CN201733554U

CN201733554U - Improved structure of heat-dissipation shell of electronic utensil

Info

Publication number: CN201733554U
Application number: CN2010202274658U
Authority: CN
Inventors: 吴哲元
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-06-17
Filing date: 2010-06-17
Publication date: 2011-02-02
Anticipated expiration: 2020-06-17

Abstract

The utility model discloses an improved structure of a heat-dissipation shell of an electronic utensil. The improved structure comprises an enclosure and a heat conduction layer, wherein the enclosure has the magnetoconductivity and is completely coated at the surface side of the electronic utensil; and the heat conduction layer is formed at the inner surface side of the enclosure at least. The heat-dissipation shell can improve the heat dissipation efficiency and the effect of electromagnetic interference protection of the enclosure and can lower the overall production cost of an electronic product. When the electronic product works, the heat conduction layer of the shell can transmit the heat generated by an electronic component inside the electronic product onto the overall surface of the enclosure, so as to increase the heat dissipation area and improve the heat dissipation efficiency; meanwhile, due to the magnetoconductivity of the enclosure and the complete coating structure of the enclosure to the electronic product, the improved structure ensures that the electronic product can not be interfered by electromagnetic wave.

Description

The structure-improved of electronics implements radiating shell

Technical field

The utility model relates to a kind of structure-improved of electronics implements radiating shell.

Background technology

Consideration based on product lightweight and material cost, it all is as the casing main material with similar materials such as plastics that many electronic products are arranged at present, but because plastic material itself can't heat conduction, and do not have permeance, therefore, for heat radiation and the more harsh circuit of Electromagnetic Interference requirement of shelter, if use plastic material as case material, the then heat radiation of its inner interlock circuit and structure and the requirement of electromagnetic wave proof, can make become in the global design more numerous and diverse (for example: increase assemblies such as fin and antimagnetic cage), cause the increase of production cost simultaneously, so, at the part electronic product, the necessity that still has it to use with the metal chassis of effects such as heat conduction and magnetic screen.

Yet, though having certain electromagnetic wave, the common metal casing structure isolates and radiating effect, but in the practical application, because tradition is as the metal material of casing, as iron and steel, aluminium or almag, all has fixing conductive coefficient, and its heat conduction efficiency still is difficult to be entirely satisfactory, therefore be difficult for the heat in the airtight casing is externally dispersed, generally speaking, still need cooperate other heat abstractor to assist its heat radiation mostly, for example: utilize fan that heat is derived, thus, ventilation orifice must be set on casing, and then the whole Electromagnetic Interference protection effect of influence, and do not see in its global design that having simplification part, its production cost also not to see effectively reduces.

The utility model content

The technical problems to be solved in the utility model provides a kind of structure-improved of electronics implements radiating shell, and it can promote the radiating efficiency and the Electromagnetic Interference protection effect of casing, and can reduce the production cost of electronic product integral body.

For solving the problems of the technologies described above, the structure-improved of electronics implements radiating shell of the present utility model comprises:

One casing has magnetic conductivity, and complete packet overlays on electronics implements table side;

One can promote the heat-conducting layer of heat conduction efficiency, is formed on the interior at least table side of casing.

Preferable, this heat-conducting layer is formed on the inside and outside two table sides of casing.

This heat-conducting layer can be the heat radiation coating of a conduction, takes shape in casing table side with wherein any processing modes such as spraying, printing, sputter, plating or evaporations.

The structure-improved of electronics implements radiating shell of the present utility model, by heat-conducting layer is set, the heat conduction that the electronic product internal electrical components is produced also diffuses to the casing integral surface, while is by the permeance of case material, and casing forms the structural design of complete coating to electronic product, makes casing have suitable electromagnetic wave proof and preferable heat transfer efficiency concurrently, simultaneously, the design of electronic product integral body is simplified, thereby reduced whole production cost.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is described in further detail:

Fig. 1 is a structure decomposition map of the present utility model;

Fig. 2 is a case component profile of the present utility model;

Fig. 3 is a partly amplification profile of case component of the present utility model.

Description of reference numerals is as follows among the figure:

1: casing

11: cap

12: shell block

2: heat-conducting layer

Embodiment

Understand for technology contents of the present utility model, characteristics and effect being had more specifically, existing in conjunction with illustrated execution mode, details are as follows:

See also shown in each figure, the utility model comprises that mainly one is applied to the casing 1 and a heat-conducting layer 2 of the metal material of various electronics implements, this casing 1 is the casing 1 of a mobile computer in the drawings, formed by a cap 11 and a shell block 12, heat-conducting layer 2 is the heat radiation coating of a conduction, this heat-conducting layer 2 can via mode machine-shapings such as spraying, printing, sputter, plating or evaporation in casing 1 at least in the table side (also can inside and outside two the table sides) on, use making casing 1 have preferable heat conduction efficiency.

Said structure is when practical application, casing 1 by this metal material itself has the characteristic of magnetic conductivity and complete coating, can form with the earth terminal of electronics implements internal circuit according to need simultaneously and be electrically connected, make the electronic circuit of this electronics implements inside have suitable Magnetic Shielding Effectiveness, to reduce electromagnetic interference, heat-conducting layer 2 then can effectively promote the radiating efficiency of casing 1, the heat that electronic building brick produced that makes this electronics implements inside is able to penetrate or contact via the width of cloth and conducts to casing 1, and diffuse to casing 1 integral surface rapidly, thus, can effectively increase whole area of dissipation and efficient, and then the design of simplification dependency structure, for example omit the external ventilation unit in casing 1 inside, thereby can reduce production costs.

In sum, the structure-improved of electronics implements radiating shell of the present utility model can promote radiating efficiency, reduces Electromagnetic Interference (EMI).

The content of above-mentioned explanation only is preferred embodiment explanation of the present utility model, and variation, modification, change or the equivalent replacement that is extended according to the utility model technological means and category also all should fall in the patent claim of the present utility model such as.

Claims

1. the structure-improved of an electronics implements radiating shell is characterized in that, comprising:

One can promote the heat-conducting layer of heat conduction efficiency, is formed on the local at least interior table side of casing.

2. the structure-improved of electronics implements radiating shell as claimed in claim 1 is characterized in that: described heat-conducting layer is formed on the inside and outside two table sides of casing.

3. as the structure-improved of claim 1 or 2 described electronics implements radiating shells, it is characterized in that: described heat-conducting layer is the heat radiation coating of a conduction.

4. the structure-improved of electronics implements radiating shell as claimed in claim 3 is characterized in that: described heat-conducting layer takes shape in casing table side with the processing mode of spraying, printing, sputter, plating or evaporation.