CN201773859U - PCB positioning device for LED die bonding and wire soldering - Google Patents
PCB positioning device for LED die bonding and wire soldering Download PDFInfo
- Publication number
- CN201773859U CN201773859U CN2010202913736U CN201020291373U CN201773859U CN 201773859 U CN201773859 U CN 201773859U CN 2010202913736 U CN2010202913736 U CN 2010202913736U CN 201020291373 U CN201020291373 U CN 201020291373U CN 201773859 U CN201773859 U CN 201773859U
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- China
- Prior art keywords
- steel mesh
- electromagnet
- pcb
- pcb board
- frame
- Prior art date
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- Expired - Fee Related
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Abstract
The utility model discloses a PCB positioning device for LED die bonding and wire soldering, which is provided with a working tabletop, and is characterized in that a carrier connecting board is disposed on the working tabletop, the bottom of the carrier connecting board is closely connected with the working tabletop via bolts, the upper portion of the carrier connecting board is connected and fastened with an electromagnet frame via bolts, more than one electromagnet is arranged in the electromagnet frame, a steel mesh is pressed on the electromagnet, a component vacancy for producing components is reserved on the steel mesh, the edge of the steel mesh is provided with a steel mesh frame, and the steel mesh is welded with the steel mesh frame integrally. The device has the advantages that the device adopts direct-current electromagnet to generate attraction, realizes fixing and clamping a PCB by tensioning the steel mesh pressed on the PCB, can load and unload the PCB via electric control, improves processing precision, increases working efficiency, and is safe and convenient.
Description
[technical field]
The utility model proposes a kind of pcb board positioner, specifically, relate in a kind of solid crystalline substance, the bonding wire production process, carry out the device of location technology effects such as pcb board is fixed, clamping cooperation for production technologies such as the solid crystalline substance that carries out the LED wafer on the pcb board, bonding wires on workbench at LED.
[background technology]
In the solid crystalline substance of present LED, bonding wire production process, need be for carrying out solid crystalline substance, the bonding wire of LED wafer on the pcb board, so at first need on workbench, carry out fixing accurately and effectively, clamping at pcb board, the general structures such as mechanical pressure type positioner, shell fragment (spring) formula positioner and pneumatic type positioner that adopt in the prior art, carry out location, fixing at pcb board, but the defective of prior art is structure and complicated operating process and machining accuracy is wayward, production efficiency is not high, and described defective value must improve.
[utility model content]
For solving the shortcoming and defect of prior art, the utility model provides solid crystalline substance of a kind of LED and bonding wire pcb board positioner, the utility model can adopt DC electromagnet to produce suction, by straining the steel mesh that pcb board press-fits above, realize the fixing and clamping of pcb board, the loading by automatically controlled realization pcb board, remove stage makeup and costume, easy to operate, promote machining accuracy, increase work efficiency.
The technical scheme that the utility model technical solution adopts is, solid crystalline substance of a kind of LED and bonding wire pcb board positioner, be arranged at a work top, it is characterized in that: a microscope carrier gusset piece is set on the described work top, described microscope carrier gusset piece underrun bolt closely is connected with work top, described microscope carrier gusset piece top is fastened with an electromagnetism brandreth by the bolt connection, be provided with more than one electromagnet in the described electromagnetism brandreth, be pressed with steel mesh on the described electromagnet, be reserved with the components and parts room that components and parts are produced on the described steel mesh, the edge part of described steel mesh is provided with the steel mesh frame, and described steel mesh and steel mesh frame are by being welded together.
The utility model according to said structure, between electromagnetism brandreth and steel mesh, can place pcb board, electromagnet produces electromagnetic attraction after energising, carry out clamping location, flatten so steel mesh will be positioned over the pcb board on steel mesh and electromagnetism brandreth surface, for production processes such as the LED on pcb board surface mounts, bonding wire create conditions; After the outage, take off steel mesh, pcb board can be taken off then.
The utility model according to said structure, its beneficial effect is, the utility model adopts DC electromagnet to produce suction, by straining the steel mesh that pcb board press-fits above, realize the fixing and clamping of pcb board, the loading by automatically controlled realization pcb board, remove stage makeup and costume, promoted machining accuracy, improved operating efficiency, safe ready.
[description of drawings]
Below in conjunction with drawings and the embodiments the utility model is explained detailedly.
Accompanying drawing 1 is a vertical section of the present utility model schematic diagram.
Accompanying drawing 2 is a steel mesh floor map of the present utility model.
Pcb board in the drawings, 1; 2, steel mesh; 3, steel mesh frame; 4, electromagnetism brandreth; 5, microscope carrier gusset piece; 6, bolt; 7, electromagnet; 8, bolt; 9, components and parts room.
[embodiment]
As Fig. 1, shown in 2, solid crystalline substance of a kind of LED of the present utility model and bonding wire pcb board positioner, be arranged at a work top, it is characterized in that: a microscope carrier gusset piece 5 is set on the described work top, described microscope carrier gusset piece 5 underrun bolts 8 closely are connected with work top, described microscope carrier gusset piece 5 tops are fastened with an electromagnetism brandreth 4 by bolt 6 connections, be provided with more than one electromagnet 7 in the described electromagnetism brandreth 4, be pressed with steel mesh 2 on the described electromagnet 7, be reserved with the components and parts room 9 that components and parts are produced on the described steel mesh 2, the edge part of described steel mesh 2 is provided with steel mesh frame 3, and described steel mesh 2 and steel mesh frame 3 are by being welded together.
Between electromagnetism brandreth 4 and steel mesh 2, can place pcb board 1, electromagnet 7 produces electromagnetic attraction after energising, carry out clamping location, flatten so steel mesh 2 will be positioned over the pcb board 1 on steel mesh 2 and electromagnetism brandreth 4 surfaces, for production processes such as the LED on pcb board 1 surface mounts, bonding wire create conditions; After the outage, take off steel mesh 2, pcb board 1 can be taken off then.
Claims (1)
1. a LED consolidates crystalline substance and bonding wire pcb board positioner, be arranged at a work top, it is characterized in that: a microscope carrier gusset piece (5) is set on the described work top, described microscope carrier gusset piece (5) underrun bolt (8) closely is connected with work top, described microscope carrier gusset piece (5) top is fastened with an electromagnetism brandreth (4) by bolt (6) connection, be provided with more than one electromagnet (7) in the described electromagnetism brandreth (4), be pressed with steel mesh (2) on the described electromagnet (7), be reserved with the components and parts room (9) that components and parts are produced on the described steel mesh (2), the edge part of described steel mesh (2) is provided with steel mesh frame (3), and described steel mesh (2) and steel mesh frame (3) are by being welded together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202913736U CN201773859U (en) | 2010-08-03 | 2010-08-03 | PCB positioning device for LED die bonding and wire soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202913736U CN201773859U (en) | 2010-08-03 | 2010-08-03 | PCB positioning device for LED die bonding and wire soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201773859U true CN201773859U (en) | 2011-03-23 |
Family
ID=43753702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202913736U Expired - Fee Related CN201773859U (en) | 2010-08-03 | 2010-08-03 | PCB positioning device for LED die bonding and wire soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201773859U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103712181A (en) * | 2013-12-24 | 2014-04-09 | 北京京东方光电科技有限公司 | LED lamp installation device and method and display device formed by LED lamp installation device |
| CN107591470A (en) * | 2017-08-16 | 2018-01-16 | 佛山市顺德区蚬华多媒体制品有限公司 | A kind of method for being used for precisely fixed LED chip |
-
2010
- 2010-08-03 CN CN2010202913736U patent/CN201773859U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103712181A (en) * | 2013-12-24 | 2014-04-09 | 北京京东方光电科技有限公司 | LED lamp installation device and method and display device formed by LED lamp installation device |
| CN107591470A (en) * | 2017-08-16 | 2018-01-16 | 佛山市顺德区蚬华多媒体制品有限公司 | A kind of method for being used for precisely fixed LED chip |
| CN107591470B (en) * | 2017-08-16 | 2019-06-21 | 佛山市顺德区蚬华多媒体制品有限公司 | A method of for precisely fixing LED chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110323 Termination date: 20130803 |