CN201788998U - Luminous module with high thermal conductivity and light guiding functions and application device thereof - Google Patents
Luminous module with high thermal conductivity and light guiding functions and application device thereof Download PDFInfo
- Publication number
- CN201788998U CN201788998U CN2009202871904U CN200920287190U CN201788998U CN 201788998 U CN201788998 U CN 201788998U CN 2009202871904 U CN2009202871904 U CN 2009202871904U CN 200920287190 U CN200920287190 U CN 200920287190U CN 201788998 U CN201788998 U CN 201788998U
- Authority
- CN
- China
- Prior art keywords
- heat
- illuminating module
- base material
- bonding pads
- chip bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 36
- -1 chip bonding pads Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 37
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000926 separation method Methods 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract 2
- 230000035515 penetration Effects 0.000 abstract 1
- 230000005619 thermoelectricity Effects 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 16
- 239000010410 layer Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000008034 disappearance Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000010068 moulding (rubber) Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The utility model provides a luminous module. The luminous module comprises a substrate and a plurality of luminous wafers arranged on the substrate, as well as a fluorescent bond layer and a protective bond layer which are covered on the luminous wafers, wherein the substrate comprises a base material and a wafer weld pad arranged on the base material and used for bearing the luminous wafers; a plurality of penetration holes penetrate the wafer weld pad and the base materials; and both the fluorescent bond layer and the protective bond layer comprise light guiding structures, so as to guide light rays emitted by the luminous wafers. In the utility model, by virtue of the substrate structure of the luminous module, thermoelectricity separation is achieved, and the radiating effect of the luminous wafers is improved; meanwhile, when the luminous module works, the color stability and light processing capability are promoted.
Description
[technical field]
The utility model relates to a kind of encapsulating structure based on a plurality of LED Chips for Communication, particularly relates to the illuminating module and the application apparatus thereof of high heat conduction of a kind of tool and light-guiding function.
[background technology]
See also Figure 12, it has shown a kind of structural representation of existing illuminating module 10.This illuminating module 10 comprises light emitting diode element (LED Component) 11, Copper Foil 12, insulating heat-conductive glue 14 and aluminium sheet 16.These illuminating module 10 manufacturing process complexity and cost are higher.In addition, the radiating effect of the substrate of being made up of Copper Foil 12, insulating heat-conductive glue 14 and aluminium sheet 16 also has to be hoisted.
Extensive use point rubber moulding formula comes packaging LED wafer (LED Chip) behind a metallic support at present, and again that this is packaged light emitting diode element is welded on a circuit board (PCB) one by one and goes up the formation illuminating module, as LED striation (Light Bar).The colour stability of this type of illuminating module is relatively poor, and also very limited to the disposal ability of light shape.
In addition, at present in the illuminating module manufacture process, after making the LED striation must cut out from female circuit board earlier on making to become finished product, existing circuit layout design just can test.Production efficiency and rate of finished products all have to be hoisted.
So as from the foregoing, the encapsulating structure of present existing illuminating module and light emitting diode element obviously has inconvenience and exists with disappearance, remains to be improved.
So, can the improving of the above-mentioned disappearance of the present utility model people's thoughts, and according to the correlation experience of being engaged in for many years in this respect, the concentrated observation and research, and cooperate the utilization of scientific principle, and propose reasonable in design and effectively improve the utility model of above-mentioned disappearance.
[utility model content]
Technical problem to be solved in the utility model, be to provide a kind of light-emitting component, circuit substrate, illuminating module, light-emitting device and display unit, its substrate has the radiating effect of improvement, and the structure of colloid layer and layout can promote the colour stability of light-emitting component, circuit substrate, illuminating module, light-emitting device and display unit, in addition, can realize that also product can check badly in manufacture process, needn't wait until that finished product just checks, reduce cost in order to improving yield.
For solving the problems of the technologies described above, according to the utility model one preferential embodiment, provide a kind of circuit substrate, be used to install luminescent wafer, comprise base material, chip bonding pads, lead weld pad and heat-conducting layer.This base material is formed with first and relative with this first second, on this first, be provided with positive conductive traces and negative pole conductive traces, this chip bonding pads and lead weld pad are located on this first, this chip bonding pads is used to lay this luminescent wafer, this lead weld pad is used for this luminescent wafer and this positive conductive traces and the electric connection of negative pole conductive traces, this heat-conducting layer is located at this second, wherein, runs through this chip bonding pads, this base material and this heat-conducting layer and is formed with a plurality of perforation.
Wherein, the hole of this perforation can be filled conduction material, such as the paste that contains containing metal heat conduction molecules such as silver paste, copper cream with the reinforced heat conduction effect.Certainly, the hole of this perforation also can keep the not occupied state of hollow.
Wherein, have electroplated lead to form lead weld pad or the metal pad on this first on this second, remove by etching again after weld pad forms.
The utility model also provides the illuminating module that comprises the foregoing circuit substrate.This illuminating module comprises the luminescent wafer with positive terminal and negative pole end.
The utility model also provides light-emitting device and the display unit that comprises the foregoing circuit substrate.
Therefore, in when work, can realize thermoelectric the separation according to circuit substrate of the present utility model, promptly the connecting circuit between each LED and LED be at the circuit substrate coplanar, circuit substrate in addition one side then for the metallic film reception LED heat that louvre spread out of as heat radiation.In addition, in when work, can promote the stability of color and according to illuminating module of the present utility model to the disposal ability of light shape.Simultaneously, in the process of making according to illuminating module of the present utility model, because the electroplated lead on second of the substrate is removed by etching, realized that luminescent wafer can test behind bonding wire on the substrate (Wire Bond).Solve product and in manufacture process, can check bad mode, needn't wait until that finished product just checks, improved yield and reduced cost.
In order further to understand the utility model is to reach technology, means and the effect that predetermined purpose is taked, see also following about detailed description of the present utility model and accompanying drawing, believe the purpose of this utility model, feature and characteristics, go deep into and concrete understanding when getting one thus, yet appended graphic reference and the explanation usefulness of only providing not is to be used for the utility model is limited.
[description of drawings]
Can more specifically describe the utility model by example with reference to the accompanying drawings, wherein accompanying drawing is not proportionally drawn, in the accompanying drawings:
Fig. 1 is the Facad structure schematic diagram according to first embodiment of illuminating module of the present utility model;
Fig. 2 is the schematic diagram of the structure of illuminating module shown in Figure 1;
Fig. 3 is the schematic perspective view of illuminating module shown in Figure 1;
Fig. 4 is another schematic perspective view of illuminating module shown in Figure 1;
Fig. 5 is the side schematic view of illuminating module shown in Figure 1;
Fig. 6 is the Facad structure schematic diagram according to second embodiment of illuminating module of the present utility model;
Fig. 7 is the schematic diagram of the structure of illuminating module shown in Figure 6;
Fig. 8 is a kind of front view of arranged array of tool electroplated lead illuminating module;
Fig. 9 is the rear view of arranged array shown in Figure 8;
Figure 10 a is the structural representation according to the 3rd embodiment of illuminating module of the present utility model;
Figure 10 b is the brightness-angular relationship schematic diagram of the colloid lens outward appearance of illuminating module shown in Figure 10 a when being cloudy surface;
Brightness-angular relationship schematic diagram when Figure 10 c is the colloid lens appearance transparent of illuminating module shown in Figure 10 a;
Figure 11 a to Figure 11 h is respectively the structural representation according to the 4th to the 11 embodiment of illuminating module of the present utility model; And
Figure 12 has shown a kind of structural representation of existing illuminating module 10.
[embodiment]
Please in the lump referring to figs. 1 to Fig. 5, it has shown the different views of first embodiment of illuminating module 100 of the present utility model respectively.This illuminating module comprises a plurality of luminescent wafers 110 and electrically-conductive backing plate.Electrically-conductive backing plate comprises base material 180, chip bonding pads 160, lead weld pad 170 and heat-conducting layer 150.
Be formed with first (be front shown among Fig. 1, do not indicate) and second (be in Fig. 2 shown back side, do not indicate) relative on the base material 180, on first, be provided with conductive traces 182,186 with first.Wherein conductive traces 182 is a positive conductive traces, and conductive traces 186 is the negative pole conductive traces.Certainly, the both positive and negative polarity of above-mentioned conductive traces can be adjusted as required, or combines with this chip bonding pads 160, to meet the restriction of dissimilar luminescent wafers, as both positive and negative polarity coplanar or non-coplanar luminescent wafer.
In the present embodiment, base material 180 can adopt the existing material of those skilled in the art.And chip bonding pads 160 is made by the material of good heat conductivity with heat-conducting layer 150.Because the interconnect function of perforation 162, the heat that produces in luminescent wafer 110 work can pass to the back of substrate via perforation 162, and distributes by heat-conducting layer 150.Therefore, the illuminating module and the electrically-conductive backing plate of present embodiment have good performance of heat dissipation, simultaneously because substrate edges is jagged, the illuminating module of present embodiment can directly be locked or chimeric mode with screw, see through this breach with the illuminating module secure bond of present embodiment in light-emitting device or display unit, and the heat on this module is conducted on this device and better radiating effect is arranged from this heat-conducting layer.
See also Fig. 6 and Fig. 7, shown structural representation according to second embodiment of illuminating module 200 of the present utility model.Illuminating module 100 structures of the illuminating module 200 of present embodiment and first embodiment are basic identical, comprise luminescent wafer 210, chip bonding pads 260, base material 280 and a plurality of perforation 262 equally.Different is that the hole of the perforation 262 of the illuminating module 200 of present embodiment is filled with conduction material, such as the paste that contains containing metal heat conduction molecules such as silver paste, copper cream (show with dark color among the figure, do not indicate).The conduction material of this filling helps further to promote the heat dispersion of electrically-conductive backing plate and illuminating module.
Please refer to Fig. 8 and Fig. 9, shown a kind of schematic diagram of arranged array of illuminating module 300.What Fig. 8 showed is the Facad structure of arranged array, and it comprises a plurality of luminescent wafers 310 and a plurality of lead weld pad 370.What Fig. 9 showed is the structure of arranged array, and it comprises a plurality of heat-conducting layers 350.Along an electroplated lead 380 (extending along the H direction shown in Fig. 8 and Fig. 9) is arranged between per two heat-conducting layers 350 of the L direction shown in Fig. 8 and Fig. 9.The position that has shown electroplated lead 380 among Fig. 8 with dotted line, wherein electroplated lead 380 is connected with lead weld pad 370 by the through hole (figure does not show) that passes substrate.The effect of electroplated lead 380 is to be convenient to the generation of lead weld pad 370 on substrate.In case after lead weld pad 370 generated, electroplated lead 380 was promptly ineffective.But because electroplated lead 380 is connected with lead weld pad 370 always, the LED striation just can be tested after must cutting out from female circuit board earlier on making and becoming finished product.In addition, the electroplated lead part must be done insulation with anti-welding lacquer and handle, and has increased the uncertainty of heat radiation.In order to address this problem, this paper has proposed simultaneously by carry out the scheme that second etch electroplated lead 380 removes electroplated lead 380 with etching mode in manufacture process.Because substrate lives through etch processes one time in earlier stage in manufacture process, so follow-up etching is called second etch.Can be implemented in like this and can check product bad in the manufacture process, needn't wait until that finished product just checks.
Figure 10 a has shown the structural representation according to the 3rd embodiment of illuminating module 400 of the present utility model.This illuminating module 400 comprises luminescent wafer 410, substrate 480 and protection glue-line 420.This luminescent wafer 410 has positive terminal and negative pole end and is located on this substrate 480; this protection glue-line 420 places on this luminescent wafer 410; this protection glue-line 420 comprises a light guide structure; with the protection glue-line 420 of incorporate formation one tool optical lens function, the light that guides this luminescent wafer 410 to send.
According to different use needs, the light guide structure of protection glue-line 420 can be a kind of in optical focus structure, cloudy surface structure and the planar structure.Figure 10 b has promptly shown the brightness-angular relationship schematic diagram of this illuminating module 400 when the light guide structure outward appearance is cloudy surface.This cloudy surface structure can protect glue-line 420 surface roughenings to realize by this, also can realize by interpolation impurity such as materials such as titanium dioxide or phosphor powder in colloid, or seeing through selection part printing opacity colloidal materials realizes.When the light guide structure rising angle reached 180 °, these luminescent wafer 410 emitted lights were used so this cloudy surface formula lens arrangement is applicable to illumination through producing the illuminating effect of wide area after the guiding of light guide structure.Figure 10 c has then shown when light guide structure is transparent optical focus structure, the brightness of this illuminating module 400-angular relationship schematic diagram.This optical focus structure can wait and realize for various lens arrangements such as convex lens, concave-convex lens or lens post (rod lens) by moulding this protection glue-line 420; when the light guide structure rising angle reaches 63 °; this luminescent wafer 410 emitted lights be through can producing the illuminating effect of focusing after guiding of light guide structure, the display light source of display unit that module becomes so this lens arrangement is suitable for (Backlight) backlight.
Please in the lump with reference to figure 11a to Figure 11 h, it has shown the structural representation according to the 4th to the 11 embodiment of illuminating module of the present utility model respectively.Wherein, the shown illuminating module of Figure 11 a, Figure 11 b, Figure 11 e, Figure 11 g and Figure 11 h has covered the fluorescent glue-line of different integral structures and varying number respectively on luminescent wafer.Such as, the fluorescent glue-line 520 shown in Figure 11 b has the sawtooth pattern light guide structure; Fluorescent glue-line 720 shown in Figure 11 e has the plane light guide structure.Fluorescent glue-line 920 shown in Figure 11 g is a plurality of, and these a plurality of fluorescent glue-lines 920 place on each luminescent wafer 910 respectively.Fluorescent glue-line 920 ' shown in Figure 11 h is single, and this single fluorescent glue-line 920 ' places on a plurality of luminescent wafers 910 '.
The shown illuminating module difference on luminescent wafer of Figure 11 c, Figure 11 d and Figure 11 f has covered fluorescent glue-line and protection glue-line simultaneously.Wherein, the protection glue 630 shown in Figure 11 c places on the fluorescent glue 620, and the light guide structure camber of fluorescent glue 620.Protection glue 630 ' shown in Figure 11 d still places on the fluorescent glue 620 ', and just the light guide structure of fluorescent glue 620 ' becomes plane.Fluorescent glue 820 shown in Figure 11 f places on the protection glue 830, and fluorescent glue 820 all has similar arc light guide structure with protection glue 830.
About the molding mode of fluorescent glue-line, for the illuminating module shown in Figure 11 g, this fluorescent glue-line 920 can place on this luminescent wafer 910 by a glue, spraying or pressing mold.And for the illuminating module shown in Figure 11 h, fluorescent glue-line 920 ' can place on this luminescent wafer 910 ' by a glue, spraying or pressing mold.
Illuminating module of the present utility model at least also comprises following modification.Directly place on a plurality of luminescent wafers by the protection glue-line; and the protection glue-line has the protection glue light guide structure that is similar to fluorescent structural adhesive layer among Figure 11 a, Figure 11 b, Figure 11 e, and also promptly this protection glue-line light guide structure can be optical focus structure, cloudy surface structure or planar structure.The material of protection glue-line can adopt complete printing opacity or part printing opacity.The coating process of protection glue-line comprises pressing mold, some glue or spraying.In addition, no matter be protection glue-line or fluorescent glue-line and the combination of protecting glue-line, all can make the structure of Figure 11 g and Figure 11 h.
Need to prove, more than mainly be that embodiment has introduced the utility model with the illuminating module.Various improvements of the present utility model in fact can be applied among light-emitting component, light-emitting device and the display unit similarly.Such as the illuminating module with heat radiation perforation being applied to light-emitting device such as general lighting light fixture or illuminating lamp tube.Simultaneously, the aforesaid illuminating module of this paper and display screen, control module can be combined into display unit such as LCD display screens or outdoor electronic board.In addition, the circuit substrate with louvre of the present utility model also can be applied in the various semiconductor circuits, is used for promoting the efficient of distributing of semiconductor wafer heat that work produces.
In the above-described embodiments, only the utility model has been carried out exemplary description, but those skilled in the art can carry out various modifications to the utility model after reading present patent application under the situation that does not break away from spirit and scope of the present utility model.
Claims (20)
1. a circuit substrate is used to install luminescent wafer, it is characterized in that, described circuit substrate comprises:
Base material, be formed with first and with described first relative second, on described first, be provided with a conductive traces;
Chip bonding pads and lead weld pad, described chip bonding pads and lead weld pad are located on described first, and described chip bonding pads is used to lay described luminescent wafer, and described lead weld pad is used for described luminescent wafer and described conductive traces are electrically connected;
Heat-conducting layer, described heat-conducting layer are located at described second;
Wherein, base material has a plurality of perforation and connects described chip bonding pads and described heat-conducting layer.
2. circuit substrate according to claim 1 is characterized in that the hole of described perforation is filled media not.
3. circuit substrate according to claim 1 is characterized in that the hole of described perforation is filled with conduction material.
4. circuit substrate according to claim 1 is characterized in that, described second mask has a plurality of heat-conducting layers, between per two heat-conducting layers an electroplated lead is arranged.
5. circuit substrate according to claim 1 is characterized in that, has breach or perforate on the described base material, described circuit substrate is locked or be embedded on the various application apparatus.
6. an illuminating module is characterized in that, described illuminating module comprises:
Luminescent wafer;
Substrate, described substrate comprise base material, chip bonding pads, lead weld pad and heat-conducting layer, wherein,
Described base material be formed with first and with described first relative second, on described first, be provided with a conductive traces;
Described chip bonding pads and lead weld pad are located on described first, and described luminescent wafer is located on the described chip bonding pads, and described lead weld pad electrically connects described luminescent wafer and described conductive traces;
Described heat-conducting layer is located on described second, and wherein, described base material has a plurality of perforation and connects described chip bonding pads and described heat-conducting layer.
7. illuminating module according to claim 6 is characterized in that the hole of described perforation is filled media not.
8. illuminating module according to claim 6 is characterized in that the hole of described perforation is filled with conduction material.
9. illuminating module according to claim 6 is characterized in that, described second mask has a plurality of heat-conducting layers, between per two heat-conducting layers an electroplated lead is arranged.
10. illuminating module according to claim 6 is characterized in that, has breach or perforate on the described base material, described illuminating module is locked or be embedded on the various application apparatus.
11. a light-emitting device is characterized in that described light-emitting device comprises illuminating module according to claim 6.
12. light-emitting device according to claim 11 is characterized in that, the hole of the described perforation of described illuminating module is filled media not.
13. light-emitting device according to claim 11 is characterized in that, the hole of the described perforation of described illuminating module is filled with conduction material.
14. light-emitting device according to claim 11 is characterized in that, described second mask of described illuminating module has a plurality of heat-conducting layers, between per two heat-conducting layers an electroplated lead is arranged.
15. light-emitting device according to claim 11 is characterized in that, has breach or perforate on the described base material of described illuminating module, described substrate is locked or be embedded on the described light-emitting device.
16. a display unit is characterized in that, described display unit comprises:
Luminescent wafer;
Substrate, described substrate comprise base material, chip bonding pads, lead weld pad and heat-conducting layer, wherein,
Described base material be formed with first and with described first relative second, on described first, be provided with a conductive traces;
Described chip bonding pads and lead weld pad are located on described first, and described luminescent wafer is located on the described chip bonding pads, and described lead weld pad electrically connects described luminescent wafer and described conductive traces;
Described heat-conducting layer is located on described second, and wherein, described base material has a plurality of perforation and connects described chip bonding pads and described heat-conducting layer; And
Display screen and control device, the light that described luminescent wafer sends is presented on the described display screen through control device control.
17. display unit according to claim 16 is characterized in that, the hole of described perforation is filled media not.
18. display unit according to claim 16 is characterized in that, the hole of described perforation is filled with conduction material.
19. display unit according to claim 16 is characterized in that, described second mask has a plurality of heat-conducting layers, between per two heat-conducting layers an electroplated lead is arranged.
20. display unit according to claim 19 is characterized in that, has breach or perforate on the described base material, described substrate is locked or be embedded on the described display unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202871904U CN201788998U (en) | 2009-12-30 | 2009-12-30 | Luminous module with high thermal conductivity and light guiding functions and application device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202871904U CN201788998U (en) | 2009-12-30 | 2009-12-30 | Luminous module with high thermal conductivity and light guiding functions and application device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201788998U true CN201788998U (en) | 2011-04-06 |
Family
ID=43820953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202871904U Expired - Fee Related CN201788998U (en) | 2009-12-30 | 2009-12-30 | Luminous module with high thermal conductivity and light guiding functions and application device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201788998U (en) |
-
2009
- 2009-12-30 CN CN2009202871904U patent/CN201788998U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203277485U (en) | Light-emitting device, light-emitting diode chip for forming multi-directional light emission and sapphire substrate thereof | |
| US20170287883A1 (en) | Light-emitting device and method of manufacturing the same | |
| CN102484195B (en) | Luminescent device and use the light unit of this luminescent device | |
| CN101050846A (en) | Method for producing flexible light source and flexible base board and flexible solid state light source | |
| JP2009117788A (en) | Light emitting diode device with heat sink base, and method for manufacturing the same | |
| CN104100849A (en) | LED (Light-Emitting Diode) lamp bulb | |
| CN102691900A (en) | Illumination device and display device | |
| CN101191949A (en) | Backlight module and LCD device | |
| CN201259194Y (en) | LED packaged illumination circuit board of high thermal conductivity | |
| KR20180000816A (en) | LED lighting with free shaped curve filaments | |
| CN201788969U (en) | Light-emitting module with high heat-conduction and light-guiding functions | |
| CN103296184A (en) | Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support | |
| CN101814574A (en) | Light emitting diode base plate heat radiation structure and manufacture method thereof | |
| CN107146543A (en) | LED display assembly | |
| CN201788998U (en) | Luminous module with high thermal conductivity and light guiding functions and application device thereof | |
| CN204240091U (en) | Illumination light source and lighting device | |
| CN201788971U (en) | Light-emitting module group with high heat-conduction and light-guiding function and application device | |
| CN201788970U (en) | Light-emitting module with high heat conducting and light guiding functions and application device | |
| CN101777525A (en) | Luminous module group with high heat conductivity and light conductivity functions and application device | |
| CN101771029A (en) | Light-emitting module with high heat conduction and light guide functions and devices applying same | |
| CN101794764A (en) | Light emitting module with high heat-conducting and light-conducting functions and application device thereof | |
| CN102280555A (en) | Light-emitting diode and manufacturing method thereof | |
| TW201123411A (en) | A light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof | |
| CN101771030A (en) | Light-emitting module with high heat conduction and light guide functions and devices applying same | |
| TW201123412A (en) | A light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110406 Termination date: 20121230 |