CN201846528U - Printed circuit board with reliable welding spots, packaging device and packaging module - Google Patents
Printed circuit board with reliable welding spots, packaging device and packaging module Download PDFInfo
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- CN201846528U CN201846528U CN2010202936526U CN201020293652U CN201846528U CN 201846528 U CN201846528 U CN 201846528U CN 2010202936526 U CN2010202936526 U CN 2010202936526U CN 201020293652 U CN201020293652 U CN 201020293652U CN 201846528 U CN201846528 U CN 201846528U
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Abstract
The utility model discloses a printed circuit board, which comprises a substrate and a plurality of pads. At least one of the pads is replaced into a pad array, and the gross area of the pad array is equal to the area of the pad before being replaced. By means of changing the pad with larger area into the pad array with smaller area, the printed circuit board can prolong service life of welding spots, and increases reliability of the welding spots.
Description
Technical field
The utility model is usually directed to improve the technology of dependability of the solder joint of packaging on printed circuit board (PCB), relates more specifically to have printed circuit board (PCB), Background Grid array packages (LGA) device and the package module of reliability solder joint.
Background technology
The LGA encapsulation is actually the improvement of PGA (contact pin grid array) encapsulation.Encapsulation is compared with PGA, and LGA removes all pins of bottom, then has become a large amount of contacts (tactile disk) on the plane.The LGA packaging can directly be gone up tin and be contained on the printed circuit board (PCB) (PCB), also can the LGA encapsulation be connected with PCB by lga socket.After adopting such connected mode, the distance between LGA packaging and the PCB significantly shortens, and makes the electric property of LGA encapsulation more be better than PGA.Compare with other package modules, LGA encapsulation have simultaneously pad layout flexibly, perfect heat-dissipating, the I/O number is more, signal quality is high advantage.Therefore, under the promotion of highly dense assembling demand, the application of LGA encapsulation is more and more wider, and demand is increasing.Yet in application, LGA Welding Problems occurs and need separate and reinitialize tin and reprocess, and therefore guarantees the First Pass Yield of LGA welding, and the reliability that promptly improves the LGA solder joint is extremely important.
The reliability of solder joint can be subjected to influence of various factors, as properties of materials (PCB substrate, element etc.) and project organization.The standard BGA of the simple structure interconnected with having the standard solder joint is different with the CSP encapsulation, and the LGA package module can comprise various components and parts, as resistance, electric capacity, inductance, transformer, MLCC, IC etc.Therefore the LGA package module is complicated more aspect project organization.Usually use the larger area pad, so that obtain to have the high power transmission of low resistance and high-termal conductivity.Yet when bonding pad area was big, its inner stress can be bigger, and this can have influence on the working life of solder joint.Therefore, need provide a kind of design, when guaranteeing high power transmission, prolong the useful life of solder joint, improve the reliability of solder joint.
The utility model content
Because thereby thermal deformation makes solder joint bear the problem that big stress causes the welding spot reliability variation, provide printed circuit board (PCB), LGA packaging during the utility model encapsulates at LGA, and LGA package module with reliability solder joint.
For this reason, the utility model provides a kind of printed circuit board (PCB), and described printed circuit board (PCB) comprises substrate and a plurality of pad, it is characterized in that, at least one pad in described a plurality of pad is replaced by pad array, the gross area of described pad array be replaced before described pad area about equally.Wherein, pad array can be the array of N * M, wherein, 1＜N≤9,1＜M≤9, N is an integer that equate or unequal with M.
Further, the utility model provides a kind of Background Grid array packages device, described Background Grid array packages device comprises body and a plurality of tactile disk, it is characterized in that, at least one tactile disk in described a plurality of tactile disk is replaced by the tactile disk array, the gross area of described tactile disk array be replaced before described tactile disk area about equally.Wherein, the tactile disk array can be the array of N * M, wherein, 1＜N≤9,1＜M≤9, N is an integer that equate or unequal with M.
Further, the utility model provides a kind of Background Grid array packages module, described Background Grid array packages module comprises Background Grid array packages device and printed circuit board (PCB), described Background Grid array packages device comprises body and a plurality of tactile disk, described printed circuit board (PCB) comprise substrate and with the corresponding a plurality of pads of described a plurality of tactile disks, it is characterized in that, at least one pad in described a plurality of pad is replaced by pad array, the gross area of described pad array be replaced before described pad area about equally, at least one tactile disk in described a plurality of tactile disk is replaced by the tactile disk array corresponding to described at least one pad, the gross area of described tactile disk array be replaced before described tactile disk area about equally.Wherein, pad array and tactile disk array all can be the arrays of N * M, wherein, 1＜N≤9,1＜M≤9, N is an integer that equate or unequal with M.
Description of drawings
Fig. 1 is the schematic diagram according to printed circuit board (PCB) of the present utility model;
Fig. 2 is the schematic diagram according to Background Grid array packages device of the present utility model;
Fig. 3 is the schematic diagram according to a pad on the printed circuit board (PCB) of an embodiment of the present utility model;
Fig. 4 is the schematic diagram according to a pad on the printed circuit board (PCB) of an embodiment of the present utility model;
Fig. 5 is the schematic diagram according to a pad on the printed circuit board (PCB) of an embodiment of the present utility model;
Fig. 6 a is the schematic diagram that illustrates a plurality of pads on the printed circuit board (PCB) that does not use the utility model method;
Fig. 6 b is the schematic diagram after being replaced according to the part pad on the printed circuit board (PCB) of an embodiment of the utility model.
Embodiment
Fig. 1 is the schematic diagram according to printed circuit board (PCB) of the present utility model.With reference to figure 1, printed circuit board (PCB) 100 of the present utility model comprises substrate 101 and a plurality of pad 102, and these a plurality of pads 102 are used for welding to realize being electrically connected of LGA packaging and printed circuit board (PCB) 100 with the LGA packaging.Pad 102 can form by modes such as chemical etchings.Three pads 102 have schematically been described among this figure, but it will be appreciated by those skilled in the art that, according to concrete needs and design, the quantity of pad can change arbitrarily on the printed circuit board (PCB), present embodiment is intended to printed circuit board (PCB) of the present utility model is carried out the explanation of principle, is not specifically to limit.The material of pad 102 is generally copper.
In order to improve the reliability of solder joint in the LGA encapsulation, prolong the life-span of solder joint, the utility model embodiment can be divided at least one pad in a plurality of pads 102 pad array of N * M as required, wherein, N can be an integer that equate or unequal with M, and is preferred, 1＜N≤9.In order to understand the utility model more intuitively, Fig. 3, Fig. 4, Fig. 5 for example understand the situation that a pad is replaced with 2 * 2,3 * 3,4 * 4 pad array.It should be noted that Fig. 3 to Fig. 5 only is exemplary explanation basic principle of the present utility model, is not exhaustive to the utility model embodiment.
Fig. 3 show with pad 301 replace with 2 * 2 pad array 301 ', the area of the pad array 301 after the replacement ' shared gross area and original pad 301 is about equally.Similarly, Fig. 4 show with pad 401 replace with 3 * 3 pad array 401 ', the pad array 401 after the replacement ' shared gross area equates with the area of original pad 401.Fig. 5 illustrate with pad 501 replace with 5 * 5 pad array 501 ', the area of the pad array 501 after the replacement ' shared gross area and original pad 501 is about equally.
Fig. 2 is the schematic diagram according to Background Grid array packages device of the present utility model.With reference to figure 2, Background Grid array packages device 200 of the present utility model comprises body 201 and a plurality of tactile disk 202, these a plurality of tactile disks 202 are corresponding to a plurality of pads on the printed circuit board (PCB) 100, are used for welding to realize being electrically connected of LGA packaging and printed circuit board (PCB) 100 with the respective pad of printed circuit board (PCB) 100.The area of a plurality of tactile disks 202 on the Background Grid array packages device 200 can be substantially equal to respectively or less than the area of the corresponding a plurality of pads 102 on the printed circuit board (PCB) 100.Background Grid array packages device of the present utility model can be resistance, electric capacity, inductance, integrated circuit (IC) element, MLCC etc.
In order to reach technique effect of the present utility model, promptly, improve the reliability of solder joint in the LGA encapsulation, prolong the life-span of solder joint, the utility model embodiment is divided into the tactile disk array of N * M with at least one tactile disk in a plurality of tactile disks 202, wherein, N can be an integer that equate or unequal with M, preferably, 1＜N, M≤9.Similar to the illustrational situation that a pad is replaced with 2 * 2,3 * 3,4 * 4 pad array of Fig. 3, Fig. 4, Fig. 5, tactile disk also can be replaced by 2 * 2,3 * 3,4 * 4 tactile disk array accordingly, no longer illustrates at this.
For the utility model is described more intuitively, Fig. 6 a for example understands the schematic diagram of a plurality of pads on the printed circuit board (PCB) that does not use the utility model method; Fig. 6 b is the schematic diagram after being replaced according to the part pad on the printed circuit board (PCB) of an embodiment of the utility model.With Fig. 6 a and 6b contrast can be clear that very much part pad 601-606 in the original printed circuit board (PCB) replaced to respectively pad array 601 '-606 '.Pad array 601 '-606 among the figure ' adopted 3 * 3 array.It will be understood by those skilled in the art that Fig. 6 a, 6b only are exemplary explanation basic principles of the present utility model, is not exhaustive to the utility model embodiment.
The utility model also provides the (not shown) of the Background Grid array packages module with reliable solder joint.This Background Grid array packages module comprises Background Grid array packages device and the printed circuit board (PCB) that connects by weld layer, the Background Grid array packages device comprises body and a plurality of tactile disk, printed circuit board (PCB) comprise substrate and with the corresponding a plurality of pads of a plurality of tactile disks, above-mentioned weld layer is welded by corresponding a plurality of pads of a plurality of tactile disks of Background Grid array packages device and printed circuit board (PCB) and forms, to realize being electrically connected of LGA packaging and printed circuit board (PCB).Wherein, at least one pad in a plurality of pads on the printed circuit board (PCB) is replaced by pad array, the gross area of this pad array be replaced before pad area about equally.At least one tactile disk in the corresponding a plurality of tactile disks of grid packaging and a plurality of pad is by the corresponding tactile disk array that replaces with, the gross area of this pad array be replaced before described pad area about equally.Above-mentioned pad array and tactile disk array all can be the arrays of N * M, and wherein, N can be an integer that equate or unequal with M, and be preferred, 1＜N≤9.
The description to disclosed embodiment that before provided is can make or use the utility model for any professional those of skill in the art that make this area.Difference to these embodiment is revised, and will be conspicuous for this area professional and technical personnel, and Ding Yi General Principle can be applied to other embodiment herein, and does not break away from spirit and scope of the present utility model.Therefore, the utility model is not limited to by the embodiment shown in this paper, but consistent with the broadest scope of principle disclosed herein and novel features.
Claims (9)
1. printed circuit board (PCB), described printed circuit board (PCB) comprises substrate and a plurality of pad, it is characterized in that, at least one pad in described a plurality of pads is replaced by pad array, the gross area of described pad array be replaced before the area of described pad equate.
2. printed circuit board (PCB) as claimed in claim 1, wherein, described pad array is the pad array of N * M, wherein, 1＜N≤9,1＜M≤9.
3. printed circuit board (PCB) as claimed in claim 2, wherein, N is an integer that equate or unequal with M.
4. Background Grid array packages device, described Background Grid array packages device comprises body and a plurality of tactile disk, it is characterized in that at least one tactile disk in described a plurality of tactile disks is replaced by the tactile disk array, the gross area of described tactile disk array equates with the area that is replaced preceding described tactile disk.
5. Background Grid array packages device as claimed in claim 4, wherein, described tactile disk array is the array of N * M, wherein, 1＜N≤9,1＜M≤9.
6. Background Grid array packages device as claimed in claim 5, wherein, N is an integer that equate or unequal with M.
7. Background Grid array packages module, described Background Grid array packages module comprises Background Grid array packages device and printed circuit board (PCB), described Background Grid array packages device comprises body and a plurality of tactile disk, described printed circuit board (PCB) comprise substrate and with the corresponding a plurality of pads of described a plurality of tactile disks, it is characterized in that, at least one pad in described a plurality of pad is replaced by pad array, the gross area of described pad array equates with the area that is replaced preceding described pad, at least one tactile disk in described a plurality of tactile disk is replaced by the tactile disk array corresponding to described at least one pad, and the gross area of described tactile disk array equates with the area that is replaced preceding described tactile disk.
8. Background Grid array packages module as claimed in claim 7, wherein, the array that described pad array and described tactile disk array all are N * M, wherein, 1＜N≤9,1＜M≤9.
9. Background Grid array packages module as claimed in claim 8, wherein, N is an integer that equate or unequal with M.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202936526U CN201846528U (en) | 2010-08-13 | 2010-08-13 | Printed circuit board with reliable welding spots, packaging device and packaging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202936526U CN201846528U (en) | 2010-08-13 | 2010-08-13 | Printed circuit board with reliable welding spots, packaging device and packaging module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201846528U true CN201846528U (en) | 2011-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202936526U Expired - Lifetime CN201846528U (en) | 2010-08-13 | 2010-08-13 | Printed circuit board with reliable welding spots, packaging device and packaging module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201846528U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102378484A (en) * | 2010-08-13 | 2012-03-14 | 雅达电子有限公司 | Method for improving solder joint reliability, printed circuit board, packaging device and packaging module |
| CN104349605A (en) * | 2013-08-05 | 2015-02-11 | 深圳市共进电子股份有限公司 | Printed circuit board and manufacturing method thereof |
-
2010
- 2010-08-13 CN CN2010202936526U patent/CN201846528U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102378484A (en) * | 2010-08-13 | 2012-03-14 | 雅达电子有限公司 | Method for improving solder joint reliability, printed circuit board, packaging device and packaging module |
| CN102378484B (en) * | 2010-08-13 | 2017-02-08 | 雅达电子有限公司 | Method for improving solder joint reliability, printed circuit board, packaging device and packaging module |
| CN104349605A (en) * | 2013-08-05 | 2015-02-11 | 深圳市共进电子股份有限公司 | Printed circuit board and manufacturing method thereof |
| CN104349605B (en) * | 2013-08-05 | 2018-06-05 | 深圳市共进电子股份有限公司 | Printed circuit board and manufacturing methods |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |