CN201829197U - Upright type test equipment for electronic assemblies - Google Patents
Upright type test equipment for electronic assemblies Download PDFInfo
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- CN201829197U CN201829197U CN201020582680XU CN201020582680U CN201829197U CN 201829197 U CN201829197 U CN 201829197U CN 201020582680X U CN201020582680X U CN 201020582680XU CN 201020582680 U CN201020582680 U CN 201020582680U CN 201829197 U CN201829197 U CN 201829197U
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- motherboard
- testing apparatus
- test
- assembly
- electrically connected
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- Tests Of Electronic Circuits (AREA)
Abstract
The utility model discloses upright type test equipment for electronic assemblies, comprising a box assembly, a plurality of first main board assemblies and a processor. The first main board assemblies are arranged in the box assembly. Each first main board assembly comprises a main board, a first main socket, an adaptor board, a first assistant socket and a central processing unit, wherein the main board is vertically arranged in the box assembly; the first main socket is arranged on the main board and electrically connected to the main board; the adaptor board is electrically connected to the first main socket and substantially vertical to the main board; the first assistant socket is arranged on the adaptor board; and the central processing unit is arranged on the main board and electrically connected to the main board. Through the processor, a plurality of electronic assemblies are respectively inserted into the first assistant sockets along a vertical direction to be tested, and then pulled out after the test is finished.
Description
Technical field
The utility model relates to a kind of testing apparatus, relates in particular to a kind of vertical type testing apparatus of electronic package.
Background technology
The method of testing of traditional memory module all is the testing apparatus by specialty, utilizes artificial mode to carry out test.For example, memory module can be inserted on the motherboard, motherboard is connected to display card, display card is connected to screen, memory module is inserted in the memory bank of motherboard, to the motherboard test of starting shooting, watch test result again, according to test result the memory module of testing is classified again by artificial mode.
Though can come action that memory module is plugged by robotic arm, motherboard must level be put, to allow robotic arm memory module can be inserted into memory bank on the motherboard.Yet motherboard has accounted for sizable horizontal zone.If will test to numerous memory modules, then must utilize numerous motherboards, and these motherboards can only level be put, and have occupied sizable space like this, the miniaturization of unfavorable test site, thereby increased testing cost.
The utility model content
Therefore, a purpose of the present utility model provides a kind of vertical type testing apparatus of electronic package, and reach automatic test purpose, save the test space and reduce testing cost.
For reaching above-mentioned purpose, the utility model provides a kind of vertical type testing apparatus of electronic package, and it comprises a box assembly, a plurality of first motherboard assembly and a processor.The first motherboard assembly is arranged in the box assembly.Each first motherboard assembly comprises a motherboard, one first baseplug, a card extender, one first secondary socket and a central processing unit.Motherboard erectly is arranged in the box assembly.First baseplug is arranged on the motherboard, and is electrically connected to motherboard.Card extender is electrically connected to first baseplug, and in fact perpendicular to motherboard.The first secondary socket is arranged on the card extender.Central processing unit is arranged on the motherboard, and is electrically connected to motherboard.Processor is inserted into a plurality of electronic packages in these first secondary sockets testing along a vertical direction respectively, and after test finishes these electronic packages is extracted.
By above-mentioned vertical type testing apparatus, can under limited space, create more tested productivity, and effectively reduce testing cost.
For foregoing of the present utility model can be become apparent, a preferred embodiment cited below particularly, and cooperation institute accompanying drawing are described in detail below.
Description of drawings
Fig. 1 shows the overall schematic according to the vertical type testing apparatus of the utility model first embodiment;
The partial schematic diagram of the vertical type testing apparatus of Fig. 2 displayed map 1;
Fig. 3 show the sectional perspective synoptic diagram of vertical type testing apparatus;
Fig. 4 shows the partial schematic diagram according to the vertical type testing apparatus of the utility model second embodiment;
Fig. 5 shows the partial schematic diagram according to the vertical type testing apparatus of the utility model the 3rd embodiment;
Fig. 6 and 7 partial schematic diagrams that show according to the vertical type testing apparatus of the utility model the 3rd embodiment;
Fig. 8 shows the annexation according to processor of the present utility model, power supply unit and motherboard;
Fig. 9 shows the synoptic diagram according to the first motherboard assembly of the utility model the 4th embodiment.
The main element symbol description:
DV: vertical direction
1: testing apparatus
10: box assembly
10 ': additional box assembly
12: base
14: loam cake
16: temperature control module
17: well heater
18: the space
20,20 ': the first motherboard assembly
21: motherboard
22: the first baseplugs
23: the second baseplugs
24: card extender
24A: second card extender
25: connecting line
26: the first secondary sockets
27: the second secondary sockets
28: central processing unit
29A: radiator fan
29B: display card
30: processor
31: pipe-hanging hook
32: robotic arm
40: power supply unit
50: test preceding working area
51: test preceding storage area
55: rough sort district, test back
56: disaggregated classification district, test back
60: the second motherboard assemblies
80: board
90: oil hydraulic cylinder
95: the oil hydraulic cylinder pipe-hanging hook
100: electronic package
200: integrated circuit
Embodiment
Fig. 1 shows the overall schematic according to the vertical type testing apparatus of the utility model first embodiment.The partial schematic diagram of the vertical type testing apparatus of Fig. 2 displayed map 1.The sectional perspective synoptic diagram of the vertical type testing apparatus that Fig. 3 shows.
As shown in Figures 1 to 3, the vertical type testing apparatus 1 of the electronic package of present embodiment comprises a box assembly 10, a plurality of first motherboard assembly 20 and a processor (Handler) 30.Certainly, the vertical type testing apparatus 1 of electronic package also can more comprise a plurality of additional box assemblies 10 '.Additional box assembly 10 ' function class be similar to box assembly 10, can increase the production capacity of test like this.Below only do explanation with the internal structure of single box assembly 10.
The first motherboard assembly 20 is arranged in the box assembly 10.Each first motherboard assembly 20 comprises a motherboard 21, one first baseplug 22, a card extender 24, one first secondary socket 26 and a central processing unit 28.Motherboard 21 for example is the motherboard from each label that can buy on the market, and it erectly is arranged in the box assembly 10.Thus, can buy the particular host plate according to client's needs and carry out the test of memory module, also can use special motherboard to test certainly.First baseplug 22 is arranged on the motherboard 21, and is electrically connected to motherboard 21.Card extender 24 is electrically connected to first baseplug 22, and in fact perpendicular to motherboard 21.The first secondary socket 26 is arranged on the card extender 24.Central processing unit 28 is arranged on the motherboard 21, and is electrically connected to motherboard 21.
In addition, aforementioned testing apparatus 1 can more comprise the preceding working area 50 of a test, the preceding storage area 51 of a test, rough sort district, a test back 55 and disaggregated classification district, a test back 56.Processor 30 is tested electronic package 100 and is inserted into the first secondary socket 26 after take out in preceding working area 50 from these.Processor 30 moves to rough sort district, test back 55 according to these electronic packages 100 that a plurality of test results (being normal or undesired for example) finish test respectively.These electronic packages 100 can leave the preceding storage area 51 of test earlier in before test, and can be stored disaggregated classification district 56 after test after the test.
It should be noted that to provide another processor (not shown) so that these electronic packages 100 are moved to the preceding working area 50 of test from testing preceding storage area 51, or moves to disaggregated classification district, test back 56 from testing rough sort district, back 55.Certainly, also can carry out aforementioned activities by processor 30.
In addition, each first motherboard assembly 20 can more comprise one second baseplug, 23, one second secondary socket 27, a connecting line 25, a radiator fan 29A and a display card 29B.Second baseplug 23 is arranged on the motherboard 21, and is electrically connected to motherboard 21.The second secondary socket 27 is arranged on the card extender 24, is used for receiving one of them electronic package 100 of insertion for test usefulness.Connecting line 25 is electrically connected second secondary socket 27 and the card extender 24.Radiator fan 29A is arranged on the central processing unit 28.Display card 29B is arranged on the motherboard 21.The user can be connected to the display screen (not shown) display card 29B to allow the tester observe test status and result.Yet display card 29B is not to be necessary element, because the data of all test processs can and be handled by processor 30 monitoring.
Fig. 4 shows the partial schematic diagram according to the vertical type testing apparatus of the utility model second embodiment.As shown in Figure 4, the testing apparatus of present embodiment is similar to first embodiment, difference is that testing apparatus more comprises a plurality of second motherboard assemblies 60, it is arranged in the box assembly 10, and stack in the top of these first motherboard assemblies 20, the structure of these second motherboard assemblies 60 and function are same as the structure and the function of these first motherboard assemblies 20.In this embodiment, processor 30 can be passed through between these second motherboard assemblies 60 and these the first motherboard assemblies 20, and these electronic packages 100 are inserted into downwards respectively in these first motherboard assemblies 20 and upwards are inserted in these second motherboard assemblies 60, as long as robotic arm 32 can be around pipe-hanging hook 31 upsets.It should be noted that processor 30 is inserted into the vertical direction DV to test in the first secondary socket 26 with electronic package 100 for the box assembly 10 that is positioned at the top, be with the suffered gravity direction of electronic package 100 in the same way; And for the box assembly 10 that is positioned at the below, processor 30 is inserted into the vertical direction DV to test in the first secondary socket 26 with electronic package 100, is reverse with the suffered gravity direction of electronic package 100.The box assembly 10 of top can individualism or existence with the box assembly 10 of below.
Fig. 5 shows the partial schematic diagram according to the vertical type testing apparatus of the utility model the 3rd embodiment.As shown in Figure 5, present embodiment is similar to first embodiment, and difference is box assembly 10 and additional box assembly 10 ' be provided with in the board 80, and box assembly 10 and these additional box assemblies 10 ' can be drawn out of board 80 so that keep in repair.
Fig. 6 and 7 partial schematic diagrams that show according to the vertical type testing apparatus of the utility model the 3rd embodiment.Shown in Fig. 6 and 7, the box assembly 10 of the testing apparatus of present embodiment comprises a base 12, a loam cake 14 and a temperature control module 16.These first motherboard assemblies 20 are fixed in the base 12.Loam cake 14 can be moved with covering base 12 and these first motherboard assemblies 20.Temperature control module 16 is arranged in loam cake 14 and the base 12 formed spaces 18, is used for controlling the temperature in space 18.In an example, temperature control module 16 comprises a well heater 17.In another example, temperature control module can the air inclusion generator, be used to provide gas to the space 18 with the control temperature.After processor 30 had been planted electronic package 100, processor 30 was removed, then the oil hydraulic cylinder 90 on the oil hydraulic cylinder pipe-hanging hook 95 with loam cake 14 down push away with base 12 closures, and then can carry out the test of some specified temp according to client's needs.
Fig. 8 shows the annexation according to processor of the present utility model, power supply unit and motherboard.As shown in Figure 8, testing apparatus of the present utility model can more comprise a power supply unit 40, be electrically connected to processor 30, processor 30 is electrically connected to motherboard 21, processor 30 back turn-on power supply 40 and motherboard 21 in electronic package 100 being inserted into the first secondary socket 26 and finish back deenergization supply 40 and motherboard 21 to remove motherboard 21 in test testing.Therefore, all test processs can be carried out or be monitored by processor 30, and tester's demand number can significantly reduce.
Below describe testing process in detail.At first, processor 30 is inserted into the first secondary socket 26 and/or the second secondary socket 27 from testing preceding working area 50 extracting electronic packages 100, then with motherboard 21 energisings (start), whether the signal that reads motherboard 21 is normal, if note abnormalities, then to motherboard 21 outages (shutdown), the electronic package 100 that more renews is tested.If the signal of motherboard 21 is normal, then repeat said procedure, to continue that other motherboards 21 in the box assembly 10 are inserted electronic package 100.The time of mainboard starting test is very long usually, is 1500 seconds to 3000 seconds or longer for example.So processor 30 can continue to utilize other additional box assemblies 10 ' motherboard 21 carry out the test of other electronic packages 100, be the repetition above-mentioned steps equally.By the time behind all box assemblies 10 ' all stuck with electronic package 100, judge whether the test duration arrives, then continue if not to wait for, if then read the signal of each motherboard 21, whether normal with the test result of judging electronic package 100, and according to test result electronic package 100 is extracted and to be delivered to rough sort district, test back 55.In addition, can electronic package 100 be carried to disaggregated classification district, test back 56 from testing rough sort district, back 55 by another processor.
Fig. 9 shows the synoptic diagram according to the first motherboard assembly of the utility model the 4th embodiment.As shown in Figure 9, the first motherboard assembly 20 of present embodiment ' be similar to, first embodiment, difference is the first motherboard assembly 20 ' more comprise one second baseplug 23, one second card extender 24A and one second secondary socket 27.Second baseplug 23 is arranged on the motherboard 21, and is electrically connected to motherboard 21.The second card extender 24A is electrically connected to second baseplug 23, and in fact perpendicular to motherboard 21.The second secondary socket 27 is arranged on the second card extender 24A, is used for receiving one of them electronic package 100 of insertion for test usefulness.The second secondary socket 27 and the first secondary socket 26 are positioned on the same surface level.So can make the location of processor 30 convenient.The second card extender 24A can have lifting structures as shown in the figure, just constituted by one first horizontal-extending plate 24A1, one second horizontal-extending plate 24A3 and a vertical extension board 24A2, vertical extension board 24A2 connects the first horizontal-extending plate 24A1 and the second horizontal-extending plate 24A3, and the second secondary socket 27 is arranged at the second horizontal-extending plate 24A3.It should be noted that the first horizontal-extending plate 24A1, the second horizontal-extending plate 24A3 and vertical extension board 24A2 can separately form or integrally formed.In addition, this first motherboard assembly 20 ' can be applicable to is used for test among all above-mentioned embodiment.
By above-mentioned vertical type testing apparatus, because the effect of card extender 24, make processor 30 electronic package 100 can be inserted in the first secondary socket 26/ second secondary socket 27 along vertical direction, and the horizontal-extending of card extender 24 is small-sized, so the spacing between the vertical type motherboard 21 can effectively be dwindled.Therefore, can under limited space, create more tested productivity, and effectively reduce testing cost.
The only convenient explanation of the specific embodiment that in the detailed description of preferred embodiment, is proposed technology contents of the present utility model; but not with the utility model narrow sense be limited to the foregoing description; in the situation that does not exceed the utility model claim scope; the many variations of being done is implemented, and all belongs to protection domain of the present utility model.
Claims (14)
1. the vertical type testing apparatus of an electronic package is characterized in that, described equipment comprises:
One box assembly;
A plurality of first motherboard assemblies are arranged in the described box assembly, and each described first motherboard assembly comprises:
One motherboard erectly is arranged in the described box assembly;
One first baseplug is arranged on the described motherboard, and is electrically connected to described motherboard;
One card extender is electrically connected to described first baseplug, and perpendicular to described motherboard; One first secondary socket is arranged on the described card extender; And
One central processing unit is arranged on the described motherboard, and is electrically connected to described motherboard; And
One processor is used for a plurality of electronic packages are inserted in the described a plurality of first secondary socket testing along a vertical direction respectively, and after test finishes described a plurality of electronic packages is extracted.
2. testing apparatus as claimed in claim 1 is characterized in that, described testing apparatus more comprises:
One power supply unit, be electrically connected to described processor, described processor is electrically connected to described motherboard, described processor is being inserted into described electronic package in the described first secondary socket back described power supply unit of conducting and described motherboard testing, and disconnects described power supply unit and described motherboard to remove described motherboard in the test back that finishes.
3. testing apparatus as claimed in claim 1 is characterized in that, described testing apparatus more comprises:
Rough sort district, one test back, described a plurality of electronic packages that described processor finishes test respectively according to a plurality of test results move to rough sort district, described test back.
4. testing apparatus as claimed in claim 1 is characterized in that, described testing apparatus more comprises:
The preceding working area of one test, described processor is inserted into described electronic package the described first secondary socket after take out in the preceding working area of described test.
