vertical direction
1: testing apparatus
10: box assembly
10 ': additional box assembly
12: base
14: loam cake
16: temperature control module
17: well heater
18: the space
20: the first motherboard assemblies
21: motherboard
22: the first baseplugs
23: the second baseplugs
24: card extender
26: test jack
28: central processing unit
29A: radiator fan
29B: display card
30: processor
31: pipe-hanging hook
32: robotic arm
40: power supply unit
50: test preceding working area
51: test preceding storage area
55: rough sort district, test back
56: disaggregated classification district, test back
60: the second motherboard assemblies
70: the location pressing mechanism
71: the first location structures
72: the second location structures
73: briquetting
74: pressing mechanism
75: the second pipe-hanging hooks
80: board
90: oil hydraulic cylinder
95: the oil hydraulic cylinder pipe-hanging hook
100: electronic component
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, the utility model embodiment is described in further details below in conjunction with accompanying drawing.At this, illustrative examples of the present utility model and explanation thereof are used to explain the utility model, but not as to qualification of the present utility model.
Fig. 1 shows the overall schematic according to the switching formula testing apparatus of the utility model first embodiment.The partial schematic diagram of the switching formula testing apparatus of Fig. 2 displayed map 1.The sectional perspective synoptic diagram of the switching formula testing apparatus of Fig. 3 displayed map 1.
As shown in Figure 1 to Figure 3, the switching formula testing apparatus 1 of the electronic component of present embodiment comprises a box assembly 10, a plurality of first motherboard assembly 20 and a processor (Handler) 30.Certainly, the switching formula testing apparatus 1 of electronic component also can more comprise a plurality of additional box assemblies 10 '.Additional box assembly 10 ' function class be similar to box assembly 10, can increase the production capacity of test like this.Below only do explanation with the internal structure of single box assembly 10.
The first motherboard assembly 20 is arranged in the box assembly 10.Each first motherboard assembly 20 comprises a motherboard 21, one first baseplug 22, a card extender 24, a test jack 26 and a central processing unit 28.Motherboard 21 for example is the motherboard from each label that can buy on the market, and it erectly is arranged in the box assembly 10.Thus, can buy the particular host plate according to client's needs and carry out the test of integrated circuit, also can use special motherboard to test certainly.First baseplug 22 is arranged on the motherboard 21, and is electrically connected to motherboard 21.Card extender 24 is electrically connected to first baseplug 22, and in fact perpendicular to motherboard 21.Test jack 26 is arranged on the card extender 24.Central processing unit 28 is arranged on the motherboard 21, and is electrically connected to motherboard 21.
Processor 30 is inserted into a plurality of electronic components 100 in these test jacks 26 testing along a vertical direction DV respectively, and after test finishes these electronic components 100 is extracted.Electronic component 100 for example be installed above the memory module (being the DIMM memory module for example) integrated circuit (IC).Processor 30 comprises a pipe-hanging hook 31 and a robotic arm 32, also can more comprise the correlation module that can carry out data processing and management and control sort program.Robotic arm 32 can move (X axis moves) along pipe-hanging hook 31, and pipe-hanging hook 31 also can be moved (Y-axis to move), and the robotic arm 32 of processor 30 can once grasp one or more electronic components 100 and carries out Z and move axially.The mode that robotic arm 32 can utilize such as adsorb is drawn integrated circuit.
In addition, aforementioned testing apparatus 1 can more comprise the preceding working area 50 of a test, the preceding storage area 51 of a test, rough sort district, a test back 55 and disaggregated classification district, a test back 56.Processor 30 is tested electronic component 100 and is inserted into the test jack 26 after take out in preceding working area 50 from these.Processor 30 moves to rough sort district, test back 55 according to these electronic components 100 that a plurality of test results (being normal or undesired for example) finish test respectively.These electronic components 100 can leave the preceding storage area 51 of test earlier in before test, and can be stored disaggregated classification district 56 after test after the test.
It should be noted that to provide another processor (not shown) so that these electronic components 100 are moved to the preceding working area 50 of test from testing preceding storage area 51, or moves to disaggregated classification district, test back 56 from testing rough sort district, back 55.Certainly, also can carry out aforementioned activities by processor 30.
In addition, each first motherboard assembly 20 can more comprise one second baseplug 23, a radiator fan 29A and a display card 29B.Second baseplug 23 is arranged on the motherboard 21, and is electrically connected to motherboard 21.Certainly, can utilize another card extender to be connected to second baseplug 23, to carry out the test of more electronic component 100.Radiator fan 29A is arranged on the central processing unit 28.Display card 29B is arranged on the motherboard 21.The user can be connected to the display screen (not shown) display card 29B to allow the tester observe test status and result.Yet display card 29B is not to be necessary element, because the data of all test processs can and be handled by processor 30 monitoring.
Fig. 4 shows the cut-open view according to the location pressing mechanism of the utility model second embodiment.As shown in Figure 4, the testing apparatus of present embodiment is similar to first embodiment, and difference is that testing apparatus more comprises a location pressing mechanism 70, is arranged on the card extender 24, comes localized electron part 100 and electronic component 100 is pressed into to test jack 26.Location pressing mechanism 70 can be different from processor 30, can also combine with processor 30.Location pressing mechanism 70 comprises one first location structure 71, one second location structure 72, a briquetting 73, a pressing mechanism 74 and one second pipe-hanging hook 75.First location structure 71 is arranged in the test jack 26 with aiming at.Second location structure 72 is arranged on first location structure 71, in order to localized electron part 100 with aiming at.Briquetting 73 is pressed into electronic component 100 to test jack 26.Pressing mechanism 74 is a spring for example, in order to force in briquetting 73.Pressing mechanism 74 is installed on second pipe-hanging hook 75 movably.
Fig. 5 shows the partial schematic diagram according to the switching formula testing apparatus of the utility model second embodiment.As shown in Figure 5, present embodiment is similar to first embodiment, and difference is box assembly 10 and additional box assembly 10 ' be provided with in the board 80, and box assembly 10 and these additional box assemblies 10 ' can be drawn out of board 80 so that keep in repair.
Fig. 6 and Fig. 7 show the partial schematic diagram according to the switching formula testing apparatus of the utility model second embodiment.As Fig. 6 and shown in Figure 7, the box assembly 10 of the testing apparatus of present embodiment comprises a base 12, a loam cake 14 and a temperature control module 16.These first motherboard assemblies 20 are fixed in the base 12.Loam cake 14 can be moved with covering base 12 and these first motherboard assemblies 20.Temperature control module 16 is arranged in loam cake 14 and the base 12 formed spaces 18, controls the temperature in space 18.In an example, temperature control module 16 comprises a well heater 17.In another example, temperature control module can the air inclusion generator, in order to provide gas to the space 18 with the control temperature.After processor 30 had been planted electronic component 100, processor 30 was removed, then the oil hydraulic cylinder 90 on the oil hydraulic cylinder pipe-hanging hook 95 with loam cake 14 down push away with base 12 closures, and then can carry out the test of some specified temp according to client's needs.
Fig. 8 shows the annexation according to processor of the present utility model, power supply unit and motherboard.As shown in Figure 8, testing apparatus of the present utility model can more comprise a power supply unit 40, be electrically connected to processor 30, processor 30 is electrically connected to motherboard 21, processor 30 is being inserted into electronic component 100 in the test jack 26 back turn-on power supply 40 and motherboard 21 testing, and finishes back deenergization supply 40 and motherboard 21 to remove motherboard 21 in test.Therefore, all test processs can be carried out or be monitored by processor 30, and tester's demand number can significantly reduce.
Below describe testing process in detail.At first, processor 30 is inserted into the test jack 26 from testing preceding working area 50 extracting electronic components 100, then with motherboard 21 energisings (start), whether the signal that reads motherboard 21 is normal, if note abnormalities, then to motherboard 21 outages (shutdown), the electronic component 100 that more renews is tested.If the signal of motherboard 21 is normal, then repeat said procedure, to continue that other motherboards 21 in the box assembly 10 are inserted electronic component 100.The time of mainboard starting test is very long usually, is 1500 seconds to 3000 seconds or longer for example.So processor 30 can continue to utilize other additional box assemblies 10 ' motherboard 21 carry out the test of other electronic components 100, be the repetition above-mentioned steps equally.By the time behind all box assemblies 10 ' all stuck with electronic component 100, judge whether the test duration arrives, then continue if not to wait for, if then read the signal of each motherboard 21, whether normal with the test result of judging electronic component 100, and according to test result electronic component 100 is extracted and to be delivered to rough sort district, test back 55.In addition, can electronic component 100 be carried to disaggregated classification district, test back 56 from testing rough sort district, back 55 by another processor.
By above-mentioned switching formula testing apparatus, because the effect of card extender 24, make processor 30 electronic component 100 can be inserted in the test jack 26 along vertical direction, and the horizontal-extending of card extender 24 is small-sized, so the spacing between the vertical type motherboard 21 can effectively be dwindled.Therefore, can under limited space, create more tested productivity, and effectively reduce testing cost.
The specific embodiment that is proposed in the detailed description of preferred embodiment is only in order to convenient explanation technology contents of the present utility model, but not with the utility model narrow sense be limited to the foregoing description, in the situation that does not exceed spirit of the present utility model and claim scope, the many variations of being done is implemented, and all belongs to scope of the present utility model.

Claims (11)

1. the switching formula testing apparatus of an electronic component is characterized in that, described switching formula testing apparatus comprises:
One box assembly;
A plurality of first motherboard assemblies are arranged in the described box assembly, and each described first motherboard assembly comprises:
One motherboard erectly is arranged in the described box assembly;
One first baseplug is arranged on the described motherboard, and is electrically connected to described motherboard;
One card extender is electrically connected to described first baseplug, and perpendicular to described motherboard;
A plurality of test jacks are arranged on the described card extender; And
One central processing unit is arranged on the described motherboard, and is electrically connected to described motherboard; And
One processor is inserted into a plurality of electronic components in described a plurality of test jack testing along a vertical direction respectively, and after test finishes described a plurality of electronic components is extracted.
2. testing apparatus as claimed in claim 1 is characterized in that, described switching formula testing apparatus more comprises:
One power supply unit, be electrically connected to described processor, described processor is electrically connected to described motherboard, described processor is being inserted into described electronic component in the described test jack back described power supply unit of conducting and described motherboard testing, and disconnects described power supply unit and described motherboard to remove described motherboard in the test back that finishes.
3. testing apparatus as claimed in claim 1 is characterized in that, described switching formula testing apparatus more comprises:
Rough sort district, one test back, described a plurality of electronic components that described processor finishes test respectively according to a plurality of test results move to rough sort district, described test back.
4. testing apparatus as claimed in claim 1 is characterized in that, described switching formula testing apparatus more comprises:
The preceding working area of one test, described processor is inserted into described electronic component the described test jack after take out in the preceding working area of described test.
5. testing apparatus as claimed in claim 1 is characterized in that, described box assembly comprises:
One base, described a plurality of first motherboard assemblies are fixed in the described base;
One loam cake, it can be moved to cover described base and described a plurality of first motherboard assembly; And
One temperature control module is arranged in the formed space of described loam cake and described base, controls the temperature in described space.
6. testing apparatus as claimed in claim 5 is characterized in that described temperature control module comprises a well heater.
7. testing apparatus as claimed in claim 1 is characterized in that described processor once grasps a plurality of of described electronic component.
8. testing apparatus as claimed in claim 1 is characterized in that, each described first motherboard assembly more comprises:
One radiator fan is arranged on the described central processing unit; And
One display card is arranged on the described motherboard.
9. testing apparatus as claimed in claim 1, it is characterized in that, described switching formula testing apparatus more comprises a plurality of additional box assemblies, described box assembly and described a plurality of additional box assembly are provided with in the board, and described box assembly and described a plurality of additional box assembly can be drawn out of described board so that keep in repair.
10. testing apparatus as claimed in claim 1 is characterized in that, described switching formula testing apparatus more comprises:
One location pressing mechanism is provided with on the described card extender, locatees described electronic component and described electronic component is pressed into to described test jack.
11. testing apparatus as claimed in claim 10 is characterized in that, described location pressing mechanism comprises:
One first location structure is arranged in the described test jack with aiming at;
One second location structure is arranged on described first location structure with aiming at, locatees described electronic component;
One briquetting is pressed into described electronic component to described test jack;
One pressing mechanism forces in described briquetting; And
One second pipe-hanging hook, described pressing mechanism are installed on described second pipe-hanging hook movably.
CN2010205874127U 2010-11-01 2010-11-01 Adapting-type testing equipment for electronic part Expired - Fee Related CN201876524U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010205874127U CN201876524U (en) 2010-11-01 2010-11-01 Adapting-type testing equipment for electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010205874127U CN201876524U (en) 2010-11-01 2010-11-01 Adapting-type testing equipment for electronic part

Publications (1)

Publication Number Publication Date
CN201876524U true CN201876524U (en) 2011-06-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010205874127U Expired - Fee Related CN201876524U (en) 2010-11-01 2010-11-01 Adapting-type testing equipment for electronic part

Country Status (1)

Country Link
CN (1) CN201876524U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102455406A (en) * 2010-11-01 2012-05-16 维瀚科技有限公司 Switching test device for electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102455406A (en) * 2010-11-01 2012-05-16 维瀚科技有限公司 Switching test device for electronic component
CN102455406B (en) * 2010-11-01 2014-11-05 维瀚科技有限公司 Switching test device for electronic component

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110622

Termination date: 20141101

EXPY Termination of patent right or utility model