CN201852665U - Gas pressure sensor - Google Patents
Gas pressure sensor Download PDFInfo
- Publication number
- CN201852665U CN201852665U CN2010205464673U CN201020546467U CN201852665U CN 201852665 U CN201852665 U CN 201852665U CN 2010205464673 U CN2010205464673 U CN 2010205464673U CN 201020546467 U CN201020546467 U CN 201020546467U CN 201852665 U CN201852665 U CN 201852665U
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- base
- silica gel
- lead
- chip
- pressure
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Abstract
The utility model relates to a gas pressure sensor which comprises a protective cover plate, silica gel, a lead, a pressure chip, an outer shell and a base, and is characterized in that the pressure chip is adhered on the base; a terminal on the base is bonded with the pressure chip through the lead; protective silica gel is coated on the pressure chip and the lead; the upper end of the outer shell is provided with the protective cover plate; and the protective cover plate is provided with an intake test hole. The gas pressure sensor has the advantages of simple structure and simple packaging process, low cost, high reliability and long service life, and is applicable to the measurement of most non-corrosive gases and dry air medium pressure.
Description
Technical field
The utility model relates to a kind of pressure test element, particularly a kind of gas pressure sensor.
Background technology
Gas pressure sensor is in pneumatic control, pressure switch and controller, and portable pressure gage and pressure gauge, MAP fields such as (manifold absolute pressure sensor) has a wide range of applications.These fields are except very high to sensitivity, stability and the life requirement of sensor, and the special requirement packaging technology is simple, with low cost, economic and practical.And the pressure transducer of other packaged type such as the oil-filled encapsulation of isolation diaphragm, need stuffing pressure transmission medium (as silicone oil) and soldering stainless steel convoluted diaphragm to isolate testing medium and sensor chip, and oil-filled process complexity is difficult to control, the heat that produces during the soldering stainless steel convoluted diaphragm can exert an influence to the characteristic of chip itself, can make chip failure when serious.Thereby, for the sensor of above-mentioned packaged type, there are certain deficiency and defective.
Summary of the invention
The purpose of this utility model is at the defective that exists in the prior art, and a kind of gas pressure sensor is provided.The utility model is applicable to the sensor of measuring the non-corrosiveness gaseous tension; by silica gel isolated pressure chip and testing medium, transmission pressure and protect cell pressure chip and bonding wire; increase influence and destruction that protecting cover plate protection silica gel is not subjected to foreign matter in the potting process in the upper end of metal shell or sintering seat; reduced the repair that applies silica gel when producing; simultaneously also indirect protection pressure chip and bonding wire, thereby the long-term stability that realizes gaseous tension is at low cost measured.The utility model comprises: cover sheet, silica gel, lead-in wire, pressure chip, shell, base; it is characterized in that being bonded with pressure chip on the described base; binding post on the base and pressure chip lead-in wire bonding; pressure chip and lead-in wire are by being filled in silica gel protected in the cavity; silica gel is kept apart pressure chip, lead-in wire and testing medium; and provide protection for pressure chip, lead-in wire; transmit the pressure of gas to be measured simultaneously as medium; the shell upper end is provided with cover sheet, and cover sheet is provided with the air inlet instrument connection.
The utility model has the advantages that:
1. adopt soft silica gel isolating chip and testing medium, both protected chip and bonding wire, transmitted the pressure of gas to be measured almost losslessly.Because the Young modulus of soft silica gel is very little, so in the process of solidifying and using,, thereby can ignore to the output characteristics influence of chip because of the stress that temperature cycles produced is very little.Secondly because coated layer of silica gel upper surface and cover sheet lower surface leave big gap, so the stress that silica gel is produced in temperature raises expansion process upwards shed, thereby to the substantially also not influence of output of chip.
2. cover sheet protection silica gel, pressure chip and bonding wire are avoided polluting and damaging.On the chip after the silicon-coating adhesive curing; on cover sheet, be provided with the air inlet instrument connection; influence and destruction that cover sheet protection silica gel is not subjected to foreign matter in the potting process; reduced the repair that applies silica gel in producing; also protected simultaneously pressure chip and bonding wire indirectly, the air inlet instrument connection is realized the connection of testing medium and sensor sensing part.
3. this sensor has been avoided the welding technology of necessary oil-extended process of the oil-filled packaged type of isolation diaphragm and convoluted diaphragm, have structure and packaging technology is simple, with low cost, the reliability height, advantages such as the life-span is long are useful for the pressure survey of most of non-corrosive gases and dry air medium.
Description of drawings
Fig. 1 split-type structural synoptic diagram of the present utility model;
Fig. 2 Contiuum type structural representation of the present utility model.
Among the figure: 1 cover sheet, 2 silica gel, 3 lead-in wires, 4 shells, 5 pressure chips, 6TO base.
7 metal sintering seats.
Embodiment
Embodiment one
Further specify embodiment of the present utility model below in conjunction with accompanying drawing:
Referring to Fig. 1; the utility model is applicable to the sensor of measuring the non-corrosiveness gaseous tension; by silica gel 2 isolated pressure chips 5 and testing medium, transmission pressure and protect cell pressure chip 5 and bonding wire 3; upper end at shell 4 increases cover sheet 1; cover sheet 1 has protected silica gel 2 not to be subjected to the influence and the destruction of foreign matter in the potting process; reduced the repair that applies silica gel when producing; simultaneously also indirect protection pressure chip 5 and bonding wire 2, thereby the long-term stability that realizes gaseous tension is at low cost measured.Present embodiment is made up of cover sheet 1, silica gel 2, lead-in wire 3, shell 4, pressure chip 5, TO base 6.The form of the encapsulation of present embodiment is split type, and base is a TO base 6.TO base 6 is arranged on the bottom of shell 4; be bonded with pressure chip 5 on the TO base 6; binding post on the TO base 6 and pressure chip 5 are by lead-in wire 3 bondings; be filled with silica gel 2 in the cavity that shell 4 and TO base 6 are formed; the lower surface of silica gel 2 upper surfaces and cover sheet 1 leaves the gap; silica gel 2 is kept apart pressure chip 5, lead-in wire 3 with testing medium; and 3 provide protection for pressure chip 5, lead-in wire; transmit the pressure of gas to be measured simultaneously as medium; shell 4 upper ends are provided with cover sheet 1, and cover sheet 1 is provided with the air inlet instrument connection.Lead-in wire 3 can be gold thread, aluminum steel and copper cash etc. according to different requirements.
Embodiment two
Embodiment two is identical with embodiment one; different is that the form that encapsulates is the form of Contiuum type encapsulation; referring to Fig. 2; base and shell are the metal sintering seats 7 of one; metal sintering seat 7 inside are filled with silica gel 2; there is cover sheet 1 metal sintering seat 7 upper ends, and sintering seat 7 is bonded with pressure chip 5, the binding post of sintering seat 7 and pressure chip 5 lead-in wire bondings.
Claims (5)
1. gas pressure sensor; comprise: cover sheet, silica gel, lead-in wire, pressure chip, shell, base; it is characterized in that described pressure chip is bonded on the base; binding post on the base and pressure chip lead-in wire bonding; pressure chip and lead-in wire are coated with protection silica gel; the shell upper end is provided with cover sheet, and cover sheet is provided with the air inlet instrument connection.
2. gas pressure sensor according to claim 1 is characterized in that described sensor is split type encapsulating structure, binding post on the TO base and pressure chip lead-in wire bonding, and the metal shell that links to each other with TO base upper end is provided with cover sheet.
3. gas pressure sensor according to claim 1; it is characterized in that described base is the Contiuum type encapsulating structure, base is the metal sintering seat of one, and there is cover sheet sintering seat upper end; the sintering seat is bonded with pressure chip, the binding post of sintering seat and pressure chip lead-in wire bonding.
4. gas pressure sensor according to claim 1 is characterized in that the lower surface of the upper surface of described coating protection silica gel and cover plate is gapped, through silica gel protected pressure chip and bonding wire.
5. gas pressure sensor according to claim 1 is characterized in that: bonding wire is gold thread, aluminum steel and copper cash.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205464673U CN201852665U (en) | 2010-09-28 | 2010-09-28 | Gas pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205464673U CN201852665U (en) | 2010-09-28 | 2010-09-28 | Gas pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201852665U true CN201852665U (en) | 2011-06-01 |
Family
ID=44095054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205464673U Expired - Fee Related CN201852665U (en) | 2010-09-28 | 2010-09-28 | Gas pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201852665U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102419235A (en) * | 2010-09-28 | 2012-04-18 | 刘胜 | Gas pressure sensor |
| CN104101459A (en) * | 2014-07-30 | 2014-10-15 | 东南大学 | Wind-pressure-resistant barometric sensor packaging structure |
| CN106531723A (en) * | 2016-11-28 | 2017-03-22 | 西安科锐盛创新科技有限公司 | Preparation method of bare chip test structure |
| CN106596641A (en) * | 2016-11-29 | 2017-04-26 | 梁结平 | Gas sensor and encapsulating method thereof |
| CN112113699A (en) * | 2019-06-21 | 2020-12-22 | 霍尼韦尔国际公司 | Micro-molded fluid pressure sensor housing |
-
2010
- 2010-09-28 CN CN2010205464673U patent/CN201852665U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102419235A (en) * | 2010-09-28 | 2012-04-18 | 刘胜 | Gas pressure sensor |
| CN104101459A (en) * | 2014-07-30 | 2014-10-15 | 东南大学 | Wind-pressure-resistant barometric sensor packaging structure |
| CN106531723A (en) * | 2016-11-28 | 2017-03-22 | 西安科锐盛创新科技有限公司 | Preparation method of bare chip test structure |
| CN106596641A (en) * | 2016-11-29 | 2017-04-26 | 梁结平 | Gas sensor and encapsulating method thereof |
| CN112113699A (en) * | 2019-06-21 | 2020-12-22 | 霍尼韦尔国际公司 | Micro-molded fluid pressure sensor housing |
| CN112113699B (en) * | 2019-06-21 | 2023-04-04 | 霍尼韦尔国际公司 | Micro-molded fluid pressure sensor housing |
| US11630011B2 (en) | 2019-06-21 | 2023-04-18 | Honeywell International Inc. | Micro-molded fluid pressure sensor housing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20190928 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |