CN201845289U - Radiating structure - Google Patents
Radiating structure Download PDFInfo
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- CN201845289U CN201845289U CN2010202818835U CN201020281883U CN201845289U CN 201845289 U CN201845289 U CN 201845289U CN 2010202818835 U CN2010202818835 U CN 2010202818835U CN 201020281883 U CN201020281883 U CN 201020281883U CN 201845289 U CN201845289 U CN 201845289U
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- central processing
- processing unit
- wind deflector
- mainboard
- internal memory
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Abstract
The utility model provides a radiating structure which comprises a radiator fan module, a motherboard module and an air deflector. One end of the air deflector is clamped between two adjacent memory-chips, and the other end of the air deflector is fixed on the motherboard, so that the air deflector is fixed on the motherboard module and extends to a position adjacent to the radiator fan module in the direction of the memory-chips and away from a central processing unit to lead a large proportion of heat dissipation wind generated by the radiator fan module to flow to the central processing unit for heat dissipation. Therefore, the radiating effect of the central processing unit is improved, and the problem of heat dissipation imbalance between the central processing unit and the memory-chips under the prior art is solved.
Description
Technical field
The utility model relates to a kind of radiator structure, particularly relates to a kind of radiator structure that is applied to improve the central processing unit radiating effect.
Background technology
Generally speaking, the mainboard of server need be installed electronic components such as internal memory and central processing unit, to carry out particular task.But because server capability constantly promotes and travelling speed increases day by day, thereby be installed in electronic component on the mainboard in when operation, the heat energy that is produced also can improve thereupon, if heat energy can't effectively be got rid of, the electronic component that then can take place on the mainboard damages because of overheated.
For this reason, server is provided with a plurality of radiator fans usually, with respectively on the mainboard such as electronic component blows cold air such as internal memory and central processing units, dispelling the heat, and then avoid the damage that causes because of overheated.Yet, because the temperature the when temperature during the central processing unit operation can be higher than the internal memory operation, therefore central processing unit need dispel the heat to it than the more cold air of internal memory, but because the obstruction of the inner setting element of server, or because radiator fan is provided with the influence of position, the normal radiator fan that takes place can't provide the cold air of capacity that central processing unit is dispelled the heat, and is not good to cause the central processing unit radiating effect, or central processing unit and the internal memory bad result such as unbalanced of dispelling the heat.
Therefore, how to propose a kind of radiator structure, solving above-mentioned central processing unit and the internal memory unbalanced problem of dispelling the heat, and then overcome the many disadvantages of aforementioned prior art, the real industry problem anxious to be overcome at present that become.
The utility model content
In view of the shortcoming of above-mentioned prior art, a purpose of the present utility model provides a kind of radiator structure, solving central processing unit and the internal memory unbalanced problem of dispelling the heat, and then improves the radiating effect of the interior central processing unit of server.
For reaching above-mentioned and other purpose, the utility model provides a kind of radiator structure, comprising: heat radiation fan module has first radiator fan arranged side by side and second radiator fan; Mainboard module, have at least one central processing unit arranged side by side and a plurality of internal memory, the air-flow that this first radiator fan produces flows towards this central processing unit, and the air-flow that this second radiator fan produces flows towards described internal memory, and the direction that is provided with of described internal memory is parallel to the airflow direction that is produced; And wind deflector, have the first relative end and second end, this first end has the fixed part that is used for fixing this mainboard module, this second end is arranged between two neighbors in the described internal memory, this first end has more extension, extend to the close position of this second radiator fan towards described internal memory and the direction that deviates from this central processing unit, distinguished and admirable with the part heat radiation that guides this second radiator fan to be produced to this central processing unit.
In an embodiment of the present utility model, the fixed part of this wind deflector is to be used to fit the ear seat of this mainboard module, be arranged at the bottom of first end of this wind deflector, this ear seat has first fixed orifice, and this wind deflector is to be locked on this mainboard module by the screw that passes this first fixed orifice.This mainboard module more comprises a carrier and a circuit board, this circuit board has second fixed orifice, this carrier is to having threaded hole by second fixed orifice, in order to this circuit board is fixed to this carrier, this of this wind deflector first fixed orifice is to should second fixed orifice, this screw wears this first fixed orifice, this second fixed orifice and this threaded hole in order, and this wind deflector is locked on this mainboard module.This mainboard module more comprises a mainboard, and this circuit board is this mainboard.
According to above-mentioned radiator structure, this mainboard module more comprises a mainboard and an expansion board, and this central processing unit and described memory setting are on this mainboard, and this circuit board of this wind deflector that locks is this expansion board.This mainboard and this expansion board all are installed on this carrier, and this expansion board is arranged between this mainboard and the described fan.Second end of this wind deflector is arranged near between the two adjacent internal memories of this central processing unit, and is close to internal memory and this wind deflector formation guide surface of this central processing unit, and is distinguished and admirable to this central processing unit with the part heat radiation that guides this second radiator fan to be produced.
In addition, this mainboard module more can comprise a plurality of memory banks that are used to plug described internal memory, and the bottom of this wind deflector second end is arranged between two neighbors of described memory bank.The bottom of this wind deflector can have the portion of dodging, and produces with the electronic component of avoiding being laid on this wind deflector and this mainboard module and interferes.
In sum, radiator structure of the present utility model comprises heat radiation fan module, mainboard module and wind deflector.This wind deflector one end is arranged between two neighbors in the described internal memory, the other end is fixed on this mainboard module, thereby this wind deflector is fixed on this mainboard module, and extend to the close position of this heat radiation fan module towards described internal memory and the direction that deviates from this central processing unit, distinguished and admirable with the major part heat radiation that guides this heat radiation fan module to be produced to this central processing unit, so that this central processing unit is dispelled the heat, thereby improve the radiating effect of this central processing unit, to solve prior art central processing unit and the internal memory unbalanced problem of dispelling the heat.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of an embodiment of the utility model radiator structure.
Fig. 2 A is the three-dimensional exploded view of another embodiment of the utility model radiator structure.
Fig. 2 B is the three-dimensional assembly diagram of another embodiment of the utility model radiator structure.
The main element symbol description:
2 servers
21 mainboard modules
210,210 ' circuit board
211 central processing units
212 internal memories
213 radiating fins
214 memory banks
215 carriers
2151 threaded holes
2152 openings
216 expansion board
2,161 second fixed orifices
22 heat radiation fan modules
22a first radiator fan
22b second radiator fan
23 wind deflectors
231 extensions
232 fixed parts
2,321 first fixed orifices
233 dodge portion
3 screws
Embodiment
Below by specific instantiation embodiment of the present utility model is described, those skilled in the art can understand other advantages of the present utility model and effect easily by the content that this instructions disclosed.
See also Fig. 1, be respectively the stereographic map of an embodiment of radiator structure of the present utility model, as shown in the figure, in the present embodiment, this radiator structure can be applicable on the server 2, this radiator structure comprises mainboard module 21, heat radiation fan module 22, wind deflector 23, but still can be according to the number of elements of its composition of situation appropriateness increase and decrease.
This mainboard module 21 comprises circuit board 210, this circuit board 210 is set side by side with at least one central processing unit 211 and a plurality of internal memory 212, this central processing unit 211 is provided with radiating fin 213, thereby carries out radiating and cooling by 213 pairs of these central processing units 211 of this radiating fin.It should be noted that this circuit board 210 is the mainboard that habit claims to be provided with central processing unit and internal memory, but not as limit.In the present embodiment, this heat radiation fan module 22 is made up of the first radiator fan 22a arranged side by side and the second radiator fan 22b at least, wherein, the air-flow that this first radiator fan 22a produces flows towards this central processing unit 211, the air-flow that this second radiator fan 22b produces flows towards described internal memory 212, and the direction that is provided with of described internal memory 212 is parallel to the airflow direction that this first and second radiator fan 22a, 22b are produced.But it should be noted that the utility model radiator structure radiator fan quantity, position and mode be set, still can suitably adjust according to situation, not with in scheming the person of being illustrated exceed.
Described wind deflector 23 has the first relative end and second end, this first end has the fixed part 232 that is used for fixing this mainboard module 21, this fixed part 232 for example is the ear seat of this mainboard module 21 that is used to fit, and can adopt screw to lock with this mainboard module 21 fixing and bonding mode is reached, but not as limit.This second end is arranged between two neighbors in the described internal memory 212, thereby prevents that this wind deflector 23 is stressed and be that the center deflects with this fixed part 232, thereby can effectively this wind deflector 23 be fixed on this mainboard module 21.In addition, first end of this wind deflector 23 has more the extension 231 that is en plaque, this extension 231 is the close positions that extend to this second radiator fan 22b towards described internal memory 212 and the direction that deviates from this central processing unit 211, distinguished and admirable to this central processing unit 211 and radiating fin 213 thereof with the part heat radiation that guides this second radiator fan 22b to be produced, so that this central processing unit 211 is dispelled the heat, thereby improve the radiating effect of this central processing unit 211, to solve existing central processing unit 211 and the unbalanced problem of internal memory 212 heat radiations.
It should be noted that, the development length value of this extension 231 is directly proportional with the radiating requirements value of this central processing unit 211, that is to say, the radiating requirements of this central processing unit 211 heals when high, the development length of this extension 231 is just longer, with more close this second radiator fan 22b of order, thereby the air-flow that this second radiator fan 22b is the more produced is directed to this central processing unit 211 and radiating fin 213 thereof, to provide better radiating effect to this central processing unit 211.
Aforesaid structure, because the temperature the when temperature during central processing unit 211 operations can be higher than internal memory 212 operations, therefore central processing unit 211 need dispel the heat to it than internal memory 212 more cold airs, thereby this wind deflector 23 guides to this central processing unit 211 and radiating fin 213 thereof with the part radiating airflow that this second radiator fan 22b is produced, make this central processing unit 211 except passing through this first radiator fan 22a, also can dispel the heat simultaneously by the part radiating airflow that this second radiator fan 22b is provided, the unbalanced problem thereby existing central processing unit of solution and internal memory dispel the heat, and then the radiating effect of 22 pairs of these central processing units 211 of raising heat radiation fan module, thereby need not increase extra heat abstractor, so also can reduce cost as radiator fan.
In addition, because the fixing of this wind deflector 23 mainly is to reach by establishing with the card of described internal memory 212, thereby this wind deflector 23 can be with this mainboard module 21 dismounting on machine box for server, so this wind deflector 23 has beneficial effects such as easy for installation, that dismounting is simple in addition.
See also Fig. 2 A and Fig. 2 B again, be respectively three-dimensional exploded view and the stereographic map of another embodiment of radiator structure of the present utility model.The difference of present embodiment and the foregoing description only is that the mainboard module of radiator structure has additional expansion board, remaining design is all roughly the same, therefore the no longer structure and the manner of execution of repeat specification same section, its different place below only is described, and, chat bright hereby for avoiding causing the element of obscuring similar equivalence with components identical symbol mark.
In the present embodiment, the ear seat of the fixed part 232 of this wind deflector 23 for being used for fitting with this mainboard module 21 1 surfaces, particularly, this fixed part 232 is arranged at this wind deflector 23 first ends below, this fixed part 232 has first fixed orifice 2321, and this wind deflector 23 is locked on this mainboard module 21 by the screw 3 that passes this first fixed orifice 2321.
Preferable, the mainboard module 21 of present embodiment more comprises carrier 215 and expansion board 216, this expansion board 216 has at least one second fixed orifice 2161, this carrier 215 has threaded hole 2151 that should second fixed orifice 2161, and this wind deflector 23 is to be locked on this mainboard module 21 by the screw 3 that passes this first fixed orifice 2321, second fixed orifice 2161 and threaded hole 2151 in regular turn.In addition, this carrier 215 has opening 2152 near a side of these heat radiation fan modules 22, and stretch out and extend for the extension 231 of this wind deflector 23 towards the direction of this heat radiation fan module 22 and internal memory 212, but not as limit.
Moreover, this mainboard module 21 more comprises the circuit board 210 ' that is provided with central processing unit 211 and internal memory 212, this circuit board 210 ' also is arranged on this carrier 215, this expansion board 216 is arranged at 22 of this circuit board 210 ' and this heat radiation fan modules, to be easy to electrically connecting this circuit board 210 ' and this heat radiation fan module 22 respectively.
Shown in Fig. 2 B, in the present embodiment, second end of this wind deflector 23 is arranged near between the two adjacent internal memories 212 of this central processing unit 211, loses with the distinguished and admirable space ease by 212 of described internal memories of the heat radiation that flows to this central processing unit 211 of avoiding this second radiator fan 22b to be produced.So, 212 of internal memories that are close to this central processing unit 211 can form a guide surface with this wind deflector 23, and are distinguished and admirable to this central processing unit 211 and radiating fin 213 thereof with the part heat radiation that guides this second radiator fan 22b to be produced.As above as can be known, this wind deflector 23 is to be arranged in the mode that internal memory 212, an end be locked in expansion board 216 by an end to be fixed on this mainboard module 21, thereby need not additionally to go up perforate at this circuit board 210 ', and this wind deflector 23 can be with this mainboard module 21 dismounting on machine box for server, event has easy for installation, and dismounting simply waits beneficial effect.
In addition, this mainboard module 21 more comprises a plurality of memory banks 214 that are used to plug described internal memory 212, and described memory bank 214 has certain structure intensity, be arranged in for bottom between two neighbors of described memory bank 214, thereby this wind deflector 23 is fixed on this mainboard module 21 these wind deflector 23 second ends.The bottom of this wind deflector 23 has the portion of dodging 233, produces with the electronic component of avoiding being laid on this wind deflector 23 and this mainboard module 21 and interferes, and increase the difficulty of installing, even cause this mainboard module 21 non-essential damages.
Therefore, the wind deflector 23 of present embodiment fixedly be to pass through the expansion board 216 of being added and this circuit board 210 ' to go up original internal memory 212 and reach, therefore can not take the space that this circuit board 210 ' is gone up circuit layout, know clearly it, this circuit board 210 ' need not headspace and fixes this wind deflector 23, thereby the elasticity of this circuit board 210 ' circuit layout that is increased.
Radiator structure of the present utility model comprises heat radiation fan module, mainboard module and wind deflector.This wind deflector one end is arranged between two neighbors in the described internal memory, the other end is fixed on this mainboard module, thereby this wind deflector is fixed on this mainboard module, and extend to the close position of this heat radiation fan module towards described internal memory and the direction that deviates from this central processing unit, distinguished and admirable with the major part heat radiation that guides this heat radiation fan module to be produced to this central processing unit, so that this central processing unit is dispelled the heat, thereby improve the radiating effect of this central processing unit, to solve prior art central processing unit and the internal memory unbalanced problem of dispelling the heat.
The foregoing description is illustrative principle of the present utility model and effect thereof only, but not is used to limit the utility model.Any those skilled in the art all can be under spirit of the present utility model and category, and the foregoing description is modified and changed.Therefore, rights protection scope of the present utility model should be foundation with the scope of claims.
Claims (9)
1. a radiator structure is characterized in that, comprising:
Heat radiation fan module has first radiator fan arranged side by side and second radiator fan;
Mainboard module, have at least one central processing unit arranged side by side and a plurality of internal memory, the air-flow that this first radiator fan produces flows towards this central processing unit, the air-flow that this second radiator fan produces flows towards described internal memory, and the direction that is provided with of described internal memory is parallel to the airflow direction that this first and second radiator fan produces; And
Wind deflector, have the first relative end and second end, this first end has the fixed part that is used for fixing this mainboard module, this second end is arranged between two neighbors in the described internal memory, this first end has more extension, extend to the close position of this second radiator fan towards described internal memory and the direction that deviates from this central processing unit, distinguished and admirable with the part heat radiation that guides this second radiator fan to be produced to this central processing unit.
2. radiator structure according to claim 1, it is characterized in that, the fixed part of this wind deflector is to be used to fit the ear seat of this mainboard module, be arranged at the bottom of first end of this wind deflector, this ear seat has first fixed orifice, and this wind deflector is to be locked on this mainboard module by the screw that passes this first fixed orifice.
3. radiator structure according to claim 2, it is characterized in that, this mainboard module more comprises a carrier and a circuit board, this circuit board has second fixed orifice, this carrier be to should having threaded hole by second fixed orifice, and in order to this circuit board is fixed to this carrier, this of this wind deflector first fixed orifice is to should second fixed orifice, this screw wears this first fixed orifice, this second fixed orifice and this threaded hole in order, and this wind deflector is locked on this mainboard module.
4. radiator structure according to claim 3 is characterized in that, this mainboard module more comprises a mainboard and an expansion board, and this central processing unit and described memory setting are on this mainboard, and this circuit board of this wind deflector that locks is this expansion board.
5. radiator structure according to claim 4 is characterized in that, this mainboard and this expansion board all are installed on this carrier, and this expansion board is arranged between this mainboard and the described fan.
6. radiator structure according to claim 3 is characterized in that this mainboard module more comprises a mainboard, and this circuit board is this mainboard.
7. radiator structure according to claim 1, it is characterized in that, second end of this wind deflector is arranged near between the two adjacent internal memories of this central processing unit, and the internal memory and this wind deflector that are close to this central processing unit form guide surface, and be distinguished and admirable to this central processing unit with the part heat radiation that guides this second radiator fan to be produced.
8. radiator structure according to claim 1 is characterized in that, this mainboard module more comprises a plurality of memory banks that are used to plug described internal memory, and the bottom of this wind deflector second end is arranged between two neighbors of described memory bank.
9. radiator structure according to claim 1 is characterized in that the bottom of this wind deflector has the portion of dodging, and produces with the electronic component of avoiding being laid on this wind deflector and this mainboard module and interferes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202818835U CN201845289U (en) | 2010-07-30 | 2010-07-30 | Radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202818835U CN201845289U (en) | 2010-07-30 | 2010-07-30 | Radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201845289U true CN201845289U (en) | 2011-05-25 |
Family
ID=44040176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202818835U Expired - Fee Related CN201845289U (en) | 2010-07-30 | 2010-07-30 | Radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201845289U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025121A (en) * | 2011-09-23 | 2013-04-03 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN103547119A (en) * | 2012-07-12 | 2014-01-29 | 富士通株式会社 | Electronic device and airflow adjustment member |
| CN103777719A (en) * | 2012-10-22 | 2014-05-07 | 英业达科技有限公司 | Circuit board module and electronic device |
| CN107589811A (en) * | 2017-09-15 | 2018-01-16 | 郑州云海信息技术有限公司 | A kind of storage server of adjustable mainboard upper and lower ventilation |
| CN113576274A (en) * | 2021-07-23 | 2021-11-02 | 广东美的厨房电器制造有限公司 | Door body and cooking device |
-
2010
- 2010-07-30 CN CN2010202818835U patent/CN201845289U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025121A (en) * | 2011-09-23 | 2013-04-03 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN103547119A (en) * | 2012-07-12 | 2014-01-29 | 富士通株式会社 | Electronic device and airflow adjustment member |
| CN103777719A (en) * | 2012-10-22 | 2014-05-07 | 英业达科技有限公司 | Circuit board module and electronic device |
| CN107589811A (en) * | 2017-09-15 | 2018-01-16 | 郑州云海信息技术有限公司 | A kind of storage server of adjustable mainboard upper and lower ventilation |
| CN113576274A (en) * | 2021-07-23 | 2021-11-02 | 广东美的厨房电器制造有限公司 | Door body and cooking device |
| CN113576274B (en) * | 2021-07-23 | 2023-08-18 | 广东美的厨房电器制造有限公司 | Door body and cooking device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110525 Termination date: 20140730 |
|
| EXPY | Termination of patent right or utility model |