CN201848664U - Semiconductor C-type bracket welding mechanism - Google Patents

Semiconductor C-type bracket welding mechanism Download PDF

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Publication number
CN201848664U
CN201848664U CN2010201745061U CN201020174506U CN201848664U CN 201848664 U CN201848664 U CN 201848664U CN 2010201745061 U CN2010201745061 U CN 2010201745061U CN 201020174506 U CN201020174506 U CN 201020174506U CN 201848664 U CN201848664 U CN 201848664U
Authority
CN
China
Prior art keywords
semiconductor
welding
base plate
positioning component
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010201745061U
Other languages
Chinese (zh)
Inventor
柏承业
季为民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Well-Tech Electronics Technologies (Changzhou) Co., Ltd.
Original Assignee
CHANGZHOU WEITAI PRECISION MACHINERY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU WEITAI PRECISION MACHINERY Co Ltd filed Critical CHANGZHOU WEITAI PRECISION MACHINERY Co Ltd
Priority to CN2010201745061U priority Critical patent/CN201848664U/en
Application granted granted Critical
Publication of CN201848664U publication Critical patent/CN201848664U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a mechanical welding locating device, in particular to a locating device required when a semiconductor bracket is welded. The utility model aims to provide a semiconductor C-type bracket welding mechanism with simple structure, which is capable of relieving labor intensity, improving efficiency and simultaneously preventing welding deformation as much as possible. The semiconductor C-type bracket welding mechanism is provided with a bottom board; the upper and the lower ends of the bottom board are respectively provided with trucking bars; a locating plate is arranged above the bottom board; the upper part of the bottom board is provided with a first locating component; and both sides of the bottom board are respectively provided with a second locating component and a third locating component. The mechanism has the following advantages: one-time assembling of products is realized, and the spatial location of a workpiece is determined through a combined shaft, a locating pin and a limit stop pin after the workpiece is arranged on a welding platform, thereby improving welding efficiency and also efficiently preventing welding deformation.

Description

Semiconductor C type support welding mechanism
Technical field
The utility model relates to a kind of machinery welding positioning equipment, required positioner when relating to the welding of semiconductor support especially.
Background technology
The welding tooling anchor clamps never are subjected to the attention of mechanical welding profession in the past, each producer all carries out own development and Design manufacturing, the welding tooling anchor clamps are exactly that weldment is accurately located and reliable grip, are convenient to the technological equipment that workpiece assembled and welded, guaranteed that Workpiece structure precision aspect requires.The frock clamp that positive popularization and use and product structure adapt in the modern times, welding was produced to improving the quality of products, alleviates working strength of workers, and the acceleration welding is produced aspects such as realizing mechanization, automated process and played important effect.
For the welding of semiconductor support, because the required precision height according to common welding method, carries out Combination Welding after earlier each parts welding being finished again, welding deformation is bigger, is difficult to guarantee welding precision.
The utility model content
It is a kind of simple in structure that the purpose of this utility model is to provide, and can reduce labor intensity, raise the efficiency the semiconductor C type support welding mechanism of as far as possible avoiding welding deformation simultaneously.
The technical scheme that realizes the utility model purpose is:
A kind of semiconductor C type support welding mechanism has base plate, and the base plate upper and lower side is respectively equipped with the carrying bar, and above-mentioned base plate top is provided with location-plate, and base plate top is provided with first positioning component, and the base plate both sides are respectively equipped with second positioning component and the 3rd positioning component.
Above-mentioned the 3rd positioning component is fixedlyed connected with base plate, and the 3rd positioning component is provided with the axle mount pad that is used for installing locating shaft.
Above-mentioned first positioning component is provided with first Anchor plate kit that is used for controlling the workpiece outline.
Above-mentioned second positioning component is provided with second Anchor plate kit that is used for controlling the workpiece outline.
Above-mentioned base plate bottom also is provided with the backer who is used for controlling the workpiece profile.
Benefit of the present utility model is to realize the disposable clamping to product, workpiece is placed the back determine the locus of workpiece both to have improved welding efficiency and also effectively avoided welding deformation by built-up shaft, alignment pin and spacing backing pin on jig; Owing to around base plate, be provided with the carrying bar, can carry out base plate by hand-held carrying bar very easily and move in addition together with workpiece.
Description of drawings
Fig. 1 is a floor map of the present utility model.
The generalized section that Fig. 2 is Fig. 1 when left is observed.
The specific embodiment
See Fig. 1 and Fig. 2, this novel semi-conductor C type support welding mechanism has base plate 1, and the base plate upper and lower side is provided with 4 carrying bars 2, can be used for movable base plate together with the workpiece on the base plate.
The base plate top is provided with location-plate 3, also is provided with first, second and third positioning component 4,5,6 on the base plate.The 3rd positioning component 6 is fixedlyed connected with base plate, is used for the position of locating shaft mount pad, and sliding joining connects locating shaft 61 on the axle mount pad, and locating shaft is used for determining the locus before the workpiece 100 sub-parts welding; Second positioning component 5 is fixedly connected on the base plate, is connected with second Anchor plate kit, 8, the second Anchor plate kits on second positioning component and is connected with second positioning component is adjustable by being threaded, and is used for limiting the outer profile size of workpiece; First positioning component 4 is fixedly connected on the base plate, first positioning component and location-plate 3 are used for determining the space placement location of the sub-part of workpiece, the first positioning component side has first Anchor plate kit 7, first Anchor plate kit is connected by screw lock with first positioning component, is used for controlling the outer profile size of workpiece.Also fixedly connected backer 9 on the base plate is used for controlling the appearance and size of workpiece.
When workpiece 100 is placed on the base plate 1, determine the locus of workpiece by locating shaft 61, location-plate 3 and first, second and third positioning component and backer 9, the welder can carry out welding operation, and owing to the disposable clamping of workpiece, has improved welding efficiency and also effectively avoided welding deformation.

Claims (5)

1. semiconductor C type support welding mechanism, has base plate (1), the base plate upper and lower side is respectively equipped with carrying bar (2), it is characterized in that: above-mentioned base plate top is provided with location-plate (3), base plate top is provided with first positioning component (4), and the base plate both sides are respectively equipped with second positioning component (5) and the 3rd positioning component (6).
2. semiconductor C type support welding mechanism according to claim 1, it is characterized in that: above-mentioned the 3rd positioning component is fixedlyed connected with base plate, and the 3rd positioning component is provided with the axle mount pad that is used for installing locating shaft (61).
3. semiconductor C type support welding mechanism according to claim 1, it is characterized in that: above-mentioned first positioning component (6) is provided with first Anchor plate kit (7) that is used for controlling workpiece (100) outline.
4. semiconductor C type support welding mechanism according to claim 1, it is characterized in that: above-mentioned second positioning component (5) is provided with second Anchor plate kit (8) that is used for controlling the workpiece outline.
5. semiconductor C type support welding mechanism according to claim 1, it is characterized in that: above-mentioned base plate bottom also is provided with the backer (9) who is used for controlling the workpiece profile.
CN2010201745061U 2010-04-29 2010-04-29 Semiconductor C-type bracket welding mechanism Expired - Fee Related CN201848664U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010201745061U CN201848664U (en) 2010-04-29 2010-04-29 Semiconductor C-type bracket welding mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010201745061U CN201848664U (en) 2010-04-29 2010-04-29 Semiconductor C-type bracket welding mechanism

Publications (1)

Publication Number Publication Date
CN201848664U true CN201848664U (en) 2011-06-01

Family

ID=44091077

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010201745061U Expired - Fee Related CN201848664U (en) 2010-04-29 2010-04-29 Semiconductor C-type bracket welding mechanism

Country Status (1)

Country Link
CN (1) CN201848664U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: CHANGZHOU WELL-TECH ELECTRONIC TECHNOLOGIES CO., L

Free format text: FORMER OWNER: CHANGZHOU WELL-TECH PRECISION MACHINERY CO., LTD.

Effective date: 20120217

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120217

Address after: 213125 Jiangsu city in Changzhou Province, the new North Xuejiadao town Fuqiang Road No. 1

Patentee after: Changzhou City Well-tech Electronic Technology Co., Ltd.

Address before: 213125 Jiangsu city in Changzhou Province, the new North Xuejiadao town Fuqiang Road No. 1

Patentee before: Changzhou Weitai Precision Machinery Co., Ltd.

C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 213125 Jiangsu city in Changzhou Province, the new North Xuejiadao town Fuqiang Road No. 1

Patentee after: Well-Tech Electronics Technologies (Changzhou) Co., Ltd.

Address before: 213125 Jiangsu city in Changzhou Province, the new North Xuejiadao town Fuqiang Road No. 1

Patentee before: Changzhou City Well-tech Electronic Technology Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110601

Termination date: 20180429