CN104100849A - LED (Light-Emitting Diode) lamp bulb - Google Patents
LED (Light-Emitting Diode) lamp bulb Download PDFInfo
- Publication number
- CN104100849A CN104100849A CN201310118212.5A CN201310118212A CN104100849A CN 104100849 A CN104100849 A CN 104100849A CN 201310118212 A CN201310118212 A CN 201310118212A CN 104100849 A CN104100849 A CN 104100849A
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- light
- circuit board
- backlight unit
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses an LED (Light-Emitting Diode) lamp bulb. The LED lamp bulb comprises a circuit board, a light source module, a conductive contact and a lamp cover, wherein the circuit board comprises at least one inserting groove; the light source module is arranged on one side of the circuit board, and comprises a transparent substrate, a circuit layer, an electrode piece and a plurality of LED chips; the circuit layer is arranged on the transparent substrate in an attached mode; the electrode piece is arranged at one end of the transparent substrate, is arranged in the inserting groove in an inserted mode and is electrically connected with the circuit layer, so that the transparent substrate is arranged on the circuit board in an upright mode; the LED chips are arranged on the transparent substrate and are electrically connected with the circuit layer; the conductive contact is arranged on the other side of the circuit board and is electrically connected with the circuit board; the lamp cover is combined with the conductive contact, so that the circuit board and the light source module are arranged between the conductive contact and the lamp cover. According to the LED lamp bulb disclosed by the invention, the transparent substrate is used so as to bear the LED chips, so that the light utilization efficiency of the LED lamp bulb can be improved.
Description
Technical field
The present invention relates to a kind of light emitting diode bulb, espespecially a kind of transparent substrates that uses is with the light emitting diode bulb of carrying light-emitting diode chip for backlight unit.
Background technology
Light emitting diode (light emitting diode, LED) be a kind of semiconductor element, mainly by semiconducting compound, convert electrical energy into luminous energy to reach illumination effect, the advantage such as therefore have that the life-span is long, stability is high and power consumption is little, house, office, outdoor and action illumination have been widely used at present, to replace traditional non-directive property light emitting sources such as fluorescent tube and incandescent lamp bulb.
Cooperation, with reference to figure 1, is the side view of existing light emitting diode bulb.This light emitting diode bulb 20 comprises a pedestal 200, a circuit board 210, a plurality of light emitting diode 226, a lampshade 230 and a conductive contact 240.This circuit board 210 and this conductive contact 240 are arranged at respectively the two opposite sides of this pedestal 200.The rectangular tabular of this circuit board 210, and this circuit board 210 to have larger area one surface smooth in this pedestal 200.This light emitting diode 226 is arranged on this circuit board 210, and another has larger area one surface to be positioned at this circuit board 210; This light emitting diode 226 is electrically connected on this circuit board 210, and this circuit board 210 provides the electric power of lighting this light emitting diode 226, and wherein, when this light emitting diode 226 is lit, the direction in this pedestal 200 towards the opposite emits beam.These lampshade 230 covers are should circuit board 210 and this light emitting diode 226 make this circuit board 210 and this light emitting diode 226 between this pedestal 200 and this lampshade 230.
Because light emitting diode 226 is directive property light source, therefore the light being sent by this light emitting diode 226 can only be towards the place ahead bright dipping (light that this light emitting diode 226 sends can only be towards the opposite in the light-emitting directions of this pedestal 200), the light-emitting zone that makes this light emitting diode bulb 20 is far away from incandescent lamp bulb, also cannot reach the bright dipping demand of the non-directive property light sources such as incandescent lamp bulb, and cause user to reduce the wish of using this light emitting diode bulb 20.
Summary of the invention
The object of the present invention is to provide a kind of light emitting diode bulb with high light utilization ratio.
For reaching above-mentioned purpose, the invention provides a kind of light emitting diode bulb, this light emitting diode bulb comprises a circuit board, at least one light source module, a conductive contact and a lampshade.This circuit board comprises at least one slot.This light source module is positioned at a side of this circuit board, and this light source module comprises a transparent substrates, a circuit layer, an electrode piece and a plurality of light-emitting diode chip for backlight unit.This transparent substrates comprises a first surface and a second surface in contrast to this first surface; This circuit layer is attached at the one at least wherein of this first surface and this second surface; This electrode piece is arranged at an end of this transparent substrates, and this electrode piece is inserted in this slot and is electrically connected on this circuit layer, and this transparent substrates is stood on this circuit board; This light-emitting diode chip for backlight unit is arranged at the one at least wherein of this first surface and this second surface, and forms and be electrically connected with this circuit layer.This conductive contact is positioned at the opposite side of this circuit board, and is electrically connected on this circuit board; This lampshade is combined with this conductive contact, and this circuit board and this light source module are placed between this lampshade and this conductive contact.
According to one embodiment of the invention, wherein this light source module more comprises a fluorescence coating, and this fluorescence coating is coated this light-emitting diode chip for backlight unit.
According to one embodiment of the invention, wherein this transparent substrates is rectangular, and this electrode piece is arranged at a short side direction of this transparent substrates.
According to one embodiment of the invention, this light emitting diode bulb more comprises a driver, is arranged on this circuit board, and forms and be electrically connected with this circuit board.
According to one embodiment of the invention, wherein this light-emitting diode chip for backlight unit is arranged at this first surface and this second surface respectively, and this light-emitting diode chip for backlight unit arrangement mode that is arranged at this second surface is same as this light-emitting diode chip for backlight unit that is arranged at this first surface.
According to one embodiment of the invention, wherein this light-emitting diode chip for backlight unit is arranged at this first surface and this second surface respectively, and this light-emitting diode chip for backlight unit that is arranged at this second surface is dislocation arrangement with this light-emitting diode chip for backlight unit that is arranged at this first surface.
According to one embodiment of the invention, this light emitting diode bulb more comprises a plurality of light source modules, and respectively the electrode piece of this light source module is inserted in a plurality of slots that are formed on this circuit board, and the respectively transparent substrates of this light source module is stood on this circuit board.
According to one embodiment of the invention, wherein this light source module is linear array on this circuit board, and the distance between wantonly two light source modules is certain value.
According to one embodiment of the invention, wherein the light transmittance of this transparent substrates is more than or equal to 50%.
According to one embodiment of the invention, wherein the material of this transparent substrates is selected from the material group that aluminium oxide, gallium nitride, glass, gallium phosphide, carborundum and chemical vapour deposition (CVD) diamond form.
Light emitting diode bulb of the present invention is used transparent substrates with carrying light-emitting diode chip for backlight unit, can improve light emitting diode bulb light utilization ratio.
Below in conjunction with the drawings and specific embodiments, describe the present invention, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the side view of existing light emitting diode bulb.
The stereogram of the light emitting diode bulb of Fig. 2 first embodiment of the invention.
Fig. 3 is the cutaway view of the light emitting diode bulb of first embodiment of the invention.
Fig. 4 is the cutaway view of the light emitting diode bulb of second embodiment of the invention.
Fig. 5 is the cutaway view of the light emitting diode bulb of third embodiment of the invention.
Wherein, Reference numeral:
10,10a, 10b: light emitting diode bulb
110: pedestal
120: circuit board
122: slot
126: plate face
130,130a, 130b: light source module
132,132a: transparent substrates
1320,1320a: first surface
1322,1322a: second surface
134,134a: circuit layer
135: electrode piece
136,136a: light-emitting diode chip for backlight unit
138a: fluorescence coating
140: lampshade
150: conductive contact
170: driver
20: light emitting diode bulb
200: pedestal
210: circuit board
226: light emitting diode
230: lampshade
240: conductive contact
The specific embodiment
Please refer to the diagram of enclosing, above and extra object, feature and advantage of the present invention are by the following illustrative by preferred embodiment of the present invention and non-limitingly describe better and understand in detail.
Cooperation, with reference to figure 2 and Fig. 3, is respectively stereogram and the cutaway view of the light emitting diode bulb of first embodiment of the invention.This light emitting diode bulb 10 is main in order to provide the light intensity distributions producing with incandescent lamp bulb akin light source; This light emitting diode bulb 10 comprises a pedestal 110, a circuit board 120, at least one light source module 130, a lampshade 140 and a conductive contact 150.
This pedestal 110 for example (but not limiting) is to use plastics or ceramic making to form, and in the present embodiment, this pedestal 110 is circular cylinder, during actual enforcement, with this, does not limit.This pedestal 110 is in order to support this circuit board 120 and this light source module 130.
This circuit board 120 is arranged at a side of this pedestal 110.In the present embodiment, this circuit board 120 is for having the FR-4 glass fibre circuit board (FR-4 is a kind of code name of flame resistant material grade) of high mechanical properties, the characteristic such as non-combustible and moistureproof, during actual enforcement, this circuit board 120 can be the printed circuit board (PCB) of metal-based circuit board or other kind according to actual demand; Secondly, this circuit board 120 is roughly rounded, and this circuit board 120 surface area with larger area one plate face is less than the area on the surface that this pedestal 110 contacts with this circuit board 120.On this circuit board 120, have at least one slot 122, this slot 122 is for running through the slotted hole structure of this circuit board 120.On this circuit board 120, be provided with a driver 170 in order to drive this light source module 130 to emit beam, this driver 170 is electrically connected on this circuit board 120.
This light source module 130 comprises a transparent substrates 132, a circuit layer 134, an electrode piece 135 and a plurality of light-emitting diode chip for backlight unit 136.This transparent substrates 132 is glass substrate, and the light transmittance of this transparent substrates 132 (transmittance) is more than or equal to 50%; Wherein, light transmittance refers to by the ratio of the luminous intensity of this transparent substrates 132 and the luminous intensity of this transparent substrates 132 of incident.The material of this transparent substrates 132 can be selected from the material group that aluminium oxide, gallium nitride, glass, gallium phosphide, carborundum and chemical vapour deposition (CVD) diamond form.This transparent substrates 132 has a first surface 1320 and in contrast to the second surface 1322 of this first surface; In the present embodiment, this transparent substrates 132 is rectangle plate body, and this first surface 1320 and this second surface 1322 are respectively this transparent substrates 132 and have larger area surface.During actual enforcement, this transparent substrates 132 can be other geometric figure according to actual demand, as: circle or polygon.
This circuit layer 134 is attached at wherein at least one of this first surface 1320 of this transparent substrates 132 and this second surface 1322, and this circuit layer 134 is used the material (as: copper) with conductive characteristic to be made, in order to the path as electric power transfer.In the present embodiment, this circuit layer 134 is arranged at this first surface 1320 and this second surface 1322 simultaneously, and this circuit layer 134 is strip setting, and the length of this circuit layer 134 is same as the length of this first surface 1320 and this second surface 1322.
This electrode piece 135 is arranged at an end of this transparent substrates 132 and is electrically connected on this circuit layer 134, and in the present embodiment, this electrode piece 135 is arranged at a short side direction of this transparent substrates 132, and forms and be electrically connected with this circuit layer 134.This electrode piece 135 is inserted in this slot 122, make this first surface 1320 of this transparent substrates 132 and this second surface 1322 perpendicular to a plate face 126 of this circuit board 120, this transparent substrates 132 is stood on this circuit board 120, make this circuit board 120 and this light source module 130 form simultaneously and be electrically connected.Secondly, 122 of this electrode piece 135 and this slots can, by scolder (not shown) so that electrode piece 135 is fixed on this circuit board 120, make to improve bond strength and the electric conductivity between this electrode piece 135 and this slot 122.
This light-emitting diode chip for backlight unit 136 is arranged at wherein at least one of this first surface 1320 of this transparent substrates 132 and this second surface 1322 respectively, and form and be electrically connected with this circuit layer 134, this light-emitting diode chip for backlight unit 136 is by this circuit layer 134 and for being connected in series, being connected in parallel or connection in series-parallel connection.In the present embodiment, this light-emitting diode chip for backlight unit 136 is arranged at this first surface 1320 and this second surface 1322 simultaneously, the quantity of light-emitting diode chip for backlight unit 136 of being located at this first surface 1320 and this second surface 1322 is identical, and the setting position correspondence of being located at the light-emitting diode chip for backlight unit 136 of second surface is located at the setting position of the light-emitting diode chip for backlight unit 136 of this first surface 1320, these light-emitting diode chip for backlight unit 136 arrangement modes that meaning is arranged at this second surface 1322 are same as this light-emitting diode chip for backlight unit 136 that is arranged at this first surface 1320.This light-emitting diode chip for backlight unit 136 can, by die bond (die attachment) technology to be fixed on this transparent substrates 132, to form and be electrically connected with this circuit layer 134 afterwards again.This light-emitting diode chip for backlight unit 136 can be for covering the light-emitting diode chip for backlight unit of crystalline substance (flip chip) form, and its electrode directly contacts this circuit layer 134, or, this light-emitting diode chip for backlight unit 136 can be also the light-emitting diode chip for backlight unit of horizontal configuration or rectilinear structure, and by least one metal bonding wire to form and to be electrically connected with this circuit layer 134.Because the light transmittance of this transparent substrates 132 is greater than 50%, thus, the light that can avoid this light-emitting diode chip for backlight unit 136 to send is covered or absorbs by this transparent substrates 132, and then improves the light utilization ratio of this light emitting diode bulb 10.
This conductive contact 150 is arranged at the opposite side of this circuit board 120, and with these lampshade 140 combinations, this circuit board 120 and this light source module 130 are placed in respectively between this conductive contact 150 and this lampshade 140.This lampshade 140 is optionally designed to transparence or translucent, so as to adjusting by the luminous intensity of the light after these lampshade 140 outgoing; Meanwhile, this lampshade 140 also can be in order to adjust the light characteristic that of the light be sent by this light-emitting diode chip for backlight unit 136, as optically focused or astigmatism, makes the more realistic demand of optical characteristics of this light emitting diode bulb 10.This conductive contact 150, for transferring on light fixture, is lighted the electric power of this light emitting diode bulb 10 so as to acquisition.Between this conductive contact 150 and this circuit board 120, cross-over connection has a plurality of wires (not icon), this wire can run through this pedestal 110, this wire in order to power delivery that 150 acquisitions of this conductive contact are arrived to this circuit board 120, and be passed to this light source module 130 by this electrode piece 135, to light this light-emitting diode chip for backlight unit 136.
Cooperation is with reference to figure 4, is the stereogram of the light emitting diode bulb of second embodiment of the invention.The light emitting diode bulb 10 of light emitting diode bulb 10a shown in Fig. 4 and the first embodiment is similar, and identical element marking is with identical symbol.Difference that it should be noted that both is: the light source module 130a shown in Fig. 4.
This light source module 130a comprises a transparent substrates 132a, a circuit layer 134a, a plurality of light-emitting diode chip for backlight unit 136a and a fluorescence coating 138a.This circuit layer 134a is arranged at a first surface 1320a and of this transparent substrates 132a on the second surface 1322a of this first surface 1320a.
This light-emitting diode chip for backlight unit 136a is arranged on this first surface 1320a and this second surface 1322a respectively, and form and be electrically connected with this circuit layer 120, and this light-emitting diode chip for backlight unit 136a that is arranged at this first surface 1320a is dislocation arrangement with this light-emitting diode chip for backlight unit 136a that is arranged at this second surface 1322a.
This fluorescence coating 138a is coated this light-emitting diode chip for backlight unit 136a, in order to the part light generation wavelength conversion of sending with this light-emitting diode chip for backlight unit 136a, and produces a light wavelength conversion line.After the other parts light mixed light that this light wavelength conversion line and this light-emitting diode chip for backlight unit 136a send, can be for the photochromic light of the demand of generation.In the present embodiment, this fluorescence coating 138a is coated a plurality of light-emitting diode chip for backlight unit 136a that are arranged at this first surface 1320a or this second surface 1322a simultaneously, so as to improving the convenience on making.When reality is implemented, this fluorescence coating 138a also can only be coated at least one light-emitting diode chip for backlight unit 136a wherein.The function of each element of light emitting diode bulb 10a and related description, in fact identical with the light emitting diode bulb 10 of the first embodiment, do not repeat them here.Light emitting diode bulb 10a at least can reach the function identical with light emitting diode bulb 10.
Cooperation is with reference to figure 5, is the stereogram of the light emitting diode bulb of third embodiment of the invention.The light emitting diode bulb 10a of light emitting diode bulb 10b shown in Fig. 5 and the second embodiment is similar, and identical element marking is with identical symbol.Difference that it should be noted that both is: the light emitting diode bulb 10b shown in Fig. 5 comprises a plurality of linearly aligned light source module 130b that are.
This light source module 130b is plugged in a plurality of slots 122 that are formed on this circuit board 120 respectively, required light source when providing this light emitting diode bulb 10b to light.Secondly, the distance between wantonly two light source module 130b is certain value, thus, not only can improve the briliancy of this light emitting diode bulb 10b, and the light source of uniform light intensity distributions more can be provided.During actual enforcement, the luminous intensity that the arrangement mode of this light source module 130b can be on demand and be other form, as: irregular.The function of each element of light emitting diode bulb 10b and related description, in fact identical with the light emitting diode bulb 10a of the second embodiment, do not repeat them here.Light emitting diode bulb 10b at least can reach the function identical with light emitting diode bulb 10a.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the claims in the present invention.
Claims (10)
1. a light emitting diode bulb, is characterized in that, comprises:
One circuit board, comprises at least one slot;
At least one light source module, is positioned at a side of this circuit board, and this light source module comprises:
One transparent substrates, comprises a first surface and a second surface in contrast to this first surface;
One circuit layer, is attached at least one in this first surface and this second surface;
One electrode piece, is arranged at an end of this transparent substrates and is electrically connected on this circuit layer, and this electrode piece is inserted in this slot, and this transparent substrates is stood on this circuit board; And
A plurality of light-emitting diode chip for backlight unit, are arranged at least one in this first surface and this second surface, and form and be electrically connected with this circuit layer;
One conductive contact, is positioned at the opposite side of this circuit board, and is electrically connected on this circuit board; And
One lampshade, is combined with this conductive contact, and this circuit board and this light source module are placed between this lampshade and this conductive contact.
2. light emitting diode bulb according to claim 1, is characterized in that, this light source module more comprises a fluorescence coating, and this fluorescence coating is coated this light-emitting diode chip for backlight unit.
3. light emitting diode bulb according to claim 1, is characterized in that, this transparent substrates is rectangular, and this electrode piece is arranged at a short side direction of this transparent substrates.
4. light emitting diode bulb according to claim 1, is characterized in that, more comprises a driver, is arranged on this circuit board, and forms and be electrically connected with this circuit board.
5. light emitting diode bulb according to claim 1, it is characterized in that, this light-emitting diode chip for backlight unit is arranged at this first surface and this second surface respectively, and this light-emitting diode chip for backlight unit arrangement mode that is arranged at this second surface is same as this light-emitting diode chip for backlight unit that is arranged at this first surface.
6. light emitting diode bulb according to claim 1, it is characterized in that, this light-emitting diode chip for backlight unit is arranged at this first surface and this second surface respectively, and this light-emitting diode chip for backlight unit that is arranged at this second surface is dislocation arrangement with this light-emitting diode chip for backlight unit that is arranged at this first surface.
7. light emitting diode bulb according to claim 1, is characterized in that, more comprises a plurality of light source modules, and respectively the electrode piece of this light source module is inserted in a plurality of slots that are formed on this circuit board, and the respectively transparent substrates of this light source module is stood on this circuit board.
8. light emitting diode bulb according to claim 7, is characterized in that, this light source module is linear array on this circuit board, and the distance between wantonly two light source modules is certain value.
9. light emitting diode bulb according to claim 1, is characterized in that, the light transmittance of this transparent substrates is more than or equal to 50%.
10. light emitting diode bulb according to claim 1, is characterized in that, the material of this transparent substrates is selected from the material group that aluminium oxide, gallium nitride, glass, gallium phosphide, carborundum and chemical vapour deposition (CVD) diamond form.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310118212.5A CN104100849A (en) | 2013-04-08 | 2013-04-08 | LED (Light-Emitting Diode) lamp bulb |
| CN201710407362.6A CN107289342A (en) | 2013-04-08 | 2013-04-08 | light emitting diode bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310118212.5A CN104100849A (en) | 2013-04-08 | 2013-04-08 | LED (Light-Emitting Diode) lamp bulb |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710407362.6A Division CN107289342A (en) | 2013-04-08 | 2013-04-08 | light emitting diode bulb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104100849A true CN104100849A (en) | 2014-10-15 |
Family
ID=51669242
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310118212.5A Pending CN104100849A (en) | 2013-04-08 | 2013-04-08 | LED (Light-Emitting Diode) lamp bulb |
| CN201710407362.6A Pending CN107289342A (en) | 2013-04-08 | 2013-04-08 | light emitting diode bulb |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710407362.6A Pending CN107289342A (en) | 2013-04-08 | 2013-04-08 | light emitting diode bulb |
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| Country | Link |
|---|---|
| CN (2) | CN104100849A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105570732A (en) * | 2014-11-07 | 2016-05-11 | 弘元科技有限公司 | Illuminating device |
| CN105737037A (en) * | 2016-05-09 | 2016-07-06 | 深圳爱易瑞科技有限公司 | LED (Light Emitting Diode) radiating street lamp |
| CN105805601A (en) * | 2014-12-30 | 2016-07-27 | 宁波海奈特照明科技有限公司 | Three-dimensional LED filament and 360-degree LED lamp |
| CN105822966A (en) * | 2016-05-09 | 2016-08-03 | 深圳爱易瑞科技有限公司 | Energy-saving LED streetlamp |
| WO2016131398A1 (en) * | 2015-02-16 | 2016-08-25 | 弘元科技有限公司 | Light emitting device |
| CN106287332A (en) * | 2015-06-05 | 2017-01-04 | 弘元科技有限公司 | Light-emitting device |
| CN108302344A (en) * | 2016-09-08 | 2018-07-20 | 展晶科技(深圳)有限公司 | Light emitting diode bulb and car light module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109253406A (en) * | 2018-11-06 | 2019-01-22 | 杭州明煜光电科技有限公司 | The production technology of LED filament, lamps and lanterns and LED filament |
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Effective date of registration: 20170515 Address after: Hsinchu City, Taiwan, China Applicant after: Jingyuan Optoelectronics Co., Ltd. Address before: Taoyuan County, Taiwan, China, Qingnian Road, No. 5, No. 2, 1 floor, 9 floor Applicant before: Intematix Technology Ct Corp. |
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