5. testing apparatus as claimed in claim 1 is characterized in that, described each described first motherboard assembly more comprises:
One second baseplug is arranged on the described motherboard, and is electrically connected to described motherboard;
One second secondary socket is arranged on the described card extender, is used for receiving one of them electronic package of insertion for test usefulness; And
One connecting line is electrically connected the described second secondary socket and described card extender.
6. testing apparatus as claimed in claim 1 is characterized in that, described testing apparatus more comprises:
A plurality of second motherboard assemblies, be arranged in the described box assembly, and stack in the top of described a plurality of first motherboard assemblies, the structure of described a plurality of second motherboard assemblies and function are same as the structure and the function of described a plurality of first motherboard assemblies, described processor can be passed through between described a plurality of second motherboard assembly and the described a plurality of first motherboard assembly, and described a plurality of electronic packages are inserted into downwards respectively in described a plurality of first motherboard assembly and upwards are inserted in described a plurality of second motherboard assembly.
7. testing apparatus as claimed in claim 1 is characterized in that, described box assembly comprises:
One base, described a plurality of first motherboard assemblies are fixed in the described base;
One loam cake, it can be moved to cover described base and described a plurality of first motherboard assembly; And
One temperature control module is arranged in the formed space of described loam cake and described base, is used for controlling the temperature in described space.
8. testing apparatus as claimed in claim 7 is characterized in that described temperature control module comprises a well heater.
9. testing apparatus as claimed in claim 1 is characterized in that described processor once grasps a plurality of of described electronic package.
10. testing apparatus as claimed in claim 1 is characterized in that, the described first motherboard assembly more comprises:
One radiator fan is arranged on the described central processing unit; And
One display card is arranged on the described motherboard.
11. testing apparatus as claimed in claim 1, it is characterized in that, described testing apparatus more comprises a plurality of additional box assemblies, described box assembly and described a plurality of additional box assembly are provided with in the board, and described box assembly and described a plurality of additional box assembly can be drawn out of described board so that keep in repair.
12. testing apparatus as claimed in claim 1 is characterized in that, the suffered gravity direction of described vertical direction and described electronic package in the same way.
13. testing apparatus as claimed in claim 1 is characterized in that, the suffered gravity direction of described vertical direction and described electronic package is reverse.
14. testing apparatus as claimed in claim 1 is characterized in that, the described first motherboard assembly more comprises:
One second baseplug is arranged on the described motherboard, and is electrically connected to described motherboard;
One second card extender is electrically connected to described second baseplug, and perpendicular to described motherboard; And
One second secondary socket is arranged on described second card extender, and one of them electronic package that is used for receiving insertion is for test usefulness, and the wherein said second secondary socket and the described first secondary socket are positioned on the same surface level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020582680XU CN201829197U (en) | 2010-10-28 | 2010-10-28 | Upright type test equipment for electronic assemblies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020582680XU CN201829197U (en) | 2010-10-28 | 2010-10-28 | Upright type test equipment for electronic assemblies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201829197U true CN201829197U (en) | 2011-05-11 |
Family
ID=43967718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020582680XU Expired - Fee Related CN201829197U (en) | 2010-10-28 | 2010-10-28 | Upright type test equipment for electronic assemblies |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201829197U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456416A (en) * | 2010-10-28 | 2012-05-16 | 维瀚科技有限公司 | Vertical test equipment for electronic assemblies |
| CN103219048A (en) * | 2012-01-19 | 2013-07-24 | 宇瞻科技股份有限公司 | Memory module testing device |
-
2010
- 2010-10-28 CN CN201020582680XU patent/CN201829197U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456416A (en) * | 2010-10-28 | 2012-05-16 | 维瀚科技有限公司 | Vertical test equipment for electronic assemblies |
| CN102456416B (en) * | 2010-10-28 | 2014-10-08 | 维瀚科技有限公司 | Vertical test equipment for electronic assemblies |
| CN103219048A (en) * | 2012-01-19 | 2013-07-24 | 宇瞻科技股份有限公司 | Memory module testing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20141028 |
|
| EXPY | Termination of patent right or utility model |