CN201812814U - 一种用于防止二极管芯片漂移的整流器 - Google Patents

一种用于防止二极管芯片漂移的整流器 Download PDF

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CN201812814U
CN201812814U CN2010202717209U CN201020271720U CN201812814U CN 201812814 U CN201812814 U CN 201812814U CN 2010202717209 U CN2010202717209 U CN 2010202717209U CN 201020271720 U CN201020271720 U CN 201020271720U CN 201812814 U CN201812814 U CN 201812814U
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diode chip
lead frame
rectifier
groove
backlight unit
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张雄杰
何洪运
姜旭波
程琳
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Suzhou Good Ark Electronics Co Ltd
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Abstract

一种用于防止二极管芯片漂移的整流器，该整流器的环氧封装体内部由连接片、引线框、二极管芯片组成，该引线框的焊接区与所述二极管芯片之间通过焊锡膏连接；所述引线框的焊接区上表面设有凹槽，该凹槽区域大于所述二极管芯片，所述焊锡膏位于该凹槽内，所述二极管芯片位于所述凹槽内并通过所述焊锡膏与引线框的焊接区连接。该整流器可防止焊接过程中焊锡融融状态时二极管芯片的漂移问题，并可对二极管芯片限位。

Description

一种用于防止二极管芯片漂移的整流器 
技术领域
本实用新型涉及一种整流器，尤其涉及一种用于防止二极管芯片漂移的整流器。 
背景技术
整流器是利用二极管的单向导电特性对交流电进行整流，故被广泛应用于交流电转换成直流电的电路中。现有整流器二极管晶粒的引线框的焊接区域常见结构为平面结构。引线框的焊接区域涂点焊锡膏，放上二极管晶粒之后，在入炉焊接过程中锡膏处于融融状态，焊接后二极管晶粒的位置偏移难以准确控制。因此如何解决现有锡膏焊接过程中二极管晶粒漂移的问题，是本实用新型研究的问题。 
发明内容
本实用新型提供一种用于防止二极管芯片漂移的整流器，该整流器可防止焊接过程中焊锡融融状态时二极管芯片的漂移问题，并可对二极管芯片限位。 
为达到上述目的，本实用新型采用的技术方案是： 
一种用于防止二极管芯片漂移的整流器，该整流器的环氧封装体内部由连接片、引线框、二极管芯片组成，该引线框的焊接区与所述二极管芯片之间通过焊锡膏连接；所述引线框的焊接区上表面设有凹槽，该凹槽区域大于所述二极管芯片，所述焊锡膏位于该凹槽内，所述二极管芯片位于所述凹槽内并通过所述焊锡膏与引线框的焊接区连接。 
由于上述技术方案运用，本实用新型与现有技术相比具有下列优点： 
本实用新型是一种用于防止二极管芯片漂移的整流器，该整流器引线框的焊接区凹槽边缘四周设计有防护墙，引线框的焊接区凹槽尺寸略大于二极管芯片尺寸，从而可利用凹槽对芯片和锡膏限位。焊接过程中锡膏和二极管芯片受到保护墙的约束，可显著减少芯片焊接的偏移量。 
附图说明
附图1为现有引线框结构； 
附图2为本实用性新型整流器结构示意图； 
附图3为本实用性新型引线框结构示意图。 
以上附图中：1、连接片；2、引线框；3、二极管芯片；4、焊接区；5、焊锡膏；6、电流传输端；7、凹槽。 
具体实施方式
下面结合附图及实施例对本实用新型作进一步描述： 
实施例：一种用于防止二极管芯片漂移的整流器， 
该整流器的环氧封装体内部主要由连接片1、引线框2、二极管芯片3组成，该引线框2一端的焊接区4与所述二极管芯片3之间通过焊锡膏5连接，该引线框2另一端是作为所述整流器的电流传输端6；其特征在于：所述引线框2的焊接区4上表面设有凹槽7，该凹槽7区域大于所述二极管芯片3，所述焊锡膏5位于该凹槽7内，所述二极管芯片3位于所述凹槽7内并通过所述焊锡膏5与引线框2的焊接区连接。 
上述实施例只为说明本实用新型的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本实用新型的内容并据以实施，并不能以此限制本实用新型的保护范围。凡根据本实用新型精神实质所作的等效变化或修饰，都应涵盖在本实用新型的保护范围之内。 

Claims (1)

1.一种用于防止二极管芯片漂移的整流器，该整流器的环氧封装体内部主要由连接片(1)、引线框(2)、二极管芯片(3)组成，该引线框(2)一端的焊接区(4)与所述二极管芯片(3)之间通过焊锡膏(5)连接，该引线框(2)另一端是作为所述整流器的电流传输端(6)；其特征在于：所述引线框(2)的焊接区(4)上表面设有凹槽(7)，该凹槽(7)区域大于所述二极管芯片(3)，所述焊锡膏(5)位于该凹槽(7)内，所述二极管芯片(3)位于所述凹槽(7)内并通过所述焊锡膏(5)与引线框(2)的焊接区连接。 
CN2010202717209U 2010-07-27 2010-07-27 一种用于防止二极管芯片漂移的整流器 Expired - Fee Related CN201812814U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449539A (zh) * 2013-02-01 2017-02-22 苏州固锝电子股份有限公司 防偏位贴片式半导体器件结构
CN106471631A (zh) * 2014-06-18 2017-03-01 Lg伊诺特有限公司 发光器件封装

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449539A (zh) * 2013-02-01 2017-02-22 苏州固锝电子股份有限公司 防偏位贴片式半导体器件结构
CN106449540A (zh) * 2013-02-01 2017-02-22 苏州固锝电子股份有限公司 高可靠性贴片式整流芯片
CN106449538A (zh) * 2013-02-01 2017-02-22 苏州固锝电子股份有限公司 贴片式整流器件结构
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CN106449539B (zh) * 2013-02-01 2019-08-02 苏州固锝电子股份有限公司 防偏位贴片式半导体器件结构
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CN106471631B (zh) * 2014-06-18 2018-12-18 Lg伊诺特有限公司 发光器件封装
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