CN207820305U - A kind of softening bilayer flexible circuit board - Google Patents
A kind of softening bilayer flexible circuit board Download PDFInfo
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- CN207820305U CN207820305U CN201721844401.0U CN201721844401U CN207820305U CN 207820305 U CN207820305 U CN 207820305U CN 201721844401 U CN201721844401 U CN 201721844401U CN 207820305 U CN207820305 U CN 207820305U
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- circuit board
- circuit
- softening
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Abstract
A kind of softening bilayer flexible circuit board, including the upper layer circuit board (1) being connected and lower circuit plate (3), the upper layer circuit board (1) includes the upper layer cover film (11) for being bonded setting from top to down, overlying adhesive (12), upper layer circuit coating (13), upper layer circuit layer (14) and upper layer base material (15), the lower circuit plate (3) includes the lower layer's base material (31) for being bonded setting from top to down, lower layer's line layer (32), lower sandwich circuit coating (33), lower layer's adhesive (34) and lower layer's cover film (35).The beneficial effects of the utility model are：Meet the demand of the further softening of the double-deck flexible circuit board so that product quality is more preferable.
Description
Technical field
The utility model is related to technical field of touch control, more particularly to a kind of softening bilayer flexible circuit board.
Background technology
With the development of technology, for flexible circuit board extensively using electronic product, product demand is also in diversified development, part
Product at work, needs flexible circuit board processing curved type state repeatedly, and the flexible circuit board that current techniques are provided is at this
Kind state is susceptible to flexible circuit board stress fatigue and open circuit, fracture occurs, to cause product failure.
The prior art as shown in Fig. 2, including set gradually from top to bottom upper layer cover film a1, overlying adhesive a2, on
Sandwich circuit coating a3, upper layer circuit layer a4, base material a5, lower layer line layer a6, lower sandwich circuit coating a7, lower layer adhesive a8 and under
Layer cover film a9.
Invention content
The purpose of this utility model be solve the deficiencies in the prior art, provide it is a kind of meet further softening, improve bending resistance
Roll over the Double-layer flexible circuit board of performance requirement.
The technical scheme in the invention for solving the above technical problem is：A kind of softening bilayer flexible circuit board, it is described
Softening bilayer flexible circuit board is equipped with bent area, the softening bilayer flexible circuit board include the upper layer circuit board that is connected and
Lower circuit plate is provided with gap, the upper layer on the bent area between the upper layer circuit board and lower circuit plate
It is provided with middle level adhesive between circuit board and lower circuit plate, the upper layer circuit board includes be bonded setting from top to down upper
Layer cover film, overlying adhesive, upper layer circuit coating, upper layer circuit layer and upper layer base material, the lower circuit plate include from upper
It is bonded lower layer's base material, lower layer's line layer, lower sandwich circuit coating, lower layer's adhesive and the lower layer's cover film of setting down, in described
Layer adhesive, upper layer circuit coating do not overlap with lower sandwich circuit coating with the bent area.
In some embodiments, the bent area is located among the softening bilayer flexible circuit board, the upper layer circuit
Coating, middle level adhesive, lower sandwich circuit coating are divided into about the symmetrical two parts in the bent area.
In some embodiments, the gap is formed between middle level adhesive described in two parts.
In some embodiments, it is located at the upper layer cover film at the bent area to bond with the upper layer circuit layer,
Lower layer's cover film is bonded with lower layer's line layer.
The beneficial effects of the utility model are：By the highest upper layer circuit coating of hardness in flexible circuit board and upper layer line
Road floor is reduced to one floor of upper layer circuit floor, and lower sandwich circuit coating and lower layer's line layer are reduced to one layer of lower layer's line layer, reduces
Flexible PCB is divided into upper layer circuit board and lower circuit plate two layers, has disperseed stress by the hardness of material.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the utility model prior art construction schematic diagram；
In figure, 1, upper layer circuit board；2, adhesive layer；3, lower circuit plate；4, bent area；5, gap；11, upper layer covers
Film；12, overlying adhesive；13, upper layer circuit coating；14, upper layer circuit layer；15, upper layer base material；31, lower layer's base material；32, under
Sandwich circuit layer；33, lower sandwich circuit coating；34, lower layer's adhesive；35, lower layer's cover film.
Specific implementation mode
The utility model is described further with reference to the accompanying drawings and examples.
In Fig. 1, a kind of softening bilayer flexible circuit board, the softening bilayer flexible circuit board is equipped with bent area 4, soft
It includes the upper layer circuit board 1 being connected and lower circuit plate 3 to change the double-deck flexible circuit board, is located at upper layer circuit board on bent area 4
It is provided with gap 5 between 1 and lower circuit plate 3, middle level adhesive 2 is provided between upper layer circuit board 1 and lower circuit plate 3,
Upper layer circuit board 1 include be bonded from top to down the upper layer cover film 11 of setting, overlying adhesive 12, upper layer circuit coating 13, on
Sandwich circuit layer 14 and upper layer base material 15, lower circuit plate 3 include lower layer's base material 31, the lower layer's line layer for being bonded setting from top to down
32, lower sandwich circuit coating 33, lower layer's adhesive 34 and lower layer's cover film 35, middle level adhesive 2, upper layer circuit coating 13 and lower layer
Circuit coating 33 does not overlap with bent area 4.
Specifically, bent area 4 is located among the softening bilayer flexible circuit board, upper layer circuit coating 13, middle level bonding
Agent 2, lower sandwich circuit coating 33 are divided into about 4 symmetrical two parts of bent area, are formed between middle level adhesive 2 described in two parts
Gap 5.
Upper layer cover film 11 at bent area 4 is bonded with upper layer circuit layer 14, lower layer's cover film 35 and lower sandwich circuit
Layer 32 bonds.
Particularly, the material of upper layer cover film 11, upper layer base material 15, lower layer's base material 31 and lower layer's cover film 35 is thickness
The flexibility characteristics of the PI of 12.5um, PI are conducive to around folding, and relatively thin thickness is also beneficial to be promoted product around folding endurance energy.Upper layer line
Road floor 14 and 32 material of lower layer's line layer are the calendering copper of thickness 12um, calendering copper feature make its be not easy in the case that around folding by
Damage, and it is relatively low around folding resistance, relatively thin thickness is also beneficial to be promoted product around folding endurance energy.
Only the most preferred embodiment of the utility model is described above, but is not to be construed as the limit to claim
System.The utility model is not only limited to above example, and concrete structure is allowed to vary.It is all in the utility model independent right
It is required that protection domain in made by various change in scope of protection of the utility model.
Claims (4)
1. a kind of softening bilayer flexible circuit board, it is characterised in that：The softening bilayer flexible circuit board is equipped with bent area
(4), the softening bilayer flexible circuit board includes the upper layer circuit board (1) being connected and lower circuit plate (3), the bent area
(4) gap (5), the upper layer circuit board (1) are provided between the upper layer circuit board (1) and lower circuit plate (3)
Middle level adhesive (2) is provided between lower circuit plate (3), the upper layer circuit board (1) includes fitting setting from top to down
Upper layer cover film (11), overlying adhesive (12), upper layer circuit coating (13), upper layer circuit layer (14) and upper layer base material
(15), the lower circuit plate (3) includes the lower layer's base material (31), lower layer's line layer (32), lower layer for being bonded setting from top to down
Circuit coating (33), lower layer's adhesive (34) and lower layer's cover film (35), the middle level adhesive (2), upper layer circuit coating
(13) it is not overlapped with the bent area (4) with lower sandwich circuit coating (33).
2. softening bilayer flexible circuit board according to claim 1, it is characterised in that：The bent area (4) is located at described soft
Change among the double-deck flexible circuit board, the upper layer circuit coating (13), middle level adhesive (2), lower sandwich circuit coating (33) are divided equally
For about the bent area (4) symmetrical two parts.
3. softening bilayer flexible circuit board according to claim 2, it is characterised in that：Middle level adhesive (2) described in two parts
Between form the gap (5).
4. softening bilayer flexible circuit board according to claim 1, it is characterised in that：Institute at the bent area (4)
It states upper layer cover film (11) to bond with the upper layer circuit layer (14), lower layer's cover film (35) and lower layer's line layer
(32) it bonds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721844401.0U CN207820305U (en) | 2017-12-26 | 2017-12-26 | A kind of softening bilayer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721844401.0U CN207820305U (en) | 2017-12-26 | 2017-12-26 | A kind of softening bilayer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207820305U true CN207820305U (en) | 2018-09-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721844401.0U Active CN207820305U (en) | 2017-12-26 | 2017-12-26 | A kind of softening bilayer flexible circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN207820305U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135076A (en) * | 2017-12-26 | 2018-06-08 | 江西合力泰科技有限公司 | A kind of softening bilayer flexible circuit board |
-
2017
- 2017-12-26 CN CN201721844401.0U patent/CN207820305U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135076A (en) * | 2017-12-26 | 2018-06-08 | 江西合力泰科技有限公司 | A kind of softening bilayer flexible circuit board |
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