CN201796874U - 前开式晶片运输盒 - Google Patents
前开式晶片运输盒 Download PDFInfo
- Publication number
- CN201796874U CN201796874U CN2010205060716U CN201020506071U CN201796874U CN 201796874 U CN201796874 U CN 201796874U CN 2010205060716 U CN2010205060716 U CN 2010205060716U CN 201020506071 U CN201020506071 U CN 201020506071U CN 201796874 U CN201796874 U CN 201796874U
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- box body
- wafer
- groove
- transport case
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205060716U CN201796874U (zh) | 2010-08-26 | 2010-08-26 | 前开式晶片运输盒 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010205060716U CN201796874U (zh) | 2010-08-26 | 2010-08-26 | 前开式晶片运输盒 |
Publications (1)
Publication Number | Publication Date |
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CN201796874U true CN201796874U (zh) | 2011-04-13 |
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CN2010205060716U Expired - Fee Related CN201796874U (zh) | 2010-08-26 | 2010-08-26 | 前开式晶片运输盒 |
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CN (1) | CN201796874U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104888551A (zh) * | 2014-03-05 | 2015-09-09 | 耀连科技有限公司 | 隔离式搬运盒的滤膜组件 |
CN112644847A (zh) * | 2019-10-09 | 2021-04-13 | 华邦电子股份有限公司 | 干燥块结构以及存储装置 |
US11651982B2 (en) | 2019-10-11 | 2023-05-16 | Winbond Electronics Corp. | Drying block structure and storage device |
-
2010
- 2010-08-26 CN CN2010205060716U patent/CN201796874U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104888551A (zh) * | 2014-03-05 | 2015-09-09 | 耀连科技有限公司 | 隔离式搬运盒的滤膜组件 |
CN104888551B (zh) * | 2014-03-05 | 2016-08-24 | 耀连科技有限公司 | 隔离式搬运盒的滤膜组件 |
CN112644847A (zh) * | 2019-10-09 | 2021-04-13 | 华邦电子股份有限公司 | 干燥块结构以及存储装置 |
US11651982B2 (en) | 2019-10-11 | 2023-05-16 | Winbond Electronics Corp. | Drying block structure and storage device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130320 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130320 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110413 Termination date: 20180826 |