CN201720640U - Welding mechanism of semiconductor stander - Google Patents

Welding mechanism of semiconductor stander Download PDF

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Publication number
CN201720640U
CN201720640U CN2010201742788U CN201020174278U CN201720640U CN 201720640 U CN201720640 U CN 201720640U CN 2010201742788 U CN2010201742788 U CN 2010201742788U CN 201020174278 U CN201020174278 U CN 201020174278U CN 201720640 U CN201720640 U CN 201720640U
Authority
CN
China
Prior art keywords
welding
base plate
positioning component
welding mechanism
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010201742788U
Other languages
Chinese (zh)
Inventor
柏承业
施仁斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Well-Tech Electronics Technologies (Changzhou) Co., Ltd.
Original Assignee
CHANGZHOU WEITAI PRECISION MACHINERY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU WEITAI PRECISION MACHINERY Co Ltd filed Critical CHANGZHOU WEITAI PRECISION MACHINERY Co Ltd
Priority to CN2010201742788U priority Critical patent/CN201720640U/en
Application granted granted Critical
Publication of CN201720640U publication Critical patent/CN201720640U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to mechanical welding and positioning equipment, in particular to a positioning device required when a semiconductor bracket is welded. The welding mechanism aims to provide a welding mechanism of the semiconductor stander, which has simple structure, and can lighten the labor intensity, improve the efficiency and avoid welding deformation as far as possible. The welding mechanism of the semiconductor stander is provided with a bottom plate, the upper part of the bottom plate is provided with a first positioning assembly, two sides of the bottom plate are respectively provided with a second positioning assembly, a third positioning assembly and a fourth positioning assembly, and the middle on the bottom plate is also provided with an auxiliary bearing assembly. The mechanical welding and positioning equipment has the advantages that products can be clamped in one step, and after a workpiece is placed on a welding platform, the space position of the workpiece can be confirmed through a combined shaft, a locating pin and a limiting stop pin, thereby not only improving the welding efficiency, but also effectively avoiding welding deformation.

Description

Semiconductor frame welding mechanism
Technical field
The utility model relates to a kind of machinery welding positioning equipment, required positioner when relating to the welding of semiconductor support especially.
Background technology
The welding tooling anchor clamps never are subjected to the attention of mechanical welding profession in the past, each producer all carries out own development and Design manufacturing, the welding tooling anchor clamps are exactly that weldment is accurately located and reliable grip, are convenient to the technological equipment that workpiece assembled and welded, guaranteed that Workpiece structure precision aspect requires.The frock clamp that positive popularization and use and product structure adapt in the modern times, welding was produced to improving the quality of products, alleviates working strength of workers, and the acceleration welding is produced aspects such as realizing mechanization, automated process and played important effect.
For the welding of semiconductor support, because the required precision height according to common welding method, carries out Combination Welding after earlier each parts welding being finished again, welding deformation is bigger, is difficult to guarantee welding precision.
Summary of the invention
It is a kind of simple in structure that the purpose of this utility model is to provide, and can reduce labor intensity, raise the efficiency the semiconductor frame welding mechanism of as far as possible avoiding welding deformation simultaneously.
The technical scheme that realizes the utility model purpose is: a kind of semiconductor frame welding mechanism, has base plate, above-mentioned base plate top is provided with first positioning component, the base plate both sides are respectively equipped with second positioning component, the 3rd positioning component and the 4th positioning component, and the middle part also is provided with the aiding support assembly on the base plate.
Have a mount pad on above-mentioned the 3rd positioning component, the axle mount pad is connected with the major axis that guarantees each sub-part axiality on the workpiece.
Above-mentioned second positioning component comprises the locating piece of fixedlying connected with base plate, the axle sleeve of fixedlying connected with locating piece, is provided with the push rod that is slidingly connected in the axle sleeve, is provided with stage clip between above-mentioned axle sleeve and the push rod.
Above-mentioned base plate top also is provided with the auxiliary limit assembly that is used for limiting the workpiece outline.
Benefit of the present utility model is to realize the disposable clamping to product, workpiece is placed the back determine the locus of workpiece both to have improved welding efficiency and also effectively avoided welding deformation by built-up shaft, alignment pin and spacing backing pin on jig; Owing on base plate, also be provided with the aiding support assembly, can earlier workpiece be placed into the Position Approximate on the base plate faster in addition, shorten man-hour greatly.
Description of drawings
Fig. 1 is a floor map of the present utility model.
Fig. 2 is the generalized section of Fig. 1 during from beneath.
The generalized section that Fig. 3 is Fig. 1 when left is observed.
Fig. 4 is an A place enlarged diagram among Fig. 2.
The specific embodiment
See Fig. 1 and Fig. 2, this novel semi-conductor frame welding mechanism has base plate 1, and base plate top is provided with first positioning component 2, the base plate both sides be respectively equipped with second and third, four positioning components 3,4,5.Above-mentioned the 3rd positioning component 4 is fixedlyed connected with base plate, is used for the position of locating shaft mount pad, and the sliding connection major axis of joining on the axle mount pad, major axis are used for determining the axiality between workpiece 100 each sub-part.Second positioning component 3 comprises locating piece 34, axle sleeve 31, push rod 32 and stage clip 33, locating piece is fixedlyed connected with screw by alignment pin with base plate, axle sleeve is fixedly connected on the locating piece, be provided with the push rod 32 that can slide in the axle sleeve, be provided with stage clip 33 between push rod and the axle sleeve, the external part of push rod can contact with workpiece, is used for locating to workpiece.
Also be provided with aiding support assembly 6 and auxiliary limit assembly 7 on the base plate, the operator utilizes the aiding support assembly faster workpiece to be placed into Position Approximate on the base plate, shortens man-hour greatly.The top of base plate is provided with auxiliary limit assembly 7, can determine the outline of welding work pieces.
When workpiece 100 is placed on the base plate 1 fast by the assist location assembly, determine the locus of workpiece again by first, second, third and fourth positioning component 2,3,4,5 and auxiliary limit assembly, the welder can carry out welding operation, and owing to, improved welding efficiency and also effectively avoided welding deformation the disposable clamping of workpiece.

Claims (4)

1. semiconductor frame welding mechanism, has base plate (1), it is characterized in that: above-mentioned base plate top is provided with first positioning component (2), the base plate both sides are respectively equipped with second positioning component (3), the 3rd positioning component (4) and the 4th positioning component (5), and the middle part also is provided with aiding support assembly (6) on the base plate.
2. semiconductor frame welding mechanism according to claim 1 is characterized in that: have a mount pad on above-mentioned the 3rd positioning component (4), the axle mount pad is connected with and guarantees the upward major axis of each sub-part axiality of workpiece (100).
3. semiconductor frame welding mechanism according to claim 1, it is characterized in that: above-mentioned second positioning component (3) comprises the locating piece (34) of fixedlying connected with base plate, the axle sleeve (31) of fixedlying connected with locating piece, be provided with the push rod (32) that is slidingly connected in the axle sleeve, be provided with stage clip (33) between above-mentioned axle sleeve and the push rod.
4. semiconductor frame welding mechanism according to claim 1 is characterized in that: above-mentioned base plate top also is provided with the auxiliary limit assembly (7) that is used for limiting the workpiece outline.
CN2010201742788U 2010-04-29 2010-04-29 Welding mechanism of semiconductor stander Expired - Fee Related CN201720640U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010201742788U CN201720640U (en) 2010-04-29 2010-04-29 Welding mechanism of semiconductor stander

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010201742788U CN201720640U (en) 2010-04-29 2010-04-29 Welding mechanism of semiconductor stander

Publications (1)

Publication Number Publication Date
CN201720640U true CN201720640U (en) 2011-01-26

Family

ID=43488925

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010201742788U Expired - Fee Related CN201720640U (en) 2010-04-29 2010-04-29 Welding mechanism of semiconductor stander

Country Status (1)

Country Link
CN (1) CN201720640U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102489862A (en) * 2011-12-15 2012-06-13 沈阳黎明航空发动机(集团)有限责任公司 Additional device for vacuum electron beam welding equipment
CN102728982A (en) * 2012-07-23 2012-10-17 杭州和泰机电工业有限公司 Joint welding tool for hopper
CN103008943A (en) * 2012-12-11 2013-04-03 柳州五菱汽车有限责任公司 Tool for welding bottom plate assembly of driving cab
CN104128728A (en) * 2013-12-20 2014-11-05 中国重汽集团柳州运力专用汽车有限公司 Dump truck baseplate framework welding device
CN104275571A (en) * 2014-09-29 2015-01-14 柳州金茂机械有限公司 Positioning equipment for assembly welding of rear frame of loader

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102489862A (en) * 2011-12-15 2012-06-13 沈阳黎明航空发动机(集团)有限责任公司 Additional device for vacuum electron beam welding equipment
CN102728982A (en) * 2012-07-23 2012-10-17 杭州和泰机电工业有限公司 Joint welding tool for hopper
CN102728982B (en) * 2012-07-23 2014-06-25 杭州和泰机电工业有限公司 Joint welding tool for hopper
CN103008943A (en) * 2012-12-11 2013-04-03 柳州五菱汽车有限责任公司 Tool for welding bottom plate assembly of driving cab
CN103008943B (en) * 2012-12-11 2015-11-25 广西汽车集团有限公司 A kind of bottom plate of driving cab assembly welding tooling
CN104128728A (en) * 2013-12-20 2014-11-05 中国重汽集团柳州运力专用汽车有限公司 Dump truck baseplate framework welding device
CN104275571A (en) * 2014-09-29 2015-01-14 柳州金茂机械有限公司 Positioning equipment for assembly welding of rear frame of loader

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: CHANGZHOU WELL-TECH ELECTRONIC TECHNOLOGIES CO., L

Free format text: FORMER OWNER: CHANGZHOU WELL-TECH PRECISION MACHINERY CO., LTD.

Effective date: 20120217

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120217

Address after: 213125 Jiangsu city in Changzhou Province, the new North Xuejiadao town Fuqiang Road No. 1

Patentee after: Changzhou City Well-tech Electronic Technology Co., Ltd.

Address before: 213125 Jiangsu city in Changzhou Province, the new North Xuejiadao town Fuqiang Road No. 1

Patentee before: Changzhou Weitai Precision Machinery Co., Ltd.

C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 213125 Jiangsu city in Changzhou Province, the new North Xuejiadao town Fuqiang Road No. 1

Patentee after: Well-Tech Electronics Technologies (Changzhou) Co., Ltd.

Address before: 213125 Jiangsu city in Changzhou Province, the new North Xuejiadao town Fuqiang Road No. 1

Patentee before: Changzhou City Well-tech Electronic Technology Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110126

Termination date: 20190429

CF01 Termination of patent right due to non-payment of annual fee