CN201724986U - Device for batch test of resistance value for anti-electromagnetic interference layer of flexible circuit board - Google Patents
Device for batch test of resistance value for anti-electromagnetic interference layer of flexible circuit board Download PDFInfo
- Publication number
- CN201724986U CN201724986U CN2010201961874U CN201020196187U CN201724986U CN 201724986 U CN201724986 U CN 201724986U CN 2010201961874 U CN2010201961874 U CN 2010201961874U CN 201020196187 U CN201020196187 U CN 201020196187U CN 201724986 U CN201724986 U CN 201724986U
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- Prior art keywords
- flexible pcb
- resistance value
- electromagnetic interference
- emi
- layer
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Abstract
The utility model relates to the field of electronic aided testing equipment, in particular to of batch test of the resistance value for the anti-electromagnetic interference layer of a flexible circuit board, which is characterized in that a testing support consists of an insulation plane and supporting legs, wherein the position of the insulation plane, which corresponds to the position of the position hole of the flexible circuit board, is provided with a position pin, the position of the insulation plane, which corresponds to the position of a resistance testing point, is provided with a probe, the insulation plane is provided with a gold-plated copper foil testing piece, the testing piece is in a linear shape connected by multi sections communicated into a whole body with all corresponding resistance testing points, and the position hole of the flexible circuit board is sheathed on the position pin and is placed on the testing piece. The batch test of the resistance value for the anti-electromagnetic interference layer of the flexible circuit board not only overcomes the problem that the flexible circuit board is not easy to directly use the probe to carry out point test due to the very thin thickness and soft material, and can realize the batch testing of multi testing points.
Description
Technical field
The utility model relates to electronics subtest utensil field, relates in particular to the proving installation that is used to measure the anti-electromagnetic interference (EMI) layer of flexible PCB resistance value.
Background technology
Flexible PCB is a kind ofly to have a height reliability with what polyimide or mylar were that base material is made, and excellent flexible printed circuit is called for short soft board or FPC, has the characteristics of distribution density height, in light weight, thin thickness.It mainly uses a lot of product scopes at mobile phone, notebook computer, PDA, digital camera, LCM etc.When flexible PCB is used for high frequency field or communication field,, just need carry out anti-electromagnetic interference (EMI) and handle for eliminating and reduce the interference of external electromagnetic environment.At present, we play shielding action at coating on both sides one deck electrically conductive ink of flexible PCB.For preventing that electro-magnetic screen layer from influencing the internal wiring resistance value, be necessary to control the resistance value of electro-magnetic screen layer, for this reason, the electro-magnetic screen layer of each sheet flexible printed circuit is all needed to do resistance measurement.Yet existing resistance measuring instrument only has two probes, and because flexible PCB material very softness and very thin thickness, and it is extremely slow therefore manually directly to carry out measuring speed, inefficiency.
The utility model content
At the problems referred to above, the utility model proposes a kind of device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value, the soft difficult problem of directly utilizing probe to carry out a test of very thin thickness material not only overcome flexible PCB owing to can also realize many test points batch testing.
Therefore, the utility model adopts following technical scheme:
The device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value of the present utility model is: constitute a testing jig by insulating panel and leg, described insulating panel is provided with tommy corresponding to the position of the pilot hole of flexible PCB, position corresponding to resistance test point is provided with probe, described insulcrete panel is provided with the test pieces of a gold-plated Copper Foil, described test pieces is the linear shape that the multistage that is communicated as one corresponding to all resistance test points is connected, the pilot hole of flexible PCB is enclosed within on the tommy, and is positioned over described test pieces top.
Further, also be provided with a gravity pressing plate above the described flexible PCB.
Further, described gravity pressing plate is the structure that is superposeed and be bonded to one by the long strip type insulcrete that the polylith size increases progressively.The width of described gravity pressing plate is 3cm～4cm.
Further, described insulating panel is a fiberglass panel.
Further, the diameter of described probe is 1.0mm.
Further, the diameter of described tommy is 2.5mm.
Further, the width of described test pieces is 10mm.
The utility model adopts as above technical scheme, has realized measuring the function of the anti-electromagnetic interference (EMI) layer of flexible PCB resistance value by a kind of test accessory simple in structure.The utility model has not only overcome flexible PCB because the soft difficult problem of directly utilizing probe to carry out a test of very thin thickness material can also realize many test points batch testing, can improve testing efficiency greatly.
Description of drawings
Fig. 1 is the vertical view of the utility model when not carrying out test mode;
Fig. 2 is the vertical view of gravity pressing plate 3 of the present utility model;
Fig. 3 is the cut-open view when carrying out test mode of the present utility model.
Embodiment
Now with embodiment the utility model is further specified in conjunction with the accompanying drawings.
Consult shown in Figure 3, the device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value of the present utility model is: constitute a testing jig by insulating panel 1 and leg 14, described insulating panel 1 is provided with tommy 13 corresponding to the position of the pilot hole 21 of flexible PCB 2, is provided with probe 12 corresponding to the position of resistance test point.Preferably, described insulating panel 1 is a fiberglass panel, can adopt the FR-4 fiberglass substrate.The diameter of described probe 12 is 1.0mm.The diameter of described tommy 13 is 2.5mm.
Consult Fig. 1 and shown in Figure 3, described insulcrete panel 1 is provided with the test pieces 11 of a gold-plated Copper Foil, and described test pieces 11 is linear shape that the multistage that is communicated as one corresponding to all resistance test points is connected.Corresponding probe 12 forms a projection 112 in meeting below the test pieces 11 of described gold-plated Copper Foil on test pieces 11, and the test pieces 11 of described gold-plated Copper Foil prolongs one section 111 at test fixture of the present utility model edge.Preferably, the width of described test pieces 11 is 10mm, and copper thickness is 1～2 μ m, and nickel is thick to be 3～5 μ m, and gold is thick to be 0.05～0.1 μ m.
Consult shown in Figure 2ly,, the projection of several test points of flexible PCB 2 and the test pieces 11 of gold-plated Copper Foil is better contacted, certain gravity downforce need be provided in order better to test.Above described flexible PCB 2, also be provided with a gravity pressing plate 3.Described gravity pressing plate 3 is the structures that superposeed and be bonded to one by the long strip type insulcrete that the polylith size increases progressively.The width of described gravity pressing plate 3 is 3cm～4cm.
Consult shown in Figure 3, when the utility model is tested, the pilot hole 21 of flexible PCB 2 is enclosed within on the tommy 13, and be positioned over test pieces 11 tops of gold-plated Copper Foil, with a probe clip of resistance measuring instrument on one section 111 position of prolongation of the test pieces 11 of gold-plated Copper Foil, press described gravity pressing plate 3 at flexible PCB to be measured 2 then, the measuring amount point of flexible PCB to be measured 2 is closely linked to each other with the test pieces 11 corresponding test points of the gold-plated Copper Foil of the utility model, electrically conduct, so just can measure the resistance value of each piece board flexible circuit plate 2 anti-electromagnetic interference (EMI) layer fast by another probe of resistance measuring instrument.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but the those skilled in the art should be understood that; in the spirit and scope of the present utility model that do not break away from appended claims and limited; can make various variations to the utility model in the form and details, be protection domain of the present utility model.
Claims (8)
1. device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value, it is characterized in that: constitute a testing jig by insulating panel (1) and leg (14), described insulating panel (1) is provided with tommy (13) corresponding to the position of the pilot hole (21) of flexible PCB (2), position corresponding to resistance test point is provided with probe (12), described insulcrete panel (1) is provided with the test pieces (11) of a gold-plated Copper Foil, described test pieces (11) is the linear shape that the multistage that is communicated as one corresponding to all resistance test points is connected, the pilot hole (21) of flexible PCB (2) is enclosed within on the tommy (13), and is positioned over described test pieces (11) top.
2. the device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value according to claim 1 is characterized in that: described flexible PCB (2) top also is provided with a gravity pressing plate (3).
3. the device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value according to claim 2 is characterized in that: described gravity pressing plate (3) is the structure that is superposeed and be bonded to one by the long strip type insulcrete that the polylith size increases progressively.
4. the device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value according to claim 2 is characterized in that: the width of described gravity pressing plate (3) is 3cm～4cm.
5. the device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value according to claim 1 is characterized in that: described insulating panel (1) is a fiberglass panel.
6. the device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value according to claim 1 is characterized in that: the diameter of described probe (12) is 1.0mm.
7. the device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value according to claim 1 is characterized in that: the diameter of described tommy (13) is 2.5mm.
8. the device that is used for the anti-electromagnetic interference (EMI) layer of measure batch flexible PCB resistance value according to claim 1 is characterized in that: the width of described test pieces (11) is 10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201961874U CN201724986U (en) | 2010-05-14 | 2010-05-14 | Device for batch test of resistance value for anti-electromagnetic interference layer of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201961874U CN201724986U (en) | 2010-05-14 | 2010-05-14 | Device for batch test of resistance value for anti-electromagnetic interference layer of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201724986U true CN201724986U (en) | 2011-01-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201961874U Expired - Fee Related CN201724986U (en) | 2010-05-14 | 2010-05-14 | Device for batch test of resistance value for anti-electromagnetic interference layer of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201724986U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103529300A (en) * | 2013-10-23 | 2014-01-22 | 上海工程技术大学 | Device for measuring surface resistance of flexible sheet material |
| CN107513493A (en) * | 2016-06-16 | 2017-12-26 | 孙百莉 | A kind of system for microorganism testing and preparation method thereof |
-
2010
- 2010-05-14 CN CN2010201961874U patent/CN201724986U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103529300A (en) * | 2013-10-23 | 2014-01-22 | 上海工程技术大学 | Device for measuring surface resistance of flexible sheet material |
| CN103529300B (en) * | 2013-10-23 | 2016-03-02 | 上海工程技术大学 | A kind of device for measuring surface resistance of flexible sheet material |
| CN107513493A (en) * | 2016-06-16 | 2017-12-26 | 孙百莉 | A kind of system for microorganism testing and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: XIAMEN BOLIAN CIRCUIT CO., LTD. Free format text: FORMER NAME: XIAMEN NEW FLEX ELECTRONICS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 361022 No. 198, Xiang Xiang Road, Haicang District, Fujian, Xiamen Patentee after: Xiamen Bolion Circuit Co., Ltd. Address before: 361022 No. 198, Xiang Xiang Road, Haicang District, Fujian, Xiamen Patentee before: Xiamen New Flex Electronics Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110126 Termination date: 20130514 |