CN201821325U - SMD crystal resonator wafer with composite coating films - Google Patents

SMD crystal resonator wafer with composite coating films Download PDF

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Publication number
CN201821325U
CN201821325U CN2010205480657U CN201020548065U CN201821325U CN 201821325 U CN201821325 U CN 201821325U CN 2010205480657 U CN2010205480657 U CN 2010205480657U CN 201020548065 U CN201020548065 U CN 201020548065U CN 201821325 U CN201821325 U CN 201821325U
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CN
China
Prior art keywords
wafer
crystal resonator
silver
coating
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010205480657U
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Chinese (zh)
Inventor
吴成秀
吴亚华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TONGLING FENGHUA ELECTRONICS CO Ltd
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TONGLING FENGHUA ELECTRONICS CO Ltd
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Priority to CN2010205480657U priority Critical patent/CN201821325U/en
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Publication of CN201821325U publication Critical patent/CN201821325U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to an SMD crystal resonator wafer with composite coating films, wherein coating film electrodes are arranged on upper and lower surfaces of a wafer, and each coating film electrode comprises a Cr coating base layer formed through coating metal Cr on the surface of the wafer and a silver coating surface layer formed through coating metal silver on the surface of the base layer. The SMD crystal resonator wafer has the characteristics of strong adhering force of the silver layer and high reliability of the crystal resonator.

Description

A kind of SMD crystal resonator wafer of composite film coating
Technical field
The utility model relates to a kind of SMD crystal resonator wafer of composite film coating.
Background technology
SMD crystal resonator manufacturing firm to the processing and film plating method of wafer is: the wafer part surface is plated the electrode (area of this electrode less than wafer surface long-pending) of one deck silver as wafer, strengthen electric conductivity, make crystal under effect of electric field, form inverse piezoelectric effect.But because silver and quartzy wafer conjugation are not fine, particularly under the bigger situation of air humidity during plated film, silver layer adhesive force can sharply reduce, and comes off in heating or vibration back generation silver layer.The crystal resonator that the silver layer obscission is arranged, resistance value raises, and corresponding power consumption increases, even causes the phenomenon of not " starting of oscillation " or job insecurity.
Summary of the invention
The purpose of this utility model provides a kind of SMD crystal resonator wafer of composite film coating, can improve the adhesive force of silver layer, improves the crystal resonator reliability.
The utility model is achieved in that the upper and lower surface of wafer is provided with coated electrode, and described coated electrode constitutes by the plating Cr basic unit that forms at wafer surface plating Cr with on the silver-plated top layer that substrate surface plating silver forms.
Because Metal Cr strong adhesion on wafer, and silver-plated top layer is to be plated on the Cr layer rather than directly to be plated on the quartzy wafer, so adhesive force is strengthened greatly.The fundamental method of check silver layer adhesive force is to use 3M to tape up and tears behind the wafer, and whether open has silver layer to be shed on the adhesive tape.Use the wafer of composite film coating, use the 3M adhesive tape to detect and find no desilverization phenomenon.
Though plating Cr can increase silver layer adhesive force,, can cause the resistance of crystal resonator to increase if the Cr layer is blocked up.The inventor found through experiments, and the thickness of plating Cr basic unit is when 6.0 ~ 6.5nm Cr, and the product resistance change only in 2 Ω, can not make the resistance value of crystal resonator raise.
As shown from the above technical solution, the silver-plated top layer of the utility model attached on the wafer, can strengthen the adhesive force of silver layer by plating Cr basic unit, can improve the crystal resonator reliability.
Description of drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is the vertical view of Fig. 1.
Embodiment
As depicted in figs. 1 and 2, the utility model wafer 1 usefulness automatic sputtering film coating mode forms coated electrode 2 on the upper and lower surface of wafer, coated electrode 2 constitutes by the plating Cr basic unit 21 that forms at wafer 1 plating metal on surface Cr with on the silver-plated top layer 22 that basic unit's 21 plating metal on surface silver forms, and the thickness that wherein plates Cr basic unit 21 is 6.0 ~ 6.5nm.

Claims (2)

1. the SMD crystal resonator wafer of a composite film coating, the upper and lower surface of wafer (1) is provided with coated electrode (2), it is characterized in that: described coated electrode (2) constitutes by the plating Cr basic unit (21) that forms at wafer (1) plating metal on surface Cr with on the silver-plated top layer (22) that basic unit (21) plating metal on surface silver forms.
2. the SMD crystal resonator wafer of composite film coating according to claim 1 is characterized in that: the thickness of plating Cr basic unit (21) is 6.0 ~ 6.5nm.
CN2010205480657U 2010-09-29 2010-09-29 SMD crystal resonator wafer with composite coating films Expired - Fee Related CN201821325U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010205480657U CN201821325U (en) 2010-09-29 2010-09-29 SMD crystal resonator wafer with composite coating films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010205480657U CN201821325U (en) 2010-09-29 2010-09-29 SMD crystal resonator wafer with composite coating films

Publications (1)

Publication Number Publication Date
CN201821325U true CN201821325U (en) 2011-05-04

Family

ID=43919267

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010205480657U Expired - Fee Related CN201821325U (en) 2010-09-29 2010-09-29 SMD crystal resonator wafer with composite coating films

Country Status (1)

Country Link
CN (1) CN201821325U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102868382A (en) * 2012-09-21 2013-01-09 成都晶宝时频技术股份有限公司 Coating electrode of SMD (surface mounted device) quartz-crystal resonator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102868382A (en) * 2012-09-21 2013-01-09 成都晶宝时频技术股份有限公司 Coating electrode of SMD (surface mounted device) quartz-crystal resonator
CN102868382B (en) * 2012-09-21 2015-05-27 成都晶宝时频技术股份有限公司 Coating electrode of SMD (surface mounted device) quartz-crystal resonator

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110504

Termination date: 20150929

EXPY Termination of patent right or utility